Product Overview
This product is a Multi-Layer Ceramic Capacitor (MLCC) designed for high-voltage applications. It is ideal for coupling, wave filtering, and resonant functions in various power supply and electronic circuits. Applications include switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamp ballasts. The MLCCs are available in various sizes and temperature characteristics, offering reliable performance in demanding electrical environments.
Product Attributes
- Material: Ceramic dielectric with inner and outer electrodes.
- Terminal Composition: Au/Ag-Ni-Sn (from the inside out).
- Certifications: RoHS/REACH compliant.
Technical Specifications
| Item | Description | Specification |
|---|---|---|
| Dimension Code | 0201 (0.50x0.25mm) | L*W (inch): 0.02*0.01 |
| 0402 (1.00x0.50mm) | L*W (inch): 0.04*0.02 | |
| 0603 (1.60x0.80mm) | L*W (inch): 0.06*0.03 | |
| 0805 (2.00x1.25mm) | L*W (inch): 0.08*0.05 | |
| 1206 (3.20x1.60mm) | L*W (inch): 0.12*0.06 | |
| 1210 (3.20x2.50mm) | L*W (inch): 0.12*0.10 | |
| 1808 (4.50x2.00mm) | L*W (inch): 0.18*0.08 | |
| 1812 (4.50x3.20mm) | L*W (inch): 0.18*0.12 | |
| 1825 (4.50x6.30mm) | L*W (inch): 0.18*0.25 | |
| 2225 (5.70x6.30mm) | L*W (inch): 0.22*0.25 | |
| Temperature Characteristic | C0G | (0 30 PPM/) |
| X7R | (15%) | |
| X5R | (15%) | |
| Nominal Electrostatic Capacity | Example: 8R0 = 8.0pF, 100 = 10pF, 101 = 100pF | |
| Tolerance of Electrostatic Capacity | B: 0.1pF, C: 0.25pF, D: 0.5pF, F: 1%, G: 2%, J: 5%, K: 10%, M: 20%, Z: +80%/-20% | |
| Rated Voltage (DC) | Example: 250 = 25V, 251 = 250V, 252 = 2500V | |
| Packing | T: Tape/Reel, P: Bag packing (PE) | |
| Operating Temperature Range | -55 ~ +125 | |
| Construction | 1. Ceramic dielectric, 2. Inner electrode, 3. Outer electrode, 4. Nickel layer, 5. Tin layer | |
| Dimensions (mm) | Part Number | L Tol | W Tol | T Tol | WB Tol |
| 0201 (0603) | 0.600.10 | 0.300.05 | 0.300.05 | 0.100.05 | |
| 0402 (1005) | 1.000.15 | 0.500.15 | 0.500.10 | 0.200.10 | |
| 0603 (1608) | 1.600.20 | 0.800.15 | 0.800.15 | 0.300.10 | |
| 0805 (2012) | 2.000.20 | 1.250.20 | 0.800.20 | 0.500.20 | |
| 1206 (3216) | 3.200.30 | 1.600.30 | 1.000.20 | 0.600.30 | |
| 1210 (3225) | 3.200.30 | 2.500.30 | 2.70 | 0.800.30 | |
| 1808 (4520) | 4.500.40 | 2.000.20 | 2.70 | 0.800.30 | |
| 1812 (4532) | 4.500.40 | 3.200.30 | 3.50 | 0.800.30 | |
| 1825 (4563) | 4.500.40 | 6.300.50 | 3.50 | 0.800.30 | |
| 2220 (5750) | 5.700.50 | 5.000.50 | 3.50 | 1.000.40 | |
| 2225 (5763) | 5.700.50 | 6.300.50 | 6.20 | 1.000.40 | |
Testing Conditions
Normal Condition:
- Temperature: 15~35
- Humidity: 45~75%RH
- Atmosphere: 86~106kPa
Relative Condition:
- Temperature: 252
- Humidity: 60~70%RH
- Atmosphere: 86~106kPa
Testing Specifications & Methods
| No. | Item | Specification/Requirement | Testing Method |
|---|---|---|---|
| 1 | Temperature | -55~+125 | |
| 2 | Visual/Dimension | 1. No Damage, 2. Dimension meet Spec | Naked eye (Visual inspection), Digital caliper |
| 3 | Static Capacity | Meet standard specification and tolerance | Refer to detailed specification for NPO and X7R/X7T/X7P characteristics. |
| 4 | Dissipation Factor (DF) | Refer to detailed specification for NPO and X7R/X7T/X7P characteristics. | Refer to detailed specification for testing frequency and voltage. |
| 5 | IR Insulation Resistance | NPO: IR50000M, C10nF; IR*Cr500S, C>10nF. X7R/X7T/X7P: IR10000M, C25nF; IR*Cr100S, C>25nF. | Testing condition: Rated voltage, Time: 605s, Humidity: 75%, Temperature: 255, Current: 50mA |
| 6 | Hi-pot (DC) | No dielectric breakdown or damage. Ur=100V, 2.5x rated voltage; Ur=200V/250V, 2.0x rated voltage; Ur=450/500/630V, 1.5x rated voltage; 1KVUr2KV, 1.2x rated voltage; 2KVUr, 1.1x rated voltage. | Voltage Raising time: 110S, Voltage maintaining time: 2S |
| 7 | Solderability | Soldering area90% | Pre-heating temperature 80-120, time 10-30s, lead free solder, flux. Soldering temperature 2455, Solder time 20.5s. |
| 8 | Resistance to the heat of soldering | Visual-No damage, soldering area90% | Pre-heating temperature 100-200, time 102 s, soldering temperature: 2655, Soldering time: 51s. Cleaning with solvent. Room temperature, time: 242 hours. |
| 9 | Flexural Strength | No damage. Electrostatic capacity change rate C/C10% | Base board: Al2O3 /PCB. PCB dimension: Thickness: 1.6mm, Length: 100mm, Width: 40mm. Flexural depth: 1mm. Bend speed: 0.5mm/sec. |
| 10 | Terminal Bonding Strength | No visual damage | Applied Force: 5N, Duration: 101S |
| 11 | Thermal Shock | NPO: C/C2.5% or 0.25pF; X7R/X7P: C/C0.5%; X7T: C/C10% | Pre-condition(X7R h characteristic):Upper limit temperature 1hour, place 241 hours, start testing. Run 5 cycles Thermal shock. Test after place 242 hours normal temp & humidity. |
| 12 | Temperature Moisture Exposure | NPO: C/C2% or 1pF; X7R/X7T/X7P: C/C10%. DF 2 times initial standard. IR NPO: IR2500M or IR*Cr25S; X7R/X7T/X7P: IR1000M or IR*Cr25S. | Temperature 402, Humidity 90~95%RH, time 50024 hours. Test after place 242 hours normal temp & humidity. |
| 13 | High Temperature Exposure | NPO: C/C2% or 1pF; X7R/X7T/X7P: C/C20%. DF 2 X initial standard. IR NPO: IR4000M or IR*Cr40S; X7R/X7T/X7P: IR2000M or IR*Cr50S. | Temperature 1253, Time 100048 hours. Voltage: 100VV250V 2x Rated voltage, 250VV1KV 1.5x rated voltage, 1KVV 1.2x rated voltage. Test after place 48 hours under normal pressure & temperature. |
| 14 | PCB Flexural Strength | No crack and other defect. | IR Soldering the MLCC on the PCB, then pressing direction based on the photo. |
Embossed Plastic Taping Details
| Code | Tape size (mm) | A | B | C | D | E | F | G | H | J | T |
|---|---|---|---|---|---|---|---|---|---|---|---|
| 0805 | T | 1.55 0.20 | 2.35 0.20 | 8.00 0.20 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.10 | 1.50 -0/+0.10 | 1.50 Max |
| 1206 | T | 1.95 0.20 | 3.60 0.20 | 8.00 0.20 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.1 | 1.50 -0/+0.10 | 1.85 Max |
| 1210 | T | 2.70 0.10 | 3.42 0.10 | 8.00 0.10 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.05 | 4.00 0.10 | 1.55 -0/+0.10 | 3.2 Max |
| 1808 | T | 2.20 0.10 | 4.95 0.10 | 12.00 0.10 | 5.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.05 | 4.00 0.10 | 1.50 -0/+0.10 | 3.0 Max |
| 1812 | T | 3.66 0.10 | 4.95 0.10 | 12.00 0.10 | 5.50 0.05 | 1.75 0.10 | 8.00 0.10 | 2.00 0.05 | 4.00 0.10 | 1.55 -0/+0.10 | 4.0 Max |
Paper Tape Reel Packing Details
| Code | Paper size (mm) | W1 | L1 | D | C | B | P1 | P2 | P0 | d | t |
|---|---|---|---|---|---|---|---|---|---|---|---|
| 1005 | 0.24 0.02 | 0.45 0.02 | 8.00 0.10 | 3.50 0.05 | 1.75 0.10 | 2.00 0.05 | 2.00 0.05 | 4.00 0.10 | 1.50 -0/+0.10 | 0.30 Below | |
| 0201 | 0.37 0.10 | 0.67 0.10 | 8.00 0.10 | 3.50 0.05 | 1.75 0.10 | 2.00 0.05 | 2.00 0.05 | 4.00 0.10 | 1.50 -0/+0.10 | 0.80 Below | |
| 0402 | 0.65 0.10 | 1.15 0.10 | 8.00 0.10 | 3.50 0.05 | 1.75 0.10 | 2.00 0.05 | 2.00 0.05 | 4.00 0.10 | 1.50 -0/+0.10 | 0.80 Below |
| Code | Paper size (mm) | A | B | C | D | E | F | G | H | J | T |
|---|---|---|---|---|---|---|---|---|---|---|---|
| 0603 | 1.10 0.10 | 1.90 0.10 | 8.00 0.10 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.10 | 1.50 -0/+0.10 | 1.10 Max | |
| 0805 | 1.45 0.15 | 2.30 0.15 | 8.0 0.15 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.10 | 1.50 -0/+0.10 | 1.10 Max | |
| 1206 | 1.80 0.20 | 3.40 0.20 | 8.00 0.20 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.10 | 1.50 -0/+0.10 | 1.10 Max |
Reel Dimensions
| Unit: mm | A | B | C | D | E | F | G |
|---|---|---|---|---|---|---|---|
| 7REEL | 1782.0 | 3.0 | 130.5 | 210.5 | 21 or Bigger | 1010.5 | 12max |
| 13REEL | 3302.0 | 3.0 | 130.5 | 210.5 | 21 or Bigger | 1010.5 | 12max |
Taping Specification
Top tape peeling strength: 0.1N < peeling strength < 0.7N. No paper dirty remains on the scotch when peeling, and sticks to top and bottom tape.
Packing Quantity
| Dimension | Paper T/R (Pcs) | Plastic T/R (Pcs) |
|---|---|---|
| 0603 | 4000 | - |
| 0805 | 4000 | 3000 (T1.35mm) |
| 1206 | - | 3000 (T>1.35mm), 2000 (T1.60mm) |
| 1210 | - | 3000 (T>1.60mm), 2000 |
| 1808 | - | 1000 (T1.85mm) |
| 1812 | - | 1000 (T>1.85mm), 800 |
| 1812 | - | 500 |
Precautions For Use
Multi-layer Ceramic Capacitors (MLCC) may fail in a short circuit mode when subjected to severe conditions beyond specified ratings. To avoid risks such as burn out, flaming, or glowing, adhere to the following precautions:
- Soldering Profile: Follow the recommended temperature profile to prevent cracks due to sudden temperature changes.
- Manual Soldering: Handle soldering irons carefully, paying attention to tip selection and temperature to avoid thermal cracks.
- Optimum Solder Amount for Reflow Soldering
- Recommended Soldering amounts
Recommended Soldering Method
| Size | Temperature Characteristics | Rated Voltage | Capacitance | Soldering Method |
|---|---|---|---|---|
| 1005 | NPO | / | / | R |
| X7R/X5R/X7S/X6S | / | / | R | |
| 0201 | NPO | / | / | R |
| X7R/X5R/X7S/X6S | / | / | R | |
| Y5V | / | / | R | |
| 0402 | NPO | / | / | R |
| X7R/X5R/X7S/X6S | / | / | R | |
| Y5V | / | / | R | |
| 0603 | NPO | / | / | R/W |
| X7R/X5R/X7S/X6S | / | C1uf | R | |
| / | C1uf | R/W | ||
| Y5V | / | C1uf | R | |
| / | C1uf | R/W | ||
| 0805 | NPO | / | / | R/W |
| X7R/X5R/X7S/X6S | / | C4.7uf | R | |
| / | C4.7uf | R/W | ||
| Y5V | / | C1uf | R | |
| / | C1uf | R/W | ||
| 1206 | NPO | / | / | R/W |
| X7R/X5R/X7S/X6S | / | C10uf | R | |
| / | C10uf | R/W | ||
| Y5V | / | C10uf | R | |
| / | C10uf | R/W | ||
| 1210 | NPO | / | / | R |
| X7R/X5R/X7S/X6S | / | / | R | |
| Y5V | / | / | R |
Soldering method: RReflow Soldering, WWave Soldering
Soldering Temperature Profile
During preheating, keep the temperature difference between soldering temperature and surface temperature of chips as T150.
2509251626_AIDE-CAPACITOR-0805X7R102K501NT_C48579594.pdf
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