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quality High Voltage Multi Layer Ceramic Capacitor for LCD Backlight Units AIDE CAPACITOR 0805X7R222K101NT Performance factory
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quality High Voltage Multi Layer Ceramic Capacitor for LCD Backlight Units AIDE CAPACITOR 0805X7R222K101NT Performance factory
>
Specifications
Voltage Rating:
100V
Capacitance:
2.2nF
Temperature Coefficient:
X7R
Tolerance:
±10%
Mfr. Part #:
0805X7R222K101NT
Model Number:
0805X7R222K101NT
Package:
0805
Key Attributes
Product Description

Product Overview

These Multi-Layer Ceramic Capacitors (MLCCs) are designed for high-voltage applications, including coupling, wave filtering, and resonance in switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamp ballasts. They are suitable for medium and high voltage MLCC requirements.

Product Attributes

  • Terminal Composition: Au/Ag-Ni-Sn (from the inside out)
  • Certifications: ROHS/REACH compliant

Technical Specifications

Item Description/Specification Details
Application Field Coupling, wave filtering, resonant in high voltage circuits, switch power supplies, AC-DC power chargers, DC-DC power chargers, networking/Communication interfaces, LCD backlight unit power supplies, amperites of energy saving lamps. (Medium and High voltage MLCC).
Testing Conditions Normal Condition Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa
Relative Condition Temperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa
Part Number Description Example: 1812 X7R 684 M 251 N T
Dimension Code Temperature Characteristic Nominal Electrostatic Capacity Tolerance of Electrostatic Capacity Rated Voltage (DC) Terminal Composition Packing
Dimension Codes Code L*W (inch) / L*W (mm)
0201 0.02*0.01 / 0.50*0.25
0402 0.04*0.02 / 1.00*0.50
0603 0.06*0.03 / 1.60*0.80
0805 0.08*0.05 / 2.00*1.25
1206 0.12*0.06 / 3.20*1.60
1210 0.12*0.10 / 3.20*2.50
1808 0.18*0.08 / 4.50*2.00
1812 0.18*0.12 / 4.50*3.20
1825 0.18*0.25 / 4.50*6.30
2211 0.22*0.11 / 5.70*2.8
2225 0.22*0.25 / 5.70*6.30
Temperature Characteristic C0G (030 PPM/), X7R (15%), X5R (15%)
Nominal Electrostatic Capacity 8R08.0, 10010, 101100 (pF)
Tolerance of Electrostatic Capacity B:0.1pF, C:0.25pF, D:0.5pF, F:1%, G: 2%, J:5%, K:10%, M:20%, Z:+80%/-20%
Rated Voltage (DC) 250 25V, 251 250V, 252 2500V
Construction 1. Ceramic dielectric, 2. Inner electrode, 3. Outer electrode, 4. Nickel layer, 5. Tin layer
Dimensions (mm) Part Number L L, W W, T T, WB WB
0201 (0603) 0.600.10, 0.300.05, 0.300.05, 0.100.05
0402 (1005) 1.000.15, 0.500.15, 0.500.10, 0.200.10
0603 (1608) 1.600.20, 0.800.15, 0.800.15, 0.300.10
0805 (2012) 2.000.20, 1.250.20, 0.800.20, 1.000.20
1206 (3216) 3.200.30, 1.600.30, 1.000.20, 1.250.20
1210 (3225) 3.200.30, 2.500.30, 2.70, 0.800.30
1808 (4520) 4.500.40, 2.000.20, 2.70, 0.800.30
1812 (4532) 4.500.40, 3.200.30, 3.50, 0.800.30
1825 (4563) 4.500.40, 6.300.50, 3.50, 0.800.30
2220 (5750) 5.700.50, 5.000.50, 3.50, 1.000.40
2225 (5763) 5.700.50, 6.300.50, 6.20, 1.000.40
Operating Temperature Range -55~+125
Static Capacity Testing NPO Characteristic 1000pF: 1MHz10%, 1.00.2Vrms
>1000pF: 1KHz10%, 1.00.2Vrms
X7R/X7T/X7P Characteristic 10uF: 1KHz10%, 1.00.2Vrms
>10uF: 120Hz24, 0.50.1Vrms
Dissipation Factor (DF) NPO Characteristic DF0.56, Cr5 pF
DF1.5[(150/Cr)+7]10-4 (5pFCr50pF)
DF0.15%, (50pFCr)
Cr1000pF: 1MHz10%, 1V0.2rms
Cr1000pF: 1KHz10%, 1V0.2rms
X7R/X7T/X7P Characteristic Cr10uF: 1KHz10%, 1V0.1rms.
Cr10uF: 120Hz24Hz, 0.5V0.1rms. (See Note 1 for DF exceptions)
Insulation Resistance (IR) NPO Characteristic IR50000M, C10nF
IR*C500S, C10nF
Testing Condition: Rated voltage, Time: 605s, Humidity: 75%, Temperature: 255, Current: 50mA
X7R/X7T/X7P Characteristic IR10000M, C25nF
IR*C100S, C25nF
Hi-pot (DC) No dielectric breakdown or damage
Ur=100V: 2.5 x rated voltage
Ur=200V/250V: 2.0 x rated voltage
Ur=450/500/630V: 1.5 x rated voltage
1KVUr2KV: 1.2 x rated voltage
2KVUr: 1.1 x rated voltage
Voltage Raising time: 110S, Voltage maintaining time: 2S
Solderability Soldering area90%, No Damage. Pre-heating: 80-120 (10-30s), Solder: Lead-free, Flux. Soldering Temp: 2455, Time: 20.5s.
Resistance to the heat of soldering No visual damage, soldering area90%. Pre-heating: 100-200 (102s), Soldering Temp: 2655 (51s). Cleaning with solvent. Room temp, 242 hours.
Electrostatic Capacity Change Rate NPO Characteristic C/C0.5% or 0.5pF (larger reading)
X7R C/C15%
X7T -33% C/C22%
X7P C/C10%
Flexural Strength No Damage. Base board: Al2O3 /PCB. PCB Dim: Thickness: 1.6mm, Length: 100mm, Width: 40mm. Flexural depth: 1mm, Bend speed: 0.5mm/sec. Electrostatic capacity change rate: C/C10% under flexural status.
Terminal Bonding Strength No visual damage. Applied Force: 5N, Duration: 101S.
Thermal Shock NPO Characteristic C/C2.5% or 0.25pF (larger reading)
X7R/X7P Characteristic C/C0.5%
X7T Characteristic C/C10%
Temperature Moisture Exposure Visual: No visual damage. Test after 242 hours normal temp & humidity. Temp: 402, Humidity: 90~95%RH, Time: 50024 hours.
Capacitance Change Rate: NPO: C/C2% or 1pF (larger reading); X7R/X7T/X7P: C/C10%.
DF: 2 times initial standard.
IR: NPO: IR2500M or IR*C25S (lower reading); X7R/X7T/X7P: IR1000M or IR*C25S (lower reading).
High Temperature Exposure Visual: No visual damage. Test after 48 hours under normal pressure & temperature.
Temp: 1253, Time: 100048 hours.
Voltage: 100VV250V (2x Rated voltage), 250VV1KV (1.5x rated voltage), 1KVV (1.2x rated voltage).
Capacitance Change Rate: NPO: C/C2% or 1pF (larger reading); X7R/X7T/X7P: C/C20%.
DF: 2 X initial standard.
IR: NPO: IR4000M or IR*C40S (lower reading); X7R/X7T/X7P: IR2000M or IR*C50S (lower reading).
PCB Flexural Strength No crack and other defect. IR measurement after soldering MLCC on PCB.
Embossed Plastic Taping Details for 0805 to 1812 types, including tape size and dimensions.
Paper Tape Reel Packing Details for 1005, 0201, 0402, 0603, 0805, 1206 types, including paper size and dimensions.
Reel Dimensions 7' REEL (1782.0), 13' REEL (3302.0)
Top Tape Peeling Strength Paper Taping: Standard values provided. Embossed Taping: 0.1N < peeling strength < 0.7N.
Packing Quantity Varies by size and tape type (e.g., 0603 Paper T/R: 4000 pcs, 0805 Plastic T/R: 3000 pcs).
Soldering Method Recommendation RReflow Soldering, WWave Soldering. Specific recommendations based on size, characteristics, voltage, and capacitance.
Soldering Temperature Profile Preheating: T150 temperature difference between soldering temperature and surface temperature of chips.

2509251626_AIDE-CAPACITOR-0805X7R222K101NT_C48579616.pdf

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