Product Overview
This product is a Multi-layer Ceramic Capacitor (MLCC) designed for high-voltage applications. It is suitable for coupling, wave filtering, and resonant functions in various high-voltage circuits. Key applications include switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamps. These MLCCs are designed for medium and high voltage requirements.
Product Attributes
- Material: Ceramic dielectric, Inner electrode, Outer electrode, Nickel layer, Tin layer
- Certifications: RoHS compliant, REACH compliant
Technical Specifications
| Item | Description | Specification |
|---|---|---|
| Application Field | Coupling, wave filtering, resonant in high voltage circuits | |
| Switch power supplier, AC-DC power charger, DC-DC power charger, networking/Communication interface, LCD backlight unit power supplier, amperite of energy saving lamps, etc. (Medium and High voltage MLCC) | ||
| Testing Conditions | Normal Condition | Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa |
| Relative Condition | Temperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa | |
| Initial Capacitance Testing | Pre-heating 150 for 1 hour, then place 48 hours under normal pressure & temperature. | |
| Part Number Description | 1. Dimension Code | 0201, 0402, 0603, 0805, 1206, 1210, 1808, 1812, 1825, 2211, 2225 |
| 2. Temperature Characteristic | C0G (030 PPM/), X7R (15%), X5R (15%) | |
| 3. Nominal Electrostatic Capacity | 8R08.0, 10010, 101100 (pF) | |
| 4. Tolerance of Electrostatic Capacity | B:0.1pF, C:0.25pF, D:0.5pF, F:1%, G: 2%, J:5%, K:10%, M:20%, Z:+80%/-20% | |
| 5. Rated Voltage (DC) | 25025, 251250, 2522500 (V) | |
| 6. Terminal Composition | Au/Ag-Ni-Sn (From the inside out) | |
| 7. Packing | T Tape/Reel, P Bag packing (PE) | |
| Construction and Dimension | Construction | 1 Ceramic dielectric, 2 Inner electrode, 3 Outer electrode, 4 Nickel layer, 5 Tin layer |
| Dimension (mm) - British System | Part Number: 0201, 0402, 0603, 0805, 1206, 1210, 1808, 1812, 1825, 2220, 2225 | |
| Dimension (mm) - Metric System | Part Number: 0603, 1005, 1608, 2012, 3216, 3225, 4520, 4532, 4563, 5750, 5763 | |
| Dimensions (L x W x T) | See detailed table in source document for each size (e.g., 0201: 0.600.10 x 0.300.05 x 0.300.05 mm) | |
| WB (Width of Braid) | See detailed table in source document for each size (e.g., 0201: 0.100.05 mm) | |
| Temperature Characteristic | -55~+125 | |
| Visual/Dimension | No Damage, Dimension meet Spec | |
| Static Capacity | Meets standard specification and tolerance (NPO, X7R/X7T/X7P characteristics) | |
| Dissipation Factor (DF) | NPO Characteristic: DF0.56 (Cr5pF), DF1.5[(150/Cr)+7]10-4 (5pFCr50pF), DF0.15% (50pFCr). X7R/X7T/X7P characteristic: See Note 1. | |
| IR Insulation Resistance | NPO Characteristic: IR50000M (C10nF), IR*Cr500S (C>10nF). X7R/X7T/X7P Characteristic: IR10000M (C25nF), IR*Cr100S (C>25nF). | |
| Hi-pot (DC) | No dielectric breakdown or damage. Test voltage varies with rated voltage (e.g., 2.5 x rated voltage for Ur=100V). | |
| Solderability | Soldering area 90%. Pre-heating 80-120 (10-30s), Soldering 2455 (20.5s). | |
| Resistance to the heat of soldering | No damage, soldering area 90%. Pre-heating 100-200 (102s), Soldering 2655 (51s). | |
| Electrostatic Capacity Change Rate | NPO: 0.5% or 0.5pF. X7R: 15%. X7T: -33% to 22%. X7P: 10%. | |
| Flexural Strength | No damage. Electrostatic capacity change rate 10%. | |
| Terminal Bonding Strength | No visual damage. Applied Force: 5N (101S). | |
| Thermal Shock | Capacity change rate: NPO 2.5% or 0.25pF, X7R/X7P 0.5%, X7T 10%. | |
| Temperature Moisture Exposure | Capacity change rate: NPO 2% or 1pF, X7R/X7T/X7P 10%. DF 2 times initial standard. IR: NPO 2500M or IR*Cr25S, X7R/X7T/X7P 1000M or IR*Cr25S. | |
| High Temperature Exposure | Capacity change rate: NPO 2% or 1pF, X7R/X7T/X7P 20%. DF 2 X initial standard. IR: NPO 4000M or IR*Cr40S, X7R/X7T/X7P 2000M or IR*Cr50S. | |
| PCB Flexural Strength | No crack and other defect. IR measurement after soldering. | |
| Embossed Plastic Taping | Reel Packing for 0805(2012)~1812(4532) type | Dimensions: See detailed table in source document (e.g., 0805: Tape size 1.550.20 mm) |
| Reel Dimensions | 7REEL: 1782.0 mm, 13REEL: 3302.0 mm | |
| Top Tape Peeling Strength | 0.1N < peeling strength < 0.7N | |
| Paper Tape Reel Packing | For 1005, 0201, 0402 types | Dimensions: See detailed table in source document (e.g., 1005: Paper size 0.240.02 mm) |
| For 0603, 0805, 1206 types | Dimensions: See detailed table in source document (e.g., 0603: Paper size 1.100.10 mm) | |
| Leader/End Part Structure | See detailed specification in source document. | |
| Packing Quantity | See detailed table in source document for Paper T/R and Plastic T/R quantities per size. | |
| Recommended Soldering Method | RReflow Soldering, WWave Soldering. Specific recommendations based on size, characteristics, and capacitance. | |
| Soldering Temperature Profile | Preheating temperature difference T 150. | |
2509251626_AIDE-CAPACITOR-0805X7R102K102NT_C48579590.pdf
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