Product Overview
This product is a Multi-layer Ceramic Capacitor (MLCC) designed for high-voltage applications. It is utilized for coupling, wave filtering, and resonance in various high-voltage circuits, including switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamps. These MLCCs are suitable for medium and high voltage applications.
Product Attributes
- Terminal Composition: Au/Ag-Ni-Sn (from the inside out)
- RoHS/REACH Compliance: Meets RoHS and REACH standards.
Technical Specifications
| Item | Description | Specification/Requirement | Testing Method |
|---|---|---|---|
| 1. Temperature | Operating Temperature | -55~+125 | - |
| Thermal Shock Pre-condition (X7R h characteristic) | Upper limit temperature 1hour, place 241 hours, start testing. Run 5 cycles Thermal shock. Test it after place 242 hours normal temp & humidity. | - | |
| 2. Visual/ Dimension | Damage Check | No Damage | Naked eye (Visual inspection) |
| Dimension Check | Dimension meet Spec | Digital calliper | |
| 3. Static Capacity | NPO characteristic | Capacity: 1000pF, Frequency: 1MHz10%, Voltage: 1.00.2Vrms Capacity: 1000 pF, Frequency: 1KHz10%, Voltage: 1.00.2Vrms | - |
| X7R/X7T/X7P characteristic | Capacity: 10uF, Frequency: 1KHz10%, Voltage: 1.00.2Vrms Capacity: 10uF, Frequency: 120Hz24, Voltage: 0.50.1Vrms | - | |
| Initial Capacitance Testing (for items 3, 11, 12, 13) | Pre-heating 150 for 1 hour, then place 48 hours under normal pressure & temperature. | - | |
| 4. Dissipation Factor (DF) | NPO Characteristic | DF0.56, Cr5 pF DF1.5[(150/Cr)+7]10-4 (5pFCr50pF) DF0.15%, (50pFCr) Cr1000pF, Testing frequency 110%MHz, Testing voltage 1V0.2rms Cr1000pF, Testing frequency 110%KHz, Testing voltage 1V0.2rms. | - |
| X7R/X7T/X7P characteristic | Cr10uF, Test frequency 110%KHz, Voltage 1V0.1rms. Cr10uF, Frequency 12024Hz, Voltage 0.5V0.1rms. | See Note 1 | |
| 5. IR Insulation Resistance | NPO Characteristic | IR50000M, C10nF IR*Cr500S, C10nF | Testing condition: Rated voltage, Time: 605s, Humidity: 75%, Temperature: 255, Current: 50mA |
| X7R/X7T/X7P Characteristic | IR10000M, C25nF IR*Cr100S, C25nF | Testing condition: Rated voltage, Time: 605s, Humidity: 75%, Temperature: 255, Current: 50mA | |
| 6. Hi-pot (DC) | No dielectric breakdown or damage | Ur=100V, 2.5 x rated voltage Ur=200V/250V, 2.0 x rated voltage Ur=450/500/630V, 1.5 x rated voltage 1KVUr2KV, 1.2 x rated voltage 2KVUr, 1.1 x rated voltage Voltage Raising time: 110S, Voltage maintaining time: 2S | - |
| 7. Solderability | Soldering area90% | Pre-heating temperature 80-120, time 10-30s, lead free solder, flux Soldering temperature 2455 Solder time 20.5s | Visual-No damage |
| 8. Resistance to the heat of soldering | No visual damage, soldering area90% | Pre-heating temperature 100-200, time 102 s, soldering temperature: 2655, Soldering time: 51s. Cleaning with solvent. Room temperature, time: 242 hours. | Visual |
| 9. Electrostatic capacity change rate | NPO Characteristic | C/C0.5% or 0.5pF (larger reading) | - |
| X7R | C/C15% | - | |
| X7T | -33% C/C22% | - | |
| X7P | C/C10% | - | |
| 10. Terminal bonding strength | No visual damage | Applied Force: 5N Duration: 101S | - |
| 11. Thermal shock | NPO Characteristic | C/C2.5% or 0.25pF (larger reading) | - |
| X7R/X7P- characteristic | C/C0.5% | - | |
| X7T characteristic | C/C10% | - | |
| 12. Temperature moisture exposure | Visual | No visual damage | Temperature 402, Humidity 90~95%RH, time 50024 hours. Test it after place 242 hours normal temp & humidity. |
| Electrostatic capacitance change rate | NPO characteristic: C/C2% or 1pF (larger reading) X7R/X7T/X7P characteristic: C/C10% | - | |
| IR | NPO characteristic: IR2500M or IR*Cr25S (Lower reading) X7R/X7T/X7P: IR1000M or IR*Cr25S (Lower reading) | - | |
| 13. High temperature exposure | Visual | No visual damage | Charging and discharging current 50mA Max. Test it after place 48 hours under normal pressure & temperature. Temperature 1253, Time 100048 hours. Voltage: 100VV250V (2x Rated voltage), 250VV1KV (1.5x rated voltage), 1KVV (1.2x rated voltage) |
| Electrostatic capacitance change rate | NPO: C/C2% or 1pF (larger reading) X7R/X7T/X7P: C/C20% | - | |
| IR | NPO: IR4000M or IR*Cr40S (Lower reading) X7R/X7T/X7P: IR2000M or IR*Cr50S (Lower reading) | - | |
| 14. PCB flexural strength | No crack and other defect | IR | Soldering the MLCC on the PCB, Then pressing direction base on the photo. |
Packing Information
Embossed Plastic Taping
| Code | Tape size A (mm) | Tape size B (mm) | Reel Diameter (mm) | Pocket Depth C (mm) | Pocket Pitch D (mm) | Tape Width E (mm) | Carrier Tape Width F (mm) | Cover Tape Width G (mm) | Leader Length (mm) | Trailer Length (mm) |
|---|---|---|---|---|---|---|---|---|---|---|
| 0805 | 1.55 0.20 | 2.35 0.20 | 8.00 0.20 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.10 | 1.50 -0/+0.10 | 1.50 Max |
| 1206 | 1.95 0.20 | 3.60 0.20 | 8.00 0.20 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.1 | 1.50 -0/+0.10 | 1.85 Max |
| 1210 | 2.70 0.10 | 3.42 0.10 | 8.00 0.10 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.05 | 4.00 0.10 | 1.55 -0/+0.10 | 3.2 Max |
| 1808 | 2.20 0.10 | 4.95 0.10 | 12.00 0.10 | 5.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.05 | 4.00 0.10 | 1.50 -0/+0.10 | 3.0 Max |
| 1812 | 3.66 0.10 | 4.95 0.10 | 12.00 0.10 | 5.50 0.05 | 1.75 0.10 | 8.00 0.10 | 2.00 0.05 | 4.00 0.10 | 1.55 -0/+0.10 | 4.0 Max |
Paper Tape Reel Packing
| Code | Paper size W1 (mm) | Paper size L1 (mm) | Reel Diameter (mm) | Pocket Depth C (mm) | Pocket Pitch D (mm) | Tape Width E (mm) | Carrier Tape Width F (mm) | Cover Tape Width G (mm) | Leader Length (mm) | Trailer Length (mm) |
|---|---|---|---|---|---|---|---|---|---|---|
| 1005 | 0.240.02 | 0.450.02 | 8.000.10 | 3.500.05 | 1.750.10 | 2.000.05 | 2.000.05 | 4.000.10 | 1.50 -0/+0.10 | 0.30 Below |
| 0201 | 0.370.10 | 0.670.10 | 8.000.10 | 3.500.05 | 1.750.10 | 2.000.05 | 2.000.05 | 4.000.10 | 1.50 -0/+0.10 | 0.80 Below |
| 0402 | 0.650.10 | 1.150.10 | 8.000.10 | 3.500.05 | 1.750.10 | 2.000.05 | 2.000.05 | 4.000.10 | 1.50 -0/+0.10 | 0.80 Below |
| Code | Paper size A (mm) | Paper size B (mm) | Reel Diameter (mm) | Pocket Depth C (mm) | Pocket Pitch D (mm) | Tape Width E (mm) | Carrier Tape Width F (mm) | Cover Tape Width G (mm) | Leader Length (mm) | Trailer Length (mm) |
|---|---|---|---|---|---|---|---|---|---|---|
| 0603 | 1.10 0.10 | 1.90 0.10 | 8.00 0.10 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.10 | 1.50 -0/+0.10 | 1.10 Max |
| 0805 | 1.45 0.15 | 2.30 0.15 | 8.0 0.15 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.10 | 1.50 -0/+0.10 | 1.10 Max |
| 1206 | 1.80 0.20 | 3.40 0.20 | 8.00 0.20 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.10 | 1.50 -0/+0.10 | 1.10 Max |
Reel Dimensions
| Reel Type | Diameter (mm) | Hub Diameter (mm) | Flange Diameter (mm) | Flange Width (mm) | Core Diameter (mm) | Max. Tape Width (mm) | |
|---|---|---|---|---|---|---|---|
| 7REEL | 1782.0 | 3.0 | 130.5 | 210.5 | 21 or Bigger | 1010.5 | 12max |
| 13REEL | 3302.0 | 3.0 | 130.5 | 210.5 | 21 or Bigger | 1010.5 | 12max |
Taping Specification
- Top tape peeling strength: 0.1N < peeling strength < 0.7N. No paper dirty remains on the scotch when peeling, and sticks to top and bottom tape.
Packing Quantity
| Dimension | Paper T/R (Pcs) | Plastic T/R (Pcs) |
|---|---|---|
| 0603 | 4000 | - |
| 0805 | 4000 | 3000 (T1.35mm) |
| 1206 | - | 3000 (T>1.35mm) |
| 1210 | - | 2000 (T1.60mm) |
| 1808 | - | 3000 (T>1.60mm) |
| 1812 | - | 2000 |
| 1812 | - | 1000 (T1.85mm) |
| - | 1000 (T>1.85mm) | |
| - | 800 | |
| - | 500 |
Precautions For Use
Multi-layer Ceramic Capacitors (MLCC) may fail in a short circuit or open circuit mode when subjected to severe conditions of electrical environment and/or mechanical stress beyond the specified rating and specified conditions. This may result in burn out, flaming or glowing in the worst case. Following precautions for safety and Application Notes shall be taken in your major consideration. If you have a question about the precautions for handling, please contact our engineering section or factory.
- Soldering Profile: To avoid crack problems due to sudden temperature change, follow the temperature profile in the adjacent graph.
- Manual Soldering: Manual soldering poses a risk of creating thermal cracks in capacitors. Ensure careful handling of the soldering iron, paying attention to tip selection and temperature contact.
- Optimum Solder Amount for Reflow Soldering
- Recommended Soldering amounts
Recommended Soldering Method
| Size | Temperature Characteristics | Rated Voltage | Capacitance | Soldering Method |
|---|---|---|---|---|
| 1005 | NPO | / | / | R |
| X7R/X5R/X7S/X6S | / | / | R | |
| 0201 | NPO | / | / | R |
| X7R/X5R/X7S/X6S | / | / | R | |
| Y5V | / | / | R | |
| 0402 | NPO | / | / | R |
| X7R/X5R/X7S/X6S | / | / | R | |
| Y5V | / | / | R | |
| 0603 | NPO | / | / | R/W |
| X7R/X5R/X7S/X6S | / | C1uf | R | |
| C1uf | R/W | |||
| Y5V | / | C1uf | R | |
| C1uf | R/W | |||
| 0805 | NPO | / | / | R/W |
| X7R/X5R/X7S/X6S | / | C4.7uf | R | |
| C4.7uf | R/W | |||
| Y5V | / | C1uf | R | |
| C1uf | R/W | |||
| 1206 | NPO | / | / | R/W |
| X7R/X5R/X7S/X6S | / | C10uf | R | |
| C10uf | R/W | |||
| Y5V | / | C10uf | R | |
| C10uf | R/W | |||
| 1210 | NPO | / | / | R |
| X7R/X5R/X7S/X6S | / | / | R | |
| Y5V | / | / | R |
Soldering method: RReflow Soldering, WWave Soldering
Soldering Temperature Profile
While in preheating, please keep the temperature difference between soldering temperature and surface temperature of chips as: T150.
2509251626_AIDE-CAPACITOR-0805X7R102K251NT_C48579592.pdf
Please Use Our Online Inquiry Contact Form Below If You Have Any Questions, Our Team Will Get Back To You As Soon As Possible