Product Overview
These Multi-Layer Ceramic Capacitors (MLCCs) are designed for high-voltage applications, including coupling, wave filtering, and resonance in switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamp ballasts. They are suitable for medium and high voltage MLCC requirements.
Product Attributes
- Terminal Composition: Au/Ag-Ni-Sn (from the inside out)
- Certifications: ROHS/REACH compliant
Technical Specifications
| Item | Description/Specification | Details |
|---|---|---|
| Application Field | Coupling, wave filtering, resonant in high voltage circuits, switch power supplies, AC-DC power chargers, DC-DC power chargers, networking/Communication interfaces, LCD backlight unit power supplies, amperites of energy saving lamps. (Medium and High voltage MLCC). | |
| Testing Conditions | Normal Condition | Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa |
| Relative Condition | Temperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa | |
| Part Number Description | Example: 1812 X7R 684 M 251 N T Dimension Code Temperature Characteristic Nominal Electrostatic Capacity Tolerance of Electrostatic Capacity Rated Voltage (DC) Terminal Composition Packing | |
| Dimension Codes | Code | L*W (inch) / L*W (mm) |
| 0201 | 0.02*0.01 / 0.50*0.25 | |
| 0402 | 0.04*0.02 / 1.00*0.50 | |
| 0603 | 0.06*0.03 / 1.60*0.80 | |
| 0805 | 0.08*0.05 / 2.00*1.25 | |
| 1206 | 0.12*0.06 / 3.20*1.60 | |
| 1210 | 0.12*0.10 / 3.20*2.50 | |
| 1808 | 0.18*0.08 / 4.50*2.00 | |
| 1812 | 0.18*0.12 / 4.50*3.20 | |
| 1825 | 0.18*0.25 / 4.50*6.30 | |
| 2211 | 0.22*0.11 / 5.70*2.8 | |
| 2225 | 0.22*0.25 / 5.70*6.30 | |
| Temperature Characteristic | C0G (030 PPM/), X7R (15%), X5R (15%) | |
| Nominal Electrostatic Capacity | 8R08.0, 10010, 101100 (pF) | |
| Tolerance of Electrostatic Capacity | B:0.1pF, C:0.25pF, D:0.5pF, F:1%, G: 2%, J:5%, K:10%, M:20%, Z:+80%/-20% | |
| Rated Voltage (DC) | 250 25V, 251 250V, 252 2500V | |
| Construction | 1. Ceramic dielectric, 2. Inner electrode, 3. Outer electrode, 4. Nickel layer, 5. Tin layer | |
| Dimensions (mm) | Part Number | L L, W W, T T, WB WB |
| 0201 (0603) | 0.600.10, 0.300.05, 0.300.05, 0.100.05 | |
| 0402 (1005) | 1.000.15, 0.500.15, 0.500.10, 0.200.10 | |
| 0603 (1608) | 1.600.20, 0.800.15, 0.800.15, 0.300.10 | |
| 0805 (2012) | 2.000.20, 1.250.20, 0.800.20, 1.000.20 | |
| 1206 (3216) | 3.200.30, 1.600.30, 1.000.20, 1.250.20 | |
| 1210 (3225) | 3.200.30, 2.500.30, 2.70, 0.800.30 | |
| 1808 (4520) | 4.500.40, 2.000.20, 2.70, 0.800.30 | |
| 1812 (4532) | 4.500.40, 3.200.30, 3.50, 0.800.30 | |
| 1825 (4563) | 4.500.40, 6.300.50, 3.50, 0.800.30 | |
| 2220 (5750) | 5.700.50, 5.000.50, 3.50, 1.000.40 | |
| 2225 (5763) | 5.700.50, 6.300.50, 6.20, 1.000.40 | |
| Operating Temperature Range | -55~+125 | |
| Static Capacity Testing | NPO Characteristic | 1000pF: 1MHz10%, 1.00.2Vrms >1000pF: 1KHz10%, 1.00.2Vrms |
| X7R/X7T/X7P Characteristic | 10uF: 1KHz10%, 1.00.2Vrms >10uF: 120Hz24, 0.50.1Vrms | |
| Dissipation Factor (DF) | NPO Characteristic | DF0.56, Cr5 pF DF1.5[(150/Cr)+7]10-4 (5pFCr50pF) DF0.15%, (50pFCr) Cr1000pF: 1MHz10%, 1V0.2rms Cr1000pF: 1KHz10%, 1V0.2rms |
| X7R/X7T/X7P Characteristic | Cr10uF: 1KHz10%, 1V0.1rms. Cr10uF: 120Hz24Hz, 0.5V0.1rms. (See Note 1 for DF exceptions) | |
| Insulation Resistance (IR) | NPO Characteristic | IR50000M, C10nF IR*C500S, C10nF Testing Condition: Rated voltage, Time: 605s, Humidity: 75%, Temperature: 255, Current: 50mA |
| X7R/X7T/X7P Characteristic | IR10000M, C25nF IR*C100S, C25nF | |
| Hi-pot (DC) | No dielectric breakdown or damage Ur=100V: 2.5 x rated voltage Ur=200V/250V: 2.0 x rated voltage Ur=450/500/630V: 1.5 x rated voltage 1KVUr2KV: 1.2 x rated voltage 2KVUr: 1.1 x rated voltage Voltage Raising time: 110S, Voltage maintaining time: 2S | |
| Solderability | Soldering area90%, No Damage. Pre-heating: 80-120 (10-30s), Solder: Lead-free, Flux. Soldering Temp: 2455, Time: 20.5s. | |
| Resistance to the heat of soldering | No visual damage, soldering area90%. Pre-heating: 100-200 (102s), Soldering Temp: 2655 (51s). Cleaning with solvent. Room temp, 242 hours. | |
| Electrostatic Capacity Change Rate | NPO Characteristic | C/C0.5% or 0.5pF (larger reading) |
| X7R | C/C15% | |
| X7T | -33% C/C22% | |
| X7P | C/C10% | |
| Flexural Strength | No Damage. Base board: Al2O3 /PCB. PCB Dim: Thickness: 1.6mm, Length: 100mm, Width: 40mm. Flexural depth: 1mm, Bend speed: 0.5mm/sec. Electrostatic capacity change rate: C/C10% under flexural status. | |
| Terminal Bonding Strength | No visual damage. Applied Force: 5N, Duration: 101S. | |
| Thermal Shock | NPO Characteristic | C/C2.5% or 0.25pF (larger reading) |
| X7R/X7P Characteristic | C/C0.5% | |
| X7T Characteristic | C/C10% | |
| Temperature Moisture Exposure | Visual: No visual damage. Test after 242 hours normal temp & humidity. Temp: 402, Humidity: 90~95%RH, Time: 50024 hours. Capacitance Change Rate: NPO: C/C2% or 1pF (larger reading); X7R/X7T/X7P: C/C10%. DF: 2 times initial standard. IR: NPO: IR2500M or IR*C25S (lower reading); X7R/X7T/X7P: IR1000M or IR*C25S (lower reading). | |
| High Temperature Exposure | Visual: No visual damage. Test after 48 hours under normal pressure & temperature. Temp: 1253, Time: 100048 hours. Voltage: 100VV250V (2x Rated voltage), 250VV1KV (1.5x rated voltage), 1KVV (1.2x rated voltage). Capacitance Change Rate: NPO: C/C2% or 1pF (larger reading); X7R/X7T/X7P: C/C20%. DF: 2 X initial standard. IR: NPO: IR4000M or IR*C40S (lower reading); X7R/X7T/X7P: IR2000M or IR*C50S (lower reading). | |
| PCB Flexural Strength | No crack and other defect. IR measurement after soldering MLCC on PCB. | |
| Embossed Plastic Taping | Details for 0805 to 1812 types, including tape size and dimensions. | |
| Paper Tape Reel Packing | Details for 1005, 0201, 0402, 0603, 0805, 1206 types, including paper size and dimensions. | |
| Reel Dimensions | 7' REEL (1782.0), 13' REEL (3302.0) | |
| Top Tape Peeling Strength | Paper Taping: Standard values provided. Embossed Taping: 0.1N < peeling strength < 0.7N. | |
| Packing Quantity | Varies by size and tape type (e.g., 0603 Paper T/R: 4000 pcs, 0805 Plastic T/R: 3000 pcs). | |
| Soldering Method Recommendation | RReflow Soldering, WWave Soldering. Specific recommendations based on size, characteristics, voltage, and capacitance. | |
| Soldering Temperature Profile | Preheating: T150 temperature difference between soldering temperature and surface temperature of chips. | |
2509251626_AIDE-CAPACITOR-0805X7R222K101NT_C48579616.pdf
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