Product Overview
These Multi-Layer Ceramic Capacitors (MLCCs) are designed for high-voltage applications, serving critical roles in coupling, wave filtering, and resonance within switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight units, and energy-saving lamps. They offer reliable performance across a range of operating conditions and are available in various sizes and dielectric characteristics.
Product Attributes
- Terminal Composition: Au/Ag-Ni-Sn (from the inside out)
- Certifications: RoHS compliant, REACH compliant
Technical Specifications
| Item | Description | Specification/Requirement | Testing Method | ||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|
| Application Field | |||||||||||
| Coupling, wave filtering, resonant in high voltage circuits | Switch power supplier, AC-DC power charger, DC-DC power charger, networking/Communication interface, LCD backlight unit power supplier, amperite of energy saving lamps, etc. (Medium and High voltage MLCC) | ||||||||||
| Testing Conditions | |||||||||||
| Normal Condition | Temperature | 15~35 | |||||||||
| Humidity | 45~75%RH | ||||||||||
| Atmosphere | 86~106kPa | ||||||||||
| Relative Condition | Temperature | 252 | |||||||||
| Humidity | 60~70%RH | ||||||||||
| Atmosphere | 86~106kPa | ||||||||||
| Part Number Description Example: 1812 X7R 684 M 251 N T | |||||||||||
| Item | Description | Example Codes | |||||||||
| 1. Dimension Code | Various sizes available (e.g., 0201, 0402, 0603, 0805, 1206, 1210, 1808, 1812, 1825, 2211, 2225) with corresponding inch and mm dimensions. | 0201, 0402, 0603, 0805, 1206, 1210, 1808, 1812, 1825, 2211, 2225 | |||||||||
| 2. Temperature Characteristic | Dielectric types | C0G (030 PPM/), X7R (15%), X5R (15%) | |||||||||
| 3. Nominal Electrostatic Capacity | Capacity value in pF | 8R08.0, 10010, 101100 | |||||||||
| 4. Tolerance of Electrostatic Capacity | Capacity tolerance | B:0.1pF, C:0.25pF, D:0.5pF, F:1%, G: 2%, J:5%, K:10%, M:20%, Z:+80%/-20% | |||||||||
| 5. Rated Voltage (DC) | DC voltage rating | 250 25V, 251 250V, 252 2500V | |||||||||
| 6. Terminal Composition | Plating material | Au/Ag-Ni-Sn | |||||||||
| 7. Packing | Packaging type | T Tape/Reel, P Bag packing (PE) | |||||||||
| Construction and Dimension | |||||||||||
| Construction | Item | Description | |||||||||
| 1. Ceramic dielectric | |||||||||||
| 2. Inner electrode | |||||||||||
| 3. Outer electrode | |||||||||||
| 4. Nickle layer | |||||||||||
| 5. Tin layer | |||||||||||
| Dimension (mm) | Part number | L | W | T | WB | ||||||
| British system | Metric system | ||||||||||
| 0201 | 0603 | 0.600.10 | 0.300.05 | 0.300.05 | 0.100.05 | ||||||
| 0402 | 1005 | 1.000.15 | 0.500.15 | 0.500.10 | 0.200.10 | ||||||
| 0603 | 1608 | 1.600.20 | 0.800.15 | 0.800.15 | 0.300.10 | ||||||
| 0805 | 2012 | 2.000.20 | 1.250.20 | 0.800.20 | 0.500.20 | ||||||
| 1206 | 3216 | 3.200.30 | 1.600.30 | 1.000.20 | 0.600.30 | ||||||
| 1210 | 3225 | 3.200.30 | 2.500.30 | 2.70 | 0.800.30 | ||||||
| 1808 | 4520 | 4.500.40 | 2.000.20 | 2.70 | 0.800.30 | ||||||
| 1812 | 4532 | 4.500.40 | 3.200.30 | 3.50 | 0.800.30 | ||||||
| 1825 | 4563 | 4.500.40 | 6.300.50 | 3.50 | 0.800.30 | ||||||
| 2220 | 5750 | 5.700.50 | 5.000.50 | 3.50 | 1.000.40 | ||||||
| 2225 | 5763 | 5.700.50 | 6.300.50 | 6.20 | 1.000.40 | ||||||
| Specification and Testing Method | |||||||||||
| No | Item | Specification/Requirement | Testing method | ||||||||
| 1 | Temperature | -55~+125 | |||||||||
| 2 | Visual/ Dimension | 1. No Damage 2. Dimension meet Spec | Naked eye (Visual inspection), Digital calliper | ||||||||
| 3 | Static capacity | Meet standard specification and tolerance | 1. NPO characteristic: Capacity Frequency Voltage 1000pF 1MHz10% 1.00.2Vrms; 1000 pF 1KHz10% X7R/X7T/X7P characteristic: Capacity Frequency Voltage 10uF 1KHz10% 1.00.2Vrms; 10uF 120Hz24 0.50.1Vrms | ||||||||
| 4 | Dissipation factor (DF) | NPO Characteristic: DF0.56, Cr5 pF; DF1.5[(150/Cr)+7]10-4 (5pFCr50pF); DF0.15%, (50pFCr). Cr1000pF, Testing frequency 110%MHz, Testing voltage 1V0.2rms. Cr1000pF, Testing frequency 110%KHz, Testing voltage 1V0.2rms. X7R/X7T/X7P characteristic: see Note 1 | |||||||||
| 5 | IR Insulation Resistance | NPO Characteristic: IR50000M,C10nF; IR*Cr500S,C10nF. Testing condition: Rated voltage Time:605s Humidity:75% Temperature:255 Current :50mA. X7R/X7T/X7P Characteristic: IR10000M,C25nF; IR*Cr100S,C25nF | |||||||||
| 6 | Hi-pot (DC) | No dielectric breakdown or damage. Ur=100V,...............2.5 x rated voltage; Ur=200V/250V,.... 2.0 x rated voltage; Ur=450/500/630V,1.5 x rated voltage; 1KVUr2KV,.......1.2 x rated voltage; 2KVUr,...............1.1 x rated voltage. Voltage Raising time:110S, Voltage maintaining time2S | |||||||||
| 7 | Solderability | soldering area90% | Visual-No damage. Pre-heating temperature 80-120, time 10-30s, lead free solder, flux. Soldering temperature 2455. Solder time 20.5s. | ||||||||
| 8 | Resistance to the heat of soldering | Visual-No damage, soldering area90% | Pre-heating temperature 100-200, time 102 s, soldering temperature :2655, Soldering time:51s. Cleaning with solvent. Room temperature, time :242 hours. | ||||||||
| Electrostatic capacity change rate | NPO Characteristic: C/C0.5% or 0.5pF larger reading. X7R :C/C15%. X7T -33% C/C22%. X7PC/C10% | ||||||||||
| DF | Refer to NO#4 | ||||||||||
| IR | Refer to NO#5 | ||||||||||
| 9 | Flexural strength | No damage | Base boardAl2O3 /PCB. PCB dimension Thickness: 1.6mm Length: 100mm Width: 40mm. Flexural depth: 1mm. Bend speed: 0.5mm/sec. Unit: mm. Test it under the flexural status. Electro static capacity change rate C/C10%. Flexural deepth 452. | ||||||||
| 10 | Terminal bonding strength | No visual damage | Applied Force: 5N. Duration: 101S. | ||||||||
| 11 | Thermal shock | NPO Characteristic; C/C2.5% or 0.25pF (larger reading). X7R/X7P- characteristic: C/C0.5%. X7T characteristic C/C10% | Pre-condition(X7R h characteristic):Upper limit temperature 1hour, place 241 hours, start to testing. Run 5 cycles Thermal shock. Test it after place 242 hours normal temp & humidity. | ||||||||
| 12 | Temperature moisture exposure | Visual: No visual damage. Electrostatic capacitance change rate: NPO characteristic: C/C2% or 1pF (larger reading). X7R/X7T/X7P characteristic: C/C10%. DF 2 times initial standard. IR: NPO characteristic: IR2500M or IR*Cr25S (Lower reading). X7R/X7T/X7P: IR1000M or IR*Cr25S (Lower reading). | Temperature 402. Humidity 90~95%RH. Time 500+24 hours. Test it after place 242 hours normal temp & humidity. | ||||||||
| 13 | High temperature exposure | Visual: No visual damage. Electrostatic capacitance change rate: NPO : C/C2% or 1pF (larger reading). X7R/X7T/X7P: C/C20%. DF 2 X initial standard. IR: NPO : IR4000M or IR*Cr40S (Lower reading). X7R/X7T/X7P : IR2000M or IR*Cr50S (Lower reading). | Temperature 1253. Time 100048 hours. Voltage 100VV250V 2x Rated voltage; 250VV1KV 1.5x rated voltage; 1KVV 1.2x rated voltage. Charging and discharging current 50mA Max. Test it after place 48 hours under normal pressure & temperature. | ||||||||
| 14 | PCB flexural strength | No crack and other defect. IR | Soldering the MLCC on the PCB (Photo1), Then pressing direction base on the photo 2. SIZE A B C. 0805(2012) 1.2 4 1.65. 1206(3216) 2.2 5 2. 1210(3225) 2.2 5 2.9. 1812(4532) 3.5 7 3.7. 2220(5750) 4.5 8 5.6. | ||||||||
| Embossed Plastic Taping | |||||||||||
| Code | Tape size (mm) | A | B | C | D | E | F | G | H | J | T |
| 0805 | 1.55 0.20 | 2.35 0.20 | 8.00 0.20 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.10 | 1.50 -0/+0.10 | 1.50 Max | |
| 1206 | 1.95 0.20 | 3.60 0.20 | 8.00 0.20 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.1 | 1.50 -0/+0.10 | 1.85 Max | |
| 1210 | 2.70 0.10 | 3.42 0.10 | 8.00 0.10 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.05 | 4.00 0.10 | 1.55 -0/+0.10 | 3.2 Max | |
| 1808 | 2.20 0.10 | 4.95 0.10 | 12.00 0.10 | 5.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.05 | 4.00 0.10 | 1.50 -0/+0.10 | 3.0 Max | |
| 1812 | 3.66 0.10 | 4.95 0.10 | 12.00 0.10 | 5.50 0.05 | 1.75 0.10 | 8.00 0.10 | 2.00 0.05 | 4.00 0.10 | 1.55 -0/+0.10 | 4.0 Max | |
| Paper Tape Reel Packing | |||||||||||
| Code | Paper size (mm) | W1 | L1 | D | C | B | P1 | P2 | P0 | d | t |
| 1005 | 0.24 0.02 | 0.45 0.02 | 8.00 0.10 | 3.50 0.05 | 1.75 0.10 | 2.00 0.05 | 2.00 0.05 | 4.00 0.10 | 1.50 -0/+0.10 | 0.30 Below | |
| 0201 | 0.37 0.10 | 0.67 0.10 | 8.00 0.10 | 3.50 0.05 | 1.75 0.10 | 2.00 0.05 | 2.00 0.05 | 4.00 0.10 | 1.50 -0/+0.10 | 0.80 Below | |
| 0402 | 0.65 0.10 | 1.15 0.10 | 8.00 0.10 | 3.50 0.05 | 1.75 0.10 | 2.00 0.05 | 2.00 0.05 | 4.00 0.10 | 1.50 -0/+0.10 | 0.80 Below | |
| Code | Paper size (mm) | A | B | C | D | E | F | G | H | J | T |
| 0603 | 1.10 0.10 | 1.90 0.10 | 8.00 0.10 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.10 | 1.50 -0/+0.10 | 1.10 Max | |
| 0805 | 1.45 0.15 | 2.30 0.15 | 8.0 0.15 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.10 | 1.50 -0/+0.10 | 1.10 Max | |
| 1206 | 1.80 0.20 | 3.40 0.20 | 8.00 0.20 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.10 | 1.50 -0/+0.10 | 1.10 Max | |
| Reel Dimensions (unit: mm) | |||||||||||
| Unit | A | B | C | D | E | F | G | ||||
| 7REEL | 1782.0 | 3.0 | 130.5 | 210.5 | 21 or Bigger | 1010.5 | 12max | ||||
| 13REEL | 3302.0 | 3.0 | 130.5 | 210.5 | 21 or Bigger | 1010.5 | 12max | ||||
| Taping specification | |||||||||||
| (a) Paper Taping Reel type | Top tape peeling strength | 0.1N < peeling strength < 0.7N. No paper dirty remains on the scotch when peeling, and sticks to top and bottom tape. | |||||||||
| Packing Quantity | |||||||||||
| Dimension | Paper T/R (Pcs) | Plastic T/R (Pcs) | |||||||||
| 0603 | 4000 | ||||||||||
| 0805 | 4000 | 3000 (T1.35mm) | |||||||||
| 1206 | 3000 (T1.35mm) 2000 (T1.60mm) | ||||||||||
| 1210 | 3000 (T1.60mm) 2000 | ||||||||||
| 1808 | 1000 (T1.85mm) | ||||||||||
| 1812 | 1000 (T1.85mm) 800 | ||||||||||
| 1812 | 500 | ||||||||||
| Precautions For Use | |||||||||||
| 1 | Soldering Profile | To avoid the crack problem by sudden temperature change, follow the temperature profile in the adjacent graph (refer to the graph in the enclosure page). | |||||||||
| 2 | Manual Soldering | Manual soldering can pose a great risk of creating thermal cracks in capacitors. The hot soldering iron tip comes into direct contact with the end terminations, and operators careless may cause the tip of the soldering iron to come into direct contact with the ceramic body of the capacitor. Therefore the soldering iron must be handled carefully, and pay much attention to the selection of the soldering iron tip and temperature contact of the tip. | |||||||||
| 3 | Optimum Solder Amount for Reflow Soldering | ||||||||||
| 4 | Recommended Soldering amounts | ||||||||||
| Recommended Soldering Method | |||||||||||
| Size | Temperature Characteristics | Capacitance | Soldering Method | ||||||||
| 1005 | NPO | / | R | ||||||||
| X7R/X5R/X7S/X6S | / | R | |||||||||
| 0201 | NPO | / | R | ||||||||
| X7R/X5R/X7S/X6S | / | R | |||||||||
| Y5V | / | R | |||||||||
| 0402 | NPO | / | R | ||||||||
| X7R/X5R/X7S/X6S | / | R | |||||||||
| Y5V | / | R | |||||||||
| 0603 | NPO | / | R/W | ||||||||
| X7R/X5R/X7S/X6S | C1uf | R | |||||||||
| C1uf | R/W | ||||||||||
| Y5V | C1uf | R | |||||||||
| C1uf | R/W | ||||||||||
| 0805 | NPO | / | R/W | ||||||||
| X7R/X5R/X7S/X6S | C4.7uf | R | |||||||||
| C4.7uf | R/W | ||||||||||
| Y5V | C1uf | R | |||||||||
| C1uf | R/W | ||||||||||
| 1206 | NPO | / | R/W | ||||||||
| X7R/X5R/X7S/X6S | C10uf | R | |||||||||
| C10uf | R/W | ||||||||||
| Y5V | C10uf | R | |||||||||
| C10uf | R/W | ||||||||||
| 1210 | NPO | / | R | ||||||||
| X7R/X5R/X7S/X6S | / | R | |||||||||
| Y5V | / | R | |||||||||
| Soldering methodRReflow Soldering WWave Soldering | |||||||||||
| The temperature profile for soldering | |||||||||||
| While in preheating, please keep the temperature difference between soldering temperature and surface temperature of chips as: T150. | |||||||||||
2509251626_AIDE-CAPACITOR-0805C0G471J500NT_C48579578.pdf
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