<
>
Specifications
Voltage Rating:
50V
Capacitance:
1nF
Temperature Coefficient:
X7R
Tolerance:
±10%
Mfr. Part #:
0805X7R102K500NT
Model Number:
0805X7R102K500NT
Package:
0805
Key Attributes
Product Description
Product Overview
These Multi-Layer Ceramic Capacitors (MLCCs) are designed for high-voltage applications, serving critical roles in coupling, wave filtering, and resonance within power supplies and communication interfaces. They are suitable for demanding environments found in switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamps. Available in various sizes and temperature characteristics, these MLCCs offer reliable performance under specified conditions.
Product Attributes
- Material: Ceramic dielectric, Inner electrode, Outer electrode (Au/Ag-Ni-Sn)
- Certifications: RoHS compliant, REACH compliant
- Packing Options: Tape/Reel (T), Bag packing (P)
Technical Specifications
| Item | Description | Specification |
|---|---|---|
| Application Field | Coupling, wave filtering, resonant in high voltage circuits | |
| Switch power supplier | ||
| AC-DC power charger | ||
| DC-DC power charger | ||
| Networking/Communication interface, LCD backlight unit power supplier, amperite of energy saving lamps | ||
| Testing Conditions | Normal Condition | Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa |
| Relative Condition | Temperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa | |
| Initial Capacitance Testing | Pre-heating 150 for 1 hour, then placed 48 hours under normal pressure & temperature. | |
| Part Number Description | Dimension Code | 0201, 0402, 0603, 0805, 1206, 1210, 1808, 1812, 1825, 2211, 2225 |
| Temperature Characteristic | C0G (030 PPM/), X7R (15%), X5R (15%) | |
| Nominal Electrostatic Capacity | 8R08.0, 10010, 101100 (pF) | |
| Tolerance of Electrostatic Capacity | B:0.1pF, C:0.25pF, D:0.5pF, F:1%, G: 2%, J:5%, K:10%, M:20%, Z:+80%/-20% | |
| Rated Voltage (DC) | 250 (25V), 251 (250V), 252 (2500V) | |
| Terminal Composition | Au/Ag-Ni-Sn (From the inside out) | |
| Construction and Dimension | Construction Items | 1. Ceramic dielectric, 2. Inner electrode, 3. Outer electrode, 4. Nickle layer, 5. Tin layer |
| Dimension (mm) - British System | 0201 (0603), 0402 (1005), 0603 (1608), 0805 (2012), 1206 (3216), 1210 (3225), 1808 (4520), 1812 (4532), 1825 (4563), 2220 (5750), 2225 (5763) | |
| Dimension (mm) - Metric System | L*W (mm): 0.50*0.25 (0201), 1.00*0.50 (0402), 1.60*0.80 (0603), 2.00*1.25 (0805), 3.20*1.60 (1206), 3.20*2.50 (1210), 4.50*2.00 (1808), 4.50*3.20 (1812), 4.50*6.30 (1825), 5.70*5.00 (2220), 5.70*6.30 (2225) | |
| Dimension (mm) - L | 0.600.10 (0201), 1.000.15 (0402), 1.600.20 (0603), 2.000.20 (0805), 3.200.30 (1206), 3.200.30 (1210), 4.500.40 (1808), 4.500.40 (1812), 4.500.40 (1825), 5.700.50 (2220), 5.700.50 (2225) | |
| Dimension (mm) - W | 0.300.05 (0201), 0.500.15 (0402), 0.800.15 (0603), 1.250.20 (0805), 1.600.30 (1206), 2.500.30 (1210), 2.000.20 (1808), 3.200.30 (1812), 6.300.50 (1825), 5.000.50 (2220), 6.300.50 (2225) | |
| Dimension (mm) - T | 0.300.05 (0201), 0.500.10 (0402), 0.800.15 (0603), 0.800.20 (0805), 1.000.20 (1206), 0.800.30 (1210), 0.800.30 (1808), 0.800.30 (1812), 0.800.30 (1825), 1.000.40 (2220), 1.000.40 (2225) | |
| Dimension (mm) - WB | 0.100.05 (0201), 0.200.10 (0402), 0.300.10 (0603), 0.500.20 (0805), 0.600.30 (1206), 0.800.30 (1210), 0.800.30 (1808), 0.800.30 (1812), 0.800.30 (1825), 1.000.40 (2220), 1.000.40 (2225) | |
| Dimension (mm) - T (Max for 1210, 1808, 1812, 1825) | 2.70 (1210, 1808), 3.50 (1812, 1825) | |
| Dimension (mm) - T (Max for 2220, 2225) | 3.50 (2220), 6.20 (2225) | |
| Temperature | -55~+125 | |
| Static Capacity | NPO: 1MHz10%, 1.00.2Vrms (1000pF); 1KHz10%, 1.00.2Vrms (>1000pF) X7R/X7T/X7P: 1KHz10%, 1.00.2Vrms (10uF); 120Hz24, 0.50.1Vrms (>10uF) | |
| Dissipation Factor (DF) | NPO: DF0.56, Cr5 pF; DF1.5[(150/Cr)+7]10-4 (5pFCr50pF); DF0.15%, (50pFCr) X7R/X7T/X7P: Cr10uF, 1KHz10%, 1V0.1rms; Cr10uF, 120Hz24, 0.5V0.1rms | |
| Insulation Resistance (IR) | NPO: IR50000M, C10nF; IR*Cr500S, C10nF (Rated voltage, 605s, Humidity:75%, Temp:255) X7R/X7T/X7P: IR10000M, C25nF; IR*Cr100S, C25nF | |
| Hi-pot (DC) | Ur=100V: 2.5 x rated voltage; Ur=200V/250V: 2.0 x rated voltage; Ur=450/500/630V: 1.5 x rated voltage; 1KVUr2KV: 1.2 x rated voltage; 2KVUr: 1.1 x rated voltage (Voltage Raising time: 110S, Voltage maintaining time2S) | |
| Solderability | Soldering area90%, No Damage (Pre-heating 80-120, 10-30s; Solder temp 2455, Solder time 20.5s) | |
| Resistance to the heat of soldering | No damage, soldering area90% (Pre-heating 100-200, 102s; Solder temp 2655, Solder time 51s) | |
| Electrostatic Capacity Change Rate | NPO: C/C0.5% or 0.5pF; X7R: C/C15%; X7T: -33% C/C22%; X7P: C/C10% | |
| Flexural Strength | No damage (Base board: Al2O3 /PCB, Thickness: 1.6mm, Length: 100mm, Width: 40mm, Flexural depth: 1mm, Bend speed: 0.5mm/sec) | |
| Electrostatic Capacity Change Rate (Flexural) | C/C10% | |
| Terminal Bonding Strength | No visual damage (Applied Force: 5N, Duration: 101S) | |
| Thermal Shock | NPO: C/C2.5% or 0.25pF; X7R/X7P: C/C0.5%; X7T: C/C10% (5 cycles) | |
| Temperature Moisture Exposure | NPO: C/C2% or 1pF; X7R/X7T/X7P: C/C10%; DF 2 times initial standard; IR: NPO: IR2500M or IR*Cr25S; X7R/X7T/X7P: IR1000M or IR*Cr25S (402, 90~95%RH, 50024 hours) | |
| High Temperature Exposure | NPO: C/C2% or 1pF; X7R/X7T/X7P: C/C20%; DF 2 X initial standard; IR: NPO: IR4000M or IR*Cr40S; X7R/X7T/X7P: IR2000M or IR*Cr50S (1253, 100048 hours, Voltage: 100V-250V: 2x Rated voltage; 250V-1KV: 1.5x rated voltage; 1KVV: 1.2x rated voltage) | |
| PCB Flexural Strength | No crack and other defect (IR measurement after soldering MLCC on PCB) | |
| Embossed Plastic Taping Dimensions | 0805: 1.550.20 A, 2.350.20 B, 8.000.20 C, 3.500.05 D, 1.750.10 E, 4.000.10 F, 2.000.10 G, 4.000.10 H, 1.50 -0/+0.10 J, 1.50 Max T 1206: 1.950.20 A, 3.600.20 B, 8.000.20 C, 3.500.05 D, 1.750.10 E, 4.000.10 F, 2.000.10 G, 4.000.10 H, 1.50 -0/+0.10 J, 1.85 Max T 1210: 2.700.10 A, 3.420.10 B, 8.000.10 C, 3.500.05 D, 1.750.10 E, 4.000.10 F, 2.000.05 G, 4.000.10 H, 1.55 -0/+0.10 J, 3.2 Max T 1808: 2.200.10 A, 4.950.10 B, 12.000.10 C, 5.500.05 D, 1.750.10 E, 4.000.10 F, 2.000.05 G, 4.000.10 H, 1.50 -0/+0.10 J, 3.0 Max T 1812: 3.660.10 A, 4.950.10 B, 12.000.10 C, 5.500.05 D, 1.750.10 E, 8.000.10 F, 2.000.05 G, 4.000.10 H, 1.55 -0/+0.10 J, 4.0 Max T | |
| Paper Tape Reel Packing Dimensions | 1005: 0.240.02 W1, 0.450.02 L1, 8.000.10 D, 3.500.05 C, 1.750.10 B, 2.000.05 P1, 2.000.05 P2, 4.000.10 P0, 1.50 -0/+0.10 d, 0.30 Below t 0201: 0.370.10 W1, 0.670.10 L1, 8.000.10 D, 3.500.05 C, 1.750.10 B, 2.000.05 P1, 2.000.05 P2, 4.000.10 P0, 1.50 -0/+0.10 d, 0.80 Below t 0402: 0.650.10 W1, 1.150.10 L1, 8.000.10 D, 3.500.05 C, 1.750.10 B, 2.000.05 P1, 2.000.05 P2, 4.000.10 P0, 1.50 -0/+0.10 d, 0.80 Below t 0603: 1.100.10 A, 1.900.10 B, 8.000.10 C, 3.500.05 D, 1.750.10 E, 4.000.10 F, 2.000.10 G, 4.000.10 H, 1.50 -0/+0.10 J, 1.10 Max T 0805: 1.450.15 A, 2.300.15 B, 8.00.15 C, 3.500.05 D, 1.750.10 E, 4.000.10 F, 2.000.10 G, 4.000.10 H, 1.50 -0/+0.10 J, 1.10 Max T 1206: 1.800.20 A, 3.400.20 B, 8.000.20 C, 3.500.05 D, 1.750.10 E, 4.000.10 F, 2.000.10 G, 4.000.10 H, 1.50 -0/+0.10 J, 1.10 Max T | |
| Reel Dimensions | 7REEL: 1782.0 A, 3.0 B, 130.5 C, 210.5 D, 21 or Bigger E, 1010.5 F, 12max G 13REEL: 3302.0 A, 3.0 B, 130.5 C, 210.5 D, 21 or Bigger E, 1010.5 F, 12max G | |
| Top Tape Peeling Strength | 0.1N < peeling strength < 0.7N | |
| Packing Quantity | 0603 Paper T/R: 4000 pcs; 0805 Plastic T/R: 3000 pcs; 1206 Plastic T/R (T1.60mm): 3000 pcs; 1210 Plastic T/R (T1.60mm): 3000 pcs; 1808 Plastic T/R: 2000 pcs; 1812 Plastic T/R (T1.85mm): 1000 pcs | |
Precautions For Use
Multi-layer Ceramic Capacitors (MLCCs) may fail in short or open circuit modes under severe electrical or mechanical stress exceeding specified ratings. This can lead to burnout, flaming, or glowing. Adhere to the following safety precautions and application notes. Contact the engineering section or factory for handling questions.
- Soldering Profile: Follow the recommended temperature profile to avoid cracks due to sudden temperature changes.
- Manual Soldering: Exercise caution to prevent thermal cracks. Ensure proper soldering iron tip selection and temperature control.
- Optimum Solder Amount for Reflow Soldering: Refer to recommended soldering amounts.
- Recommended Soldering Method: RReflow Soldering, WWave Soldering. Specific recommendations vary by size, temperature characteristic, rated voltage, and capacitance.
- Soldering Temperature Profile: Maintain a temperature difference T150 between soldering temperature and chip surface temperature during preheating.
2509251626_AIDE-CAPACITOR-0805X7R102K500NT_C48579593.pdf
Request A Quote
Please Use Our Online Inquiry Contact Form Below If You Have Any Questions, Our Team Will Get Back To You As Soon As Possible
