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Specifications
Voltage Rating:
250V
Capacitance:
220pF
Temperature Coefficient:
X7R
Tolerance:
±10%
Mfr. Part #:
0805X7R221K251NT
Model Number:
0805X7R221K251NT
Package:
0805
Key Attributes
Product Description
Product Overview
This product is a Multi-Layer Ceramic Capacitor (MLCC) designed for high-voltage applications. It is suitable for coupling, wave filtering, and resonant functions in various power supply and lighting circuits, including switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamps. These MLCCs are available in medium and high voltage ratings.
Product Attributes
- Material: Ceramic dielectric, Inner electrode, Outer electrode (Au/Ag-Ni-Sn terminal composition).
- Certifications: RoHS compliant, REACH compliant.
- Packing Options: Tape/Reel (T), Bag packing (P).
Technical Specifications
Part Number Description Example: 1812 X7R 684 M 251 N T
Dimension Codes (L*W):
- 0201: 0.02*0.01 inch (0.50*0.25 mm)
- 0402: 0.04*0.02 inch (1.00*0.50 mm)
- 0603: 0.06*0.03 inch (1.60*0.80 mm)
- 0805: 0.08*0.05 inch (2.00*1.25 mm)
- 1206: 0.12*0.06 inch (3.20*1.60 mm)
- 1210: 0.12*0.10 inch (3.20*2.50 mm)
- 1808: 0.18*0.08 inch (4.50*2.00 mm)
- 1812: 0.18*0.12 inch (4.50*3.20 mm)
- 1825: 0.18*0.25 inch (4.50*6.30 mm)
- 2211: 0.22*0.11 inch (5.70*2.8 mm)
- 2225: 0.22*0.25 inch (5.70*6.30 mm)
Temperature Characteristics:
- C0G: 0 30 PPM/
- X7R: 15%
- X5R: 15%
Nominal Electrostatic Capacity:
- 8R0: 8.0 pF
- 100: 10 pF
- 101: 100 pF
Tolerance of Electrostatic Capacity:
- B: 0.1pF
- C: 0.25pF
- D: 0.5pF
- F: 1%
- G: 2%
- J: 5%
- K: 10%
- M: 20%
- Z: +80%/-20%
Rated Voltage (DC):
- 250: 25V
- 251: 250V
- 252: 2500V
Terminal Composition: Au/Ag-Ni-Sn (From the inside out)
| Item | Specification/Requirement | Testing Method |
|---|---|---|
| Temperature | -55~+125 | - |
| Visual/Dimension | 1. No Damage 2. Dimension meet Spec | Naked eye (Visual inspection), Digital caliper |
| Static Capacity (NPO) | 1000pF: 1MHz10%, 1.00.2Vrms 1000pF: 1KHz10%, 1.00.2Vrms | - |
| Static Capacity (X7R/X7T/X7P) | 10uF: 1KHz10%, 1.00.2Vrms 10uF: 120Hz24, 0.50.1Vrms | - |
| Dissipation Factor (DF) (NPO) | DF0.56, Cr5 pF DF1.5[(150/Cr)+7]10-4 (5pFCr50pF) DF0.15%, (50pFCr) Cr1000pF, 1MHz10%, 1V0.2rms Cr1000pF, 1KHz10%, 1V0.2rms | - |
| Dissipation Factor (DF) (X7R/X7T/X7P) | Cr10uF, 1KHz10%, 1V0.1rms. Cr10uF, 120Hz24Hz, 0.5V0.1rms. | - |
| IR Insulation Resistance (NPO) | IR50000M, C10nF IR*Cr500S, C10nF | Rated voltage, Time: 605s, Humidity: 75%, Temperature: 255, Current: 50mA |
| IR Insulation Resistance (X7R/X7T/X7P) | IR10000M, C25nF IR*Cr100S, C25nF | Rated voltage, Time: 605s, Humidity: 75%, Temperature: 255, Current: 50mA |
| Hi-pot (DC) | Ur=100V, 2.5 x rated voltage Ur=200V/250V, 2.0 x rated voltage Ur=450/500/630V, 1.5 x rated voltage 1KVUr2KV, 1.2 x rated voltage 2KVUr, 1.1 x rated voltage | Voltage Raising time: 110S, Voltage maintaining time: 2S |
| Solderability | Soldering area90% | Pre-heating temperature 80-120, time 10-30s, lead free solder, flux. Soldering temperature 2455, Solder time 20.5s. |
| Resistance to the heat of soldering | No visual damage, soldering area90% | Pre-heating temperature 100-200, time 102 s, soldering temperature :2655, Soldering time:51s. Cleaning with solvent. Room temperature, time: 242 hours. |
| Electrostatic capacity change rate | NPO: C/C0.5% or 0.5pF (larger reading) X7R: C/C15% X7T: -33% C/C22% X7P: C/C10% | - |
| Flexural strength | No damage. Electro static capacity change rate C/C10% | Base boardAl2O3 /PCB, PCB dimension Thickness: 1.6mm, Length: 100mm, Width: 40mm, Flexural depth: 1mm, Bend speed: 0.5mm/sec. |
| Terminal bonding strength | No visual damage | Applied Force: 5N, Duration: 101S |
| Thermal shock | NPO: C/C2.5% or 0.25pF (larger reading) X7R/X7P: C/C0.5% X7T: C/C10% | Pre-condition(X7R h characteristic): Upper limit temperature 1hour, place 241 hours, start testing. Run 5 cycles Thermal shock. Test after place 242 hours normal temp & humidity. |
| Temperature moisture exposure | Visual: No visual damage Electrostatic capacitance change rate: NPO: C/C2% or 1pF (larger reading), X7R/X7T/X7P: C/C10% DF 2 times initial standard IR: NPO: IR2500M or IR*Cr25S (Lower reading), X7R/X7T/X7P: IR1000M or IR*Cr25S (Lower reading) | Temperature 402, Humidity 90~95%RH, time 50024 hours. Test after place 242 hours normal temp & humidity. |
| High temperature exposure | Visual: No visual damage Electrostatic capacitance change rate: NPO: C/C2% or 1pF (larger reading), X7R/X7T/X7P: C/C20% DF 2 X initial standard IR: NPO: IR4000M or IR*Cr40S (Lower reading), X7R/X7T/X7P: IR2000M or IR*Cr50S (Lower reading) | Temperature 1253, Time 100048 hours. Voltage: 100VV250V 2x Rated voltage, 250VV1KV 1.5x rated voltage, 1KVV 1.2x rated voltage. Test after place 48 hours under normal pressure & temperature. Charging and discharging current 50mA Max. |
| PCB flexural strength | No crack and other defect | Soldering the MLCC on the PCB, then pressing direction based on the photo. |
Taping Specifications
Embossed Plastic Taping
| Code | Tape size | A | B | C | D | E | F | G | H | J | T |
|---|---|---|---|---|---|---|---|---|---|---|---|
| 0805 | 1.55 0.20 | 2.35 0.20 | 8.00 0.20 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.10 | 1.50 -0/+0.10 | 1.50 Max | |
| 1206 | 1.95 0.20 | 3.60 0.20 | 8.00 0.20 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.1 | 1.50 -0/+0.10 | 1.85 Max | |
| 1210 | 2.70 0.10 | 3.42 0.10 | 8.00 0.10 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.05 | 4.00 0.10 | 1.55 -0/+0.10 | 3.2 Max | |
| 1808 | 2.20 0.10 | 4.95 0.10 | 12.00 0.10 | 5.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.05 | 4.00 0.10 | 1.50 -0/+0.10 | 3.0 Max | |
| 1812 | 3.66 0.10 | 4.95 0.10 | 12.00 0.10 | 5.50 0.05 | 1.75 0.10 | 8.00 0.10 | 2.00 0.05 | 4.00 0.10 | 1.55 -0/+0.10 | 4.0 Max |
Paper Tape Reel Packing
| Code | Paper size | W1 | L1 | D | C | B | P1 | P2 | P0 | d | t |
|---|---|---|---|---|---|---|---|---|---|---|---|
| 1005 | 0.240.02 | 0.450.02 | 8.000.10 | 3.500.05 | 1.750.10 | 2.000.05 | 2.000.05 | 4.000.10 | 1.50 -0/+0.10 | 0.30 Below | |
| 0201 | 0.370.10 | 0.670.10 | 8.000.10 | 3.500.05 | 1.750.10 | 2.000.05 | 2.000.05 | 4.000.10 | 1.50 -0/+0.10 | 0.80 Below | |
| 0402 | 0.650.10 | 1.150.10 | 8.000.10 | 3.500.05 | 1.750.10 | 2.000.05 | 2.000.05 | 4.000.10 | 1.50 -0/+0.10 | 0.80 Below |
| Code | Paper size | A | B | C | D | E | F | G | H | J | T |
|---|---|---|---|---|---|---|---|---|---|---|---|
| 0603 | 1.10 0.10 | 1.90 0.10 | 8.00 0.10 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.10 | 1.50 -0/+0.10 | 1.10 Max | |
| 0805 | 1.45 0.15 | 2.30 0.15 | 8.0 0.15 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.10 | 1.50 -0/+0.10 | 1.10 Max | |
| 1206 | 1.80 0.20 | 3.40 0.20 | 8.00 0.20 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.10 | 1.50 -0/+0.10 | 1.10 Max |
Reel Dimensions
| Type | A | B | C | D | E | F | G |
|---|---|---|---|---|---|---|---|
| 7REEL | 1782.0 | 3.0 | 130.5 | 210.5 | 21 or Bigger | 1010.5 | 12max |
| 13REEL | 3302.0 | 3.0 | 130.5 | 210.5 | 21 or Bigger | 1010.5 | 12max |
Top tape peeling strength
- Standard: 0.1N < peeling strength < 0.7N
- No paper dirty remains on the scotch when peeling, and sticks to top and bottom tape.
Packing Quantity
| Dimension | Paper T/R (Pcs) | Plastic T/R (Pcs) |
|---|---|---|
| 0603 | 4000 | - |
| 0805 | 4000 | 3000 (T1.35mm) |
| 1206 | - | 3000 (T>1.35mm), 2000 (T1.60mm) |
| 1210 | - | 3000 (T>1.60mm), 2000 |
| 1808 | - | 1000 (T1.85mm) |
| 1812 | - | 1000 (T>1.85mm), 800 |
| 1812 | - | 500 |
Precautions For Use
Multi-layer Ceramic Capacitors (MLCC) may fail in a short circuit or open circuit mode when subjected to severe electrical or mechanical stress beyond specified ratings. This can result in burn out, flaming, or glowing. Adhere to the following precautions and application notes.
- Soldering Profile: Follow the recommended temperature profile to avoid cracks due to sudden temperature changes.
- Manual Soldering: Exercise caution to prevent thermal cracks. Ensure the soldering iron tip is carefully selected and used, avoiding direct contact with the ceramic body.
- Optimum Solder Amount for Reflow Soldering
- Recommended Soldering amounts
Recommended Soldering Method
| Size | Temperature Characteristics | Rated Voltage | Capacitance | Soldering Method |
|---|---|---|---|---|
| 1005 | NPO | / | / | R |
| X7R/X5R/X7S/X6S | / | / | R | |
| 0201 | NPO | / | / | R |
| X7R/X5R/X7S/X6S | / | / | R | |
| Y5V | / | / | R | |
| 0402 | NPO | / | / | R |
| X7R/X5R/X7S/X6S | / | / | R | |
| Y5V | / | / | R | |
| 0603 | NPO | / | / | R/W |
| X7R/X5R/X7S/X6S | / | C1uf | R | |
| / | C1uf | R/W | ||
| Y5V | / | C1uf | R | |
| / | C1uf | R/W | ||
| 0805 | NPO | / | / | R/W |
| X7R/X5R/X7S/X6S | / | C4.7uf | R | |
| / | C4.7uf | R/W | ||
| Y5V | / | C1uf | R | |
| / | C1uf | R/W | ||
| 1206 | NPO | / | / | R/W |
| X7R/X5R/X7S/X6S | / | C10uf | R | |
| / | C10uf | R/W | ||
| Y5V | / | C10uf | R | |
| / | C10uf | R/W | ||
| 1210 | NPO | / | / | R |
| X7R/X5R/X7S/X6S | / | / | R | |
| Y5V | / | / | R |
Soldering method: RReflow Soldering, WWave Soldering
Soldering Temperature Profile
While in preheating, keep the temperature difference between soldering temperature and surface temperature of chips as: T150.
2509251626_AIDE-CAPACITOR-0805X7R221K251NT_C48579609.pdf
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