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quality Multi Layer Ceramic Capacitor AIDE CAPACITOR 0805X7R102K501NT Designed for AC DC and DC DC Power Chargers factory
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quality Multi Layer Ceramic Capacitor AIDE CAPACITOR 0805X7R102K501NT Designed for AC DC and DC DC Power Chargers factory
>
Specifications
Voltage Rating:
500V
Capacitance:
1nF
Temperature Coefficient:
X7R
Tolerance:
±10%
Mfr. Part #:
0805X7R102K501NT
Model Number:
0805X7R102K501NT
Package:
0805
Key Attributes
Product Description

Product Overview

This product is a Multi-Layer Ceramic Capacitor (MLCC) designed for high-voltage applications. It is ideal for coupling, wave filtering, and resonant functions in various power supply and electronic circuits. Applications include switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamp ballasts. The MLCCs are available in various sizes and temperature characteristics, offering reliable performance in demanding electrical environments.

Product Attributes

  • Material: Ceramic dielectric with inner and outer electrodes.
  • Terminal Composition: Au/Ag-Ni-Sn (from the inside out).
  • Certifications: RoHS/REACH compliant.

Technical Specifications

Item Description Specification
Dimension Code 0201 (0.50x0.25mm) L*W (inch): 0.02*0.01
0402 (1.00x0.50mm) L*W (inch): 0.04*0.02
0603 (1.60x0.80mm) L*W (inch): 0.06*0.03
0805 (2.00x1.25mm) L*W (inch): 0.08*0.05
1206 (3.20x1.60mm) L*W (inch): 0.12*0.06
1210 (3.20x2.50mm) L*W (inch): 0.12*0.10
1808 (4.50x2.00mm) L*W (inch): 0.18*0.08
1812 (4.50x3.20mm) L*W (inch): 0.18*0.12
1825 (4.50x6.30mm) L*W (inch): 0.18*0.25
2225 (5.70x6.30mm) L*W (inch): 0.22*0.25
Temperature Characteristic C0G (0 30 PPM/)
X7R (15%)
X5R (15%)
Nominal Electrostatic Capacity Example: 8R0 = 8.0pF, 100 = 10pF, 101 = 100pF
Tolerance of Electrostatic Capacity B: 0.1pF, C: 0.25pF, D: 0.5pF, F: 1%, G: 2%, J: 5%, K: 10%, M: 20%, Z: +80%/-20%
Rated Voltage (DC) Example: 250 = 25V, 251 = 250V, 252 = 2500V
Packing T: Tape/Reel, P: Bag packing (PE)
Operating Temperature Range -55 ~ +125
Construction 1. Ceramic dielectric, 2. Inner electrode, 3. Outer electrode, 4. Nickel layer, 5. Tin layer
Dimensions (mm) Part Number L Tol | W Tol | T Tol | WB Tol
0201 (0603) 0.600.10 | 0.300.05 | 0.300.05 | 0.100.05
0402 (1005) 1.000.15 | 0.500.15 | 0.500.10 | 0.200.10
0603 (1608) 1.600.20 | 0.800.15 | 0.800.15 | 0.300.10
0805 (2012) 2.000.20 | 1.250.20 | 0.800.20 | 0.500.20
1206 (3216) 3.200.30 | 1.600.30 | 1.000.20 | 0.600.30
1210 (3225) 3.200.30 | 2.500.30 | 2.70 | 0.800.30
1808 (4520) 4.500.40 | 2.000.20 | 2.70 | 0.800.30
1812 (4532) 4.500.40 | 3.200.30 | 3.50 | 0.800.30
1825 (4563) 4.500.40 | 6.300.50 | 3.50 | 0.800.30
2220 (5750) 5.700.50 | 5.000.50 | 3.50 | 1.000.40
2225 (5763) 5.700.50 | 6.300.50 | 6.20 | 1.000.40

Testing Conditions

Normal Condition:

  • Temperature: 15~35
  • Humidity: 45~75%RH
  • Atmosphere: 86~106kPa

Relative Condition:

  • Temperature: 252
  • Humidity: 60~70%RH
  • Atmosphere: 86~106kPa

Testing Specifications & Methods

No. Item Specification/Requirement Testing Method
1 Temperature -55~+125
2 Visual/Dimension 1. No Damage, 2. Dimension meet Spec Naked eye (Visual inspection), Digital caliper
3 Static Capacity Meet standard specification and tolerance Refer to detailed specification for NPO and X7R/X7T/X7P characteristics.
4 Dissipation Factor (DF) Refer to detailed specification for NPO and X7R/X7T/X7P characteristics. Refer to detailed specification for testing frequency and voltage.
5 IR Insulation Resistance NPO: IR50000M, C10nF; IR*Cr500S, C>10nF. X7R/X7T/X7P: IR10000M, C25nF; IR*Cr100S, C>25nF. Testing condition: Rated voltage, Time: 605s, Humidity: 75%, Temperature: 255, Current: 50mA
6 Hi-pot (DC) No dielectric breakdown or damage. Ur=100V, 2.5x rated voltage; Ur=200V/250V, 2.0x rated voltage; Ur=450/500/630V, 1.5x rated voltage; 1KVUr2KV, 1.2x rated voltage; 2KVUr, 1.1x rated voltage. Voltage Raising time: 110S, Voltage maintaining time: 2S
7 Solderability Soldering area90% Pre-heating temperature 80-120, time 10-30s, lead free solder, flux. Soldering temperature 2455, Solder time 20.5s.
8 Resistance to the heat of soldering Visual-No damage, soldering area90% Pre-heating temperature 100-200, time 102 s, soldering temperature: 2655, Soldering time: 51s. Cleaning with solvent. Room temperature, time: 242 hours.
9 Flexural Strength No damage. Electrostatic capacity change rate C/C10% Base board: Al2O3 /PCB. PCB dimension: Thickness: 1.6mm, Length: 100mm, Width: 40mm. Flexural depth: 1mm. Bend speed: 0.5mm/sec.
10 Terminal Bonding Strength No visual damage Applied Force: 5N, Duration: 101S
11 Thermal Shock NPO: C/C2.5% or 0.25pF; X7R/X7P: C/C0.5%; X7T: C/C10% Pre-condition(X7R h characteristic):Upper limit temperature 1hour, place 241 hours, start testing. Run 5 cycles Thermal shock. Test after place 242 hours normal temp & humidity.
12 Temperature Moisture Exposure NPO: C/C2% or 1pF; X7R/X7T/X7P: C/C10%. DF 2 times initial standard. IR NPO: IR2500M or IR*Cr25S; X7R/X7T/X7P: IR1000M or IR*Cr25S. Temperature 402, Humidity 90~95%RH, time 50024 hours. Test after place 242 hours normal temp & humidity.
13 High Temperature Exposure NPO: C/C2% or 1pF; X7R/X7T/X7P: C/C20%. DF 2 X initial standard. IR NPO: IR4000M or IR*Cr40S; X7R/X7T/X7P: IR2000M or IR*Cr50S. Temperature 1253, Time 100048 hours. Voltage: 100VV250V 2x Rated voltage, 250VV1KV 1.5x rated voltage, 1KVV 1.2x rated voltage. Test after place 48 hours under normal pressure & temperature.
14 PCB Flexural Strength No crack and other defect. IR Soldering the MLCC on the PCB, then pressing direction based on the photo.

Embossed Plastic Taping Details

Code Tape size (mm) A B C D E F G H J T
0805 T 1.55 0.20 2.35 0.20 8.00 0.20 3.50 0.05 1.75 0.10 4.00 0.10 2.00 0.10 4.00 0.10 1.50 -0/+0.10 1.50 Max
1206 T 1.95 0.20 3.60 0.20 8.00 0.20 3.50 0.05 1.75 0.10 4.00 0.10 2.00 0.10 4.00 0.1 1.50 -0/+0.10 1.85 Max
1210 T 2.70 0.10 3.42 0.10 8.00 0.10 3.50 0.05 1.75 0.10 4.00 0.10 2.00 0.05 4.00 0.10 1.55 -0/+0.10 3.2 Max
1808 T 2.20 0.10 4.95 0.10 12.00 0.10 5.50 0.05 1.75 0.10 4.00 0.10 2.00 0.05 4.00 0.10 1.50 -0/+0.10 3.0 Max
1812 T 3.66 0.10 4.95 0.10 12.00 0.10 5.50 0.05 1.75 0.10 8.00 0.10 2.00 0.05 4.00 0.10 1.55 -0/+0.10 4.0 Max

Paper Tape Reel Packing Details

Code Paper size (mm) W1 L1 D C B P1 P2 P0 d t
1005 0.24 0.02 0.45 0.02 8.00 0.10 3.50 0.05 1.75 0.10 2.00 0.05 2.00 0.05 4.00 0.10 1.50 -0/+0.10 0.30 Below
0201 0.37 0.10 0.67 0.10 8.00 0.10 3.50 0.05 1.75 0.10 2.00 0.05 2.00 0.05 4.00 0.10 1.50 -0/+0.10 0.80 Below
0402 0.65 0.10 1.15 0.10 8.00 0.10 3.50 0.05 1.75 0.10 2.00 0.05 2.00 0.05 4.00 0.10 1.50 -0/+0.10 0.80 Below
Code Paper size (mm) A B C D E F G H J T
0603 1.10 0.10 1.90 0.10 8.00 0.10 3.50 0.05 1.75 0.10 4.00 0.10 2.00 0.10 4.00 0.10 1.50 -0/+0.10 1.10 Max
0805 1.45 0.15 2.30 0.15 8.0 0.15 3.50 0.05 1.75 0.10 4.00 0.10 2.00 0.10 4.00 0.10 1.50 -0/+0.10 1.10 Max
1206 1.80 0.20 3.40 0.20 8.00 0.20 3.50 0.05 1.75 0.10 4.00 0.10 2.00 0.10 4.00 0.10 1.50 -0/+0.10 1.10 Max

Reel Dimensions

Unit: mm A B C D E F G
7REEL 1782.0 3.0 130.5 210.5 21 or Bigger 1010.5 12max
13REEL 3302.0 3.0 130.5 210.5 21 or Bigger 1010.5 12max

Taping Specification

Top tape peeling strength: 0.1N < peeling strength < 0.7N. No paper dirty remains on the scotch when peeling, and sticks to top and bottom tape.

Packing Quantity

Dimension Paper T/R (Pcs) Plastic T/R (Pcs)
0603 4000 -
0805 4000 3000 (T1.35mm)
1206 - 3000 (T>1.35mm), 2000 (T1.60mm)
1210 - 3000 (T>1.60mm), 2000
1808 - 1000 (T1.85mm)
1812 - 1000 (T>1.85mm), 800
1812 - 500

Precautions For Use

Multi-layer Ceramic Capacitors (MLCC) may fail in a short circuit mode when subjected to severe conditions beyond specified ratings. To avoid risks such as burn out, flaming, or glowing, adhere to the following precautions:

  • Soldering Profile: Follow the recommended temperature profile to prevent cracks due to sudden temperature changes.
  • Manual Soldering: Handle soldering irons carefully, paying attention to tip selection and temperature to avoid thermal cracks.
  • Optimum Solder Amount for Reflow Soldering
  • Recommended Soldering amounts

Recommended Soldering Method

Size Temperature Characteristics Rated Voltage Capacitance Soldering Method
1005 NPO / / R
X7R/X5R/X7S/X6S / / R
0201 NPO / / R
X7R/X5R/X7S/X6S / / R
Y5V / / R
0402 NPO / / R
X7R/X5R/X7S/X6S / / R
Y5V / / R
0603 NPO / / R/W
X7R/X5R/X7S/X6S / C1uf R
/ C1uf R/W
Y5V / C1uf R
/ C1uf R/W
0805 NPO / / R/W
X7R/X5R/X7S/X6S / C4.7uf R
/ C4.7uf R/W
Y5V / C1uf R
/ C1uf R/W
1206 NPO / / R/W
X7R/X5R/X7S/X6S / C10uf R
/ C10uf R/W
Y5V / C10uf R
/ C10uf R/W
1210 NPO / / R
X7R/X5R/X7S/X6S / / R
Y5V / / R

Soldering method: RReflow Soldering, WWave Soldering

Soldering Temperature Profile

During preheating, keep the temperature difference between soldering temperature and surface temperature of chips as T150.


2509251626_AIDE-CAPACITOR-0805X7R102K501NT_C48579594.pdf

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