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Specifications
Voltage Rating:
200V
Capacitance:
100pF
Temperature Coefficient:
X7R
Tolerance:
±10%
Mfr. Part #:
0805X7R101K201NT
Model Number:
0805X7R101K201NT
Package:
0805
Key Attributes
Product Description
Product Overview
These Multi-Layer Ceramic Capacitors (MLCCs) are designed for high-voltage applications, including coupling, wave filtering, and resonant functions in switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight units, and energy-saving lamps. They are suitable for medium and high voltage MLCC requirements.
Product Attributes
- Terminal Composition: Au/Ag-Ni-Sn (from the inside out)
- Certifications: RoHS compliant, REACH compliant
Technical Specifications
| Item | Description/Specification | Details | |||
|---|---|---|---|---|---|
| Application Field | High voltage circuits | ||||
| Function | Coupling, wave filtering, resonant | ||||
| Typical Applications | Switch power supplier, AC-DC power charger, DC-DC power charger, networking/Communication interface, LCD backlight unit power supplier, amperite of energy saving lamps | ||||
| Testing Conditions | Normal: Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa | ||||
| Relative: Temperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa | |||||
| Part Number Description | Item 1: Dimension Code | 0201 (0.02*0.01 inch / 0.50*0.25 mm) to 2225 (0.22*0.25 inch / 5.70*6.30 mm) | |||
| Item 2: Temperature Characteristic | C0G (030 PPM/), X7R (15%), X5R (15%) | ||||
| Item 3: Nominal Electrostatic Capacity | e.g., 8R0=8.0pF, 100=10pF, 101=100pF | ||||
| Item 4: Tolerance of Electrostatic Capacity | B:0.1pF, C:0.25pF, D:0.5pF, F:1%, G: 2%, J:5%, K:10%, M:20%, Z:+80%/-20% | ||||
| Item 5: Rated Voltage (DC) | e.g., 250=25V, 251=250V, 252=2500V | ||||
| Item 6: Terminal Composition | Au/Ag-Ni-Sn | ||||
| Item 7: Packing | T (Tape/Reel), P (Bag packing) | ||||
| Construction | 1. Ceramic dielectric | ||||
| 2. Inner electrode | |||||
| 3. Outer electrode | |||||
| 4. Nickle layer | |||||
| 5. Tin layer | |||||
| Dimensions (mm) | Part Number | L | W | T | WB |
| 0201 (0603) | 0.600.10 | 0.300.05 | 0.300.05 | 0.100.05 | |
| 0402 (1005) | 1.000.15 | 0.500.15 | 0.500.10 | 0.200.10 | |
| 0603 (1608) | 1.600.20 | 0.800.15 | 0.800.15 | 0.300.10 | |
| 0805 (2012) | 2.000.20 | 1.250.20 | 0.800.20 | 0.500.20 | |
| 1206 (3216) | 3.200.30 | 1.600.30 | 1.000.20 | 0.600.30 | |
| 1210 (3225) | 3.200.30 | 2.500.30 | 2.70 | 0.800.30 | |
| 1808 (4520) | 4.500.40 | 2.000.20 | 2.70 | 0.800.30 | |
| 1812 (4532) | 4.500.40 | 3.200.30 | 3.50 | 0.800.30 | |
| 1825 (4563) | 4.500.40 | 6.300.50 | 3.50 | 0.800.30 | |
| 2220 (5750) | 5.700.50 | 5.000.50 | 3.50 | 1.000.40 | |
| 2225 (5763) | 5.700.50 | 6.300.50 | 6.20 | 1.000.40 | |
| Specification & Testing Method | Temperature Range | -55~+125 | |||
| Visual/Dimension | No Damage, Dimension meet Spec | ||||
| Static Capacity | NPO: 1000pF @ 1MHz10%, 1.00.2Vrms; >1000pF @ 1KHz10%, 1.00.2Vrms | X7R/X7T/X7P: 10uF @ 1KHz10%, 1.00.2Vrms; >10uF @ 120Hz24, 0.50.1Vrms | |||
| Dissipation Factor (DF) | NPO: DF0.56 (Cr5pF), DF1.5[(150/Cr)+7]10-4 (5pFCr50pF), DF0.15% (50pFCr). Frequency 110%MHz, Voltage 1V0.2rms (Cr1000pF); Frequency 110%KHz, Voltage 1V0.2rms (Cr1000pF). | X7R/X7T/X7P: Cr10uF, 1KHz10%, 1V0.1rms; Cr10uF, 12024Hz, 0.5V0.1rms. See Note 1 for exceptions. | |||
| IR Insulation Resistance | NPO: IR50000M (C10nF), IR*Cr500S (C>10nF). Test @ Rated voltage, 605s, 75% Humidity, 255, 50mA. | X7R/X7T/X7P: IR10000M (C25nF), IR*Cr100S (C>25nF). | |||
| Hi-pot (DC) | No dielectric breakdown or damage. Test voltage varies based on rated voltage (Ur): 2.5xUr (Ur100V), 2.0xUr (200V/250V), 1.5xUr (450/500/630V), 1.2xUr (1KVUr2KV), 1.1xUr (Ur>2KV). Voltage raising time: 110S, maintaining time: 2S. | ||||
| Solderability | Soldering area 90%. Visual-No damage. Pre-heating: 80-120 (10-30s). Solder temp: 2455. Solder time: 20.5s. | ||||
| Resistance to Heat of Soldering | Visual-No damage, soldering area 90%. Pre-heating: 100-200 (102s). Solder temp: 2655. Solder time: 51s. Cleaning with solvent. Room temp, 242 hours. | ||||
| Electrostatic Capacity Change Rate | NPO: |C/C| 0.5% or 0.5pF. X7R: |C/C| 15%. X7T: -33% C/C22%. X7P: |C/C| 10%. | Refer to NO#4 for DF, NO#5 for IR. | |||
| Flexural Strength | No damage. Base board: Al2O3 /PCB. PCB dimension: Thickness: 1.6mm, Length: 100mm, Width: 40mm. Flexural depth: 1mm. Bend speed: 0.5mm/sec. Capacitance change rate: |C/C| 10%. | ||||
| Terminal Bonding Strength | No visual damage. Applied Force: 5N. Duration: 101S. | ||||
| Thermal Shock | NPO: |C/C| 2.5% or 0.25pF. X7R/X7P: |C/C| 0.5%. X7T: |C/C| 10%. Pre-condition (X7R): Upper limit temp 1hr, 241 hrs. 5 cycles. Test after 242 hrs. | ||||
| Temperature Moisture Exposure | Visual: No damage. Test after 242 hrs. Temp: 402, Humidity: 90~95%RH, Time: 50024 hours. Capacity change rate: NPO: |C/C| 2% or 1pF. X7R/X7T/X7P: |C/C| 10%. DF 2x initial standard. IR: NPO: IR2500M or IR*Cr25S. X7R/X7T/X7P: IR1000M or IR*Cr25S. | ||||
| High Temperature Exposure | Visual: No damage. Test after 48 hrs. Temp: 1253, Time: 100048 hours. Voltage: 100VV250V (2x Rated voltage), 250VV1KV (1.5x rated voltage), 1KVV (1.2x rated voltage). Capacity change rate: NPO: |C/C| 2% or 1pF. X7R/X7T/X7P: |C/C| 20%. DF 2x initial standard. IR: NPO: IR4000M or IR*Cr40S. X7R/X7T/X7P: IR2000M or IR*Cr50S. | ||||
| PCB Flexural Strength | No crack and other defect. IR measurement after soldering. Sizes and dimensions (A, B, C) provided for 0805 to 2220. | ||||
| Embossed Plastic Taping | Details for 0805 to 1812 types including tape size (A-J) and dimensions. | ||||
| Paper Tape Reel Packing | Details for 1005, 0201, 0402 types (W1, L1, D, C, B, P1, P2, P0, d, t) and 0603, 0805, 1206 types (A-J, T). | ||||
| Reel Dimensions | 7' REEL (1782.0), 13' REEL (3302.0) with various dimensions (A-G). | ||||
| Taping Specification | Top tape peeling strength: 0.1N < peeling strength < 0.7N. | ||||
| Packing Quantity | Varies by size and taping type (Paper T/R, Plastic T/R). E.g., 0603 Paper T/R: 4000 pcs, 0805 Plastic T/R: 3000 pcs. | ||||
| Soldering Method | Recommended methods (R-Reflow, W-Wave) based on size, temperature characteristics, rated voltage, and capacitance. | ||||
2509251626_AIDE-CAPACITOR-0805X7R101K201NT_C48579587.pdf
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