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Specifications
Voltage Rating:
500V
Capacitance:
2.2nF
Temperature Coefficient:
X7R
Tolerance:
±10%
Mfr. Part #:
0805X7R222K501NT
Model Number:
0805X7R222K501NT
Package:
0805
Key Attributes
Product Description
Product Overview
High-reliability Multi-Layer Ceramic Capacitors (MLCCs) designed for demanding high-voltage applications. These capacitors are essential components for coupling, wave filtering, and resonance in various high-voltage circuits, including switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight units, and energy-saving lamps. They offer robust performance and are built with advanced ceramic dielectric and electrode materials.
Product Attributes
- Material: Ceramic dielectric, Inner electrode, Outer electrode (Au/Ag-Ni-Sn terminal composition)
- Certifications: RoHS/REACH compliant
Technical Specifications
| Item | Description | Specification | ||
|---|---|---|---|---|
| Application Field | Coupling, wave filtering, resonant in high voltage circuits | |||
| Switch power supplier | ||||
| AC-DC power charger, DC-DC power charger | ||||
| Networking/Communication interface, LCD backlight unit power supplier, amperite of energy saving lamps | ||||
| Testing Conditions | Normal Condition | Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa | ||
| Relative Condition | Temperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa | |||
| Part Number Description | Dimension Code Examples | 0201, 0402, 0603, 0805, 1206, 1210, 1808, 1812, 1825, 2211, 2225 | ||
| Temperature Characteristic | C0G (030 PPM/), X7R (15%), X5R (15%) | |||
| Nominal Electrostatic Capacity | 8R08.0, 10010, 101100 (pF) | |||
| Tolerance of Electrostatic Capacity | B:0.1pF, C:0.25pF, D:0.5pF, F:1%, G: 2%, J:5%, K:10%, M:20%, Z:+80%/-20% | |||
| Rated Voltage (DC) | 25025, 251250, 2522500 (V) | |||
| Terminal Composition | Au/Ag-Ni-Sn (From the inside out) | |||
| Packing | T Tape/Reel, P Bag packing (PE) | |||
| Construction & Dimension | Construction Items | 1. Ceramic dielectric, 2. Inner electrode, 3. Outer electrode, 4. Nickle layer, 5. Tin layer | ||
| Dimensions (mm) | Part Number | L | W | T | WB | |||
| 0201 (0603) | 0.600.10 | 0.300.05 | 0.300.05 | 0.100.05 |
| 0402 (1005) | 1.000.15 | 0.500.15 | 0.500.10 | 0.200.10 |
| 0603 (1608) | 1.600.20 | 0.800.15 | 0.800.15 | 0.300.10 |
| 0805 (2012) | 2.000.20 | 1.250.20 | 0.800.20 | 0.500.20 |
| 1206 (3216) | 3.200.30 | 1.600.30 | 1.000.20 | 0.600.30 |
| 1210 (3225) | 3.200.30 | 2.500.30 | 2.70 | 0.800.30 |
| 1808 (4520) | 4.500.40 | 2.000.20 | 2.70 | 0.800.30 |
| 1812 (4532) | 4.500.40 | 3.200.30 | 3.50 | 0.800.30 |
| 1825 (4563) | 4.500.40 | 6.300.50 | 3.50 | 0.800.30 |
| 2220 (5750) | 5.700.50 | 5.000.50 | 3.50 | 1.000.40 |
| 2225 (5763) | 5.700.50 | 6.300.50 | 6.20 | 1.000.40 |
| Specification & Testing Method | Temperature | -55~+125 | ||
| Visual/Dimension | 1. No Damage, 2. Dimension meet Spec. Tested by Naked eye (Visual inspection) and Digital calliper. | |||
| Static Capacity | NPO: 1MHz10%, 1.00.2Vrms (1000pF); 1KHz10%, 1.00.2Vrms (>1000pF). X7R/X7T/X7P: 1KHz10%, 1.00.2Vrms (10uF); 120Hz24, 0.50.1Vrms (>10uF). | |||
| Dissipation Factor (DF) | NPO: DF0.56, Cr5 pF; DF1.5[(150/Cr)+7]10-4 (5pFCr50pF); DF0.15%, (50pFCr). Testing frequency 110%MHz, Voltage 1V0.2rms (Cr1000pF); 110%KHz, Voltage 1V0.2rms (Cr>1000pF). X7R/X7T/X7P: Cr10uF, 110%KHz, 1V0.1rms; Cr10uF, 12024Hz, 0.5V0.1rms. See Note 1 for exceptions. | |||
| IR Insulation Resistance | NPO: IR50000M, C10nF; IR*Cr500S, C10nF. X7R/X7T/X7P: IR10000M, C25nF; IR*Cr100S, C25nF. Testing condition: Rated voltage, 605s, Humidity:75%, Temperature:255, Current :50mA. | |||
| Hi-pot (DC) | No dielectric breakdown or damage. Ur=100V, 2.5 x rated voltage; Ur=200V/250V, 2.0 x rated voltage; Ur=450/500/630V, 1.5 x rated voltage; 1KVUr2KV, 1.2 x rated voltage; 2KVUr, 1.1 x rated voltage. Voltage Raising time: 110S, Voltage maintaining time: 2S. | |||
| Solderability | Soldering area90%. Visual-No damage. Pre-heating temperature 80-120, time 10-30s, lead free solder, flux. Soldering temperature 2455, Solder time 20.5s. | |||
| Resistance to the heat of soldering | Visual-No damage, soldering area90%. Pre-heating temperature 100-200, time 102 s, soldering temperature: 2655, Soldering time: 51s. Cleaning with solvent. Room temperature, time: 242 hours. | |||
| Electrostatic Capacity Change Rate | NPO: C/C0.5% or 0.5pF (larger reading). X7R: C/C15%. X7T: -33% C/C22%. X7P: C/C10%. | |||
| Flexural Strength | No damage. Base board: Al2O3 /PCB. PCB dimension: Thickness: 1.6mm, Length: 100mm, Width: 40mm. Flexural depth: 1mm. Bend speed: 0.5mm/sec. Electro static capacity change rate: C/C10%. | |||
| Terminal Bonding Strength | No visual damage. Applied Force: 5N, Duration: 101S. | |||
| Thermal Shock | NPO: C/C2.5% or 0.25pF (larger reading). X7R/X7P: C/C0.5%. X7T: C/C10%. 5 cycles. Test after 242hours normal temp & humidity. | |||
| Temperature Moisture Exposure | Visual: No visual damage. Capacity change rate: NPO: C/C2% or 1pF (larger reading); X7R/X7T/X7P: C/C10%. DF 2 times initial standard. IR: NPO: IR2500M or IR*Cr25S; X7R/X7T/X7P: IR1000M or IR*Cr25S. Test after 242hours normal temp & humidity (402, 90~95%RH, 50024 hours). | |||
| High Temperature Exposure | Visual: No visual damage. Capacity change rate: NPO: C/C2% or 1pF (larger reading); X7R/X7T/X7P: C/C20%. DF 2 X initial standard. IR: NPO: IR4000M or IR*Cr40S; X7R/X7T/X7P: IR2000M or IR*Cr50S. Test after 48hours under normal pressure & temperature (1253, 100048 hours, Voltage dependent on rating). | |||
| PCB Flexural Strength | No crack and other defect. IR tested. | |||
| Embossed Plastic Taping | Tape Size (0805) | A: 1.550.20, B: 2.350.20, C: 8.000.20, D: 3.500.05, E: 1.750.10, F: 4.000.10, G: 2.000.10, H: 4.000.10, J: 1.50 -0/+0.10, T: 1.50 Max | ||
| Tape Size (1206) | A: 1.950.20, B: 3.600.20, C: 8.000.20, D: 3.500.05, E: 1.750.10, F: 4.000.10, G: 2.000.10, H: 4.000.1, J: 1.50 -0/+0.10, T: 1.85 Max | |||
| Tape Size (1210) | A: 2.700.10, B: 3.420.10, C: 8.000.10, D: 3.500.05, E: 1.750.10, F: 4.000.10, G: 2.000.05, H: 4.000.10, J: 1.55 -0/+0.10, T: 3.2 Max | |||
| Tape Size (1808) | A: 2.200.10, B: 4.950.10, C: 12.000.10, D: 5.500.05, E: 1.750.10, F: 4.000.10, G: 2.000.05, H: 4.000.10, J: 1.50 -0/+0.10, T: 3.0 Max | |||
| Tape Size (1812) | A: 3.660.10, B: 4.950.10, C: 12.000.10, D: 5.500.05, E: 1.750.10, F: 8.000.10, G: 2.000.05, H: 4.000.10, J: 1.55 -0/+0.10, T: 4.0 Max | |||
| Paper Tape Reel Packing | Paper Tape Size (1005) | W1: 0.240.02, L1: 0.450.02, D: 8.000.10, C: 3.500.05, B: 1.750.10, P1: 2.000.05, P2: 2.000.05, P0: 4.000.10, d: 1.50 -0/+0.10, t: 0.30 Below | ||
| Paper Tape Size (0201) | W1: 0.370.10, L1: 0.670.10, D: 8.000.10, C: 3.500.05, B: 1.750.10, P1: 2.000.05, P2: 2.000.05, P0: 4.000.10, d: 1.50 -0/+0.10, t: 0.80 Below | |||
| Paper Tape Size (0402) | W1: 0.650.10, L1: 1.150.10, D: 8.000.10, C: 3.500.05, B: 1.750.10, P1: 2.000.05, P2: 2.000.05, P0: 4.000.10, d: 1.50 -0/+0.10, t: 0.80 Below | |||
| Paper Tape Size (0603) | A: 1.100.10, B: 1.900.10, C: 8.000.10, D: 3.500.05, E: 1.750.10, F: 4.000.10, G: 2.000.10, H: 4.000.10, J: 1.50 -0/+0.10, T: 1.10 Max | |||
| Paper Tape Size (0805) | A: 1.450.15, B: 2.300.15, C: 8.00.15, D: 3.500.05, E: 1.750.10, F: 4.000.10, G: 2.000.10, H: 4.000.10, J: 1.50 -0/+0.10, T: 1.10 Max | |||
| Paper Tape Size (1206) | A: 1.800.20, B: 3.400.20, C: 8.000.20, D: 3.500.05, E: 1.750.10, F: 4.000.10, G: 2.000.10, H: 4.000.10, J: 1.50 -0/+0.10, T: 1.10 Max | |||
| Reel Dimensions | 7' REEL: 1782.0, 3.0, 130.5, 210.5, 21 or Bigger, 1010.5, 12max. 13' REEL: 3302.0, 3.0, 130.5, 210.5, 21 or Bigger, 1010.5, 12max. | |||
| Top Tape Peeling Strength | Standard: 0.1N < peeling strength < 0.7N. No paper dirty remains on the scotch when peeling, and sticks to top and bottom tape. | |||
| Packing Quantity | Refer to table for Paper T/R and Plastic T/R quantities per size. | |||
| Soldering Method | RReflow Soldering, WWave Soldering. Refer to table for recommended methods by size, characteristics, rated voltage, and capacitance. | |||
| Soldering Temperature Profile | Keep temperature difference between soldering temperature and surface temperature of chips as T150 during preheating. | |||
2509251626_AIDE-CAPACITOR-0805X7R222K501NT_C48579615.pdf
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