Product Overview
This product is a Multi-layer Ceramic Capacitor (MLCC) designed for high-voltage applications. It is suitable for coupling, wave filtering, and resonant functions in various high-voltage circuits, including switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamps. The MLCCs are available in a range of standard sizes and temperature characteristics, offering reliable performance in demanding electrical environments.
Product Attributes
- Temperature Characteristic Options: C0G (030 PPM/), X7R (15%), X5R (15%)
- Terminal Composition: Au/Ag-Ni-Sn (From the inside out)
- RoHS/REACH Compliance: Meets RoHS and REACH standards.
Technical Specifications
| Item | Description | Specification/Requirement | Testing Method | ||
|---|---|---|---|---|---|
| Application Field | Coupling, wave filtering, resonant in high voltage circuits, switch power suppliers, AC-DC power chargers, DC-DC power chargers, networking/Communication interfaces, LCD backlight unit power suppliers, amperites of energy saving lamps, etc. (Medium and High voltage MLCC). | ||||
| Testing Conditions: - Normal: Temperature 15~35, Humidity 45~75%RH, Atmosphere 86~106kPa - Relative: Temperature 252, Humidity 60~70%RH, Atmosphere 86~106kPa | |||||
| Part Number Description | Example: 1812 X7R 684 M 251 N T 1. Dimension Code 2. Temperature Characteristic 3. Nominal Electrostatic Capacity 4. Tolerance of Electrostatic Capacity 5. Rated Voltage (DC) 6. Terminal Composition 7. Packing | ||||
| Dimension Codes & Sizes | Inch (L*W): 0201 (0.02*0.01), 0402 (0.04*0.02), 0603 (0.06*0.03), 0805 (0.08*0.05), 1206 (0.12*0.06), 1210 (0.12*0.10), 1808 (0.18*0.08), 1812 (0.18*0.12), 1825 (0.18*0.25), 2211 (0.22*0.11), 2225 (0.22*0.25) Metric (L*W mm): 0201 (0.50*0.25), 0402 (1.00*0.50), 0603 (1.60*0.80), 0805 (2.00*1.25), 1206 (3.20*1.60), 1210 (3.20*2.50), 1808 (4.50*2.00), 1812 (4.50*3.20), 1825 (4.50*6.30), 2211 (5.70*2.8), 2225 (5.70*6.30) | ||||
| Construction | Ceramic dielectric, Inner electrode, Outer electrode, Nickel layer, Tin layer | ||||
| Dimensions (mm) | Part Number | L | W | T | WB |
| British System | 0201 (0603) | 0.600.10 | 0.300.05 | 0.300.05 | 0.100.05 |
| 0402 (1005) | 1.000.15 | 0.500.15 | 0.500.10 | 0.200.10 | |
| 0603 (1608) | 1.600.20 | 0.800.15 | 0.800.15 | 0.300.10 | |
| 0805 (2012) | 2.000.20 | 1.250.20 | 0.800.20 | 0.500.20 | |
| 1206 (3216) | 3.200.30 | 1.600.30 | 1.000.20 | 0.600.30 | |
| 1210 (3225) | 3.200.30 | 2.500.30 | 2.70 | 0.800.30 | |
| 1808 (4520) | 4.500.40 | 2.000.20 | 2.70 | 0.800.30 | |
| 1812 (4532) | 4.500.40 | 3.200.30 | 3.50 | 0.800.30 | |
| 1825 (4563) | 4.500.40 | 6.300.50 | 3.50 | 0.800.30 | |
| 2220 (5750) | 5.700.50 | 5.000.50 | 3.50 | 1.000.40 | |
| 2225 (5763) | 5.700.50 | 6.300.50 | 6.20 | 1.000.40 | |
| Temperature Characteristic | C0G (030 PPM/), X7R (15%), X5R (15%) | ||||
| Nominal Electrostatic Capacity | 8R08.0pF, 10010pF, 101100pF | ||||
| Tolerance of Electrostatic Capacity | B:0.1pF, C:0.25pF, D:0.5pF, F:1%, G: 2%, J:5%, K:10%, M:20%, Z:+80%/-20% | ||||
| Rated Voltage (DC) | 25025V, 251250V, 2522500V | ||||
| Temperature Range | -55~+125 | ||||
| Dissipation Factor (DF) | Refer to Note 1 for specific values based on characteristic and capacitance. | ||||
| Insulation Resistance (IR) | NPO Characteristic: IR50000M, C10nF; IR*Cr500S, C10nF X7R/X7T/X7P Characteristic: IR10000M, C25nF; IR*Cr100S, C25nF Testing condition: Rated voltage, Time: 605s, Humidity: 75%, Temperature: 255, Current: 50mA | ||||
| Hi-pot (DC) | No dielectric breakdown or damage. Test voltage depends on rated voltage (Ur): - Ur=100V: 2.5 x rated voltage - Ur=200V/250V: 2.0 x rated voltage - Ur=450/500/630V: 1.5 x rated voltage - 1KVUr2KV: 1.2 x rated voltage - 2KVUr: 1.1 x rated voltage Voltage Raising time: 110S, Voltage maintaining time: 2S | ||||
| Solderability | Soldering area 90%, Visual-No damage. Pre-heating temperature 80-120, time 10-30s, lead free solder, flux. Soldering temperature 2455, Solder time 20.5s. | ||||
| Resistance to the heat of soldering | Visual-No damage, soldering area 90%. Pre-heating temperature 100-200, time 102s, soldering temperature: 2655, Soldering time: 51s. Cleaning with solvent. Room temperature, time: 242 hours. | ||||
| Electrostatic Capacity Change Rate | NPO Characteristic: C/C0.5% or 0.5pF (larger reading) X7R: C/C15% X7T: -33% C/C22% X7P: C/C10% | ||||
| Flexural Strength | No damage. Base board: Al2O3 /PCB. PCB dimension: Thickness: 1.6mm, Length: 100mm, Width: 40mm. Flexural depth: 1mm. Bend speed: 0.5mm/sec. Electro static capacity change rate: C/C10% | ||||
| Terminal Bonding Strength | No visual damage. Applied Force: 5N, Duration: 101S | ||||
| Thermal Shock | NPO Characteristic: C/C2.5% or 0.25pF (larger reading) X7R/X7P Characteristic: C/C0.5% X7T Characteristic: C/C10% 5 cycles. Test after 242 hours at normal temp & humidity. | ||||
| Temperature Moisture Exposure | Visual: No visual damage. Temperature: 402, Humidity: 90~95%RH, Time: 50024 hours. Electrostatic Capacitance Change Rate: - NPO: C/C2% or 1pF (larger reading) - X7R/X7T/X7P: C/C10% DF: 2 times initial standard IR: NPO: IR2500M or IR*Cr25S (Lower reading); X7R/X7T/X7P: IR1000M or IR*Cr25S (Lower reading) | ||||
| High Temperature Exposure | Visual: No visual damage. Temperature: 1253, Time: 100048 hours. Voltage: Varies based on rated voltage. Electrostatic Capacitance Change Rate: - NPO: C/C2% or 1pF (larger reading) - X7R/X7T/X7P: C/C20% DF: 2 X initial standard IR: NPO: IR4000M or IR*Cr40S (Lower reading); X7R/X7T/X7P: IR2000M or IR*Cr50S (Lower reading) | ||||
| PCB Flexural Strength | No crack and other defect. IR measurement after soldering. | ||||
| Embossed Plastic Taping Dimensions | Details provided for 0805 to 1812 types, including tape size, pitch, and reel dimensions. | ||||
| Paper Tape Reel Packing Dimensions | Details provided for 1005, 0201, 0402, 0603, 0805, and 1206 types, including tape size, pitch, and reel dimensions. | ||||
| Taping Specification | Top tape peeling strength: 0.1N < peeling strength < 0.7N for embossed taping. | ||||
| Packing Quantity | Quantities vary by size and tape type (Paper/Plastic). See Page 11 for details. | ||||
| Soldering Method Recommendations | Recommended methods (R-Reflow, W-Wave) provided for different sizes, temperature characteristics, and capacitance values. See Page 13 for details. | ||||
| Soldering Temperature Profile | Details on preheating and soldering temperatures to avoid cracks. See Page 14 for details. | ||||
Precautions For Use
MLCCs may fail in short or open circuit modes under severe electrical or mechanical stress beyond specified ratings. To prevent issues like burnout, flaming, or glowing, adhere to the following precautions:
- Soldering Profile: Follow the recommended temperature profile to prevent cracks due to sudden temperature changes.
- Manual Soldering: Handle soldering irons carefully to avoid direct contact with the ceramic body and prevent thermal cracks.
- Optimum Solder Amount: Ensure the correct solder amount for reflow soldering.
2509251626_AIDE-CAPACITOR-0805X7R106K100NT_C48579605.pdf
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