Product Overview
This product is a Multi-Layer Ceramic Capacitor (MLCC) designed for high-voltage applications. It is suitable for coupling, wave filtering, and resonant functions in various power supply and energy-saving lamp circuits, including switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamps. The MLCCs are available in various sizes and temperature characteristics, offering reliable performance under specified testing conditions.
Product Attributes
- Material: Ceramic dielectric, Inner electrode, Outer electrode (Au/Ag-Ni-Sn terminal composition)
- Certifications: RoHS compliant, REACH compliant
Technical Specifications
| Item | Description | Specification/Requirement | Testing Method | ||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|
| 1 | Application Field | Coupling, wave filtering, resonant in high voltage circuits (switch power supplier, AC-DC power charger, DC-DC power charger, networking/Communication interface, LCD backlight unit power supplier, amperite of energy saving lamps, etc.) (Medium and High voltage MLCC) | - | ||||||||
| 2.1 | Testing Condition (Normal) | Temperature: 15~35; Humidity: 45~75%RH; Atmosphere: 86~106kPa | - | ||||||||
| 2.2 | Testing Condition (Relative) | Temperature: 252; Humidity: 60~70%RH; Atmosphere: 86~106kPa | - | ||||||||
| 3 | Part Number Description Example: 1812 X7R 684 M 251 N T | ||||||||||
| Dimension Code | 0201, 0402, 0603, 0805, 1206, 1210, 1808, 1812, 1825, 2211, 2225 | L*W (inch/mm) specified | |||||||||
| Temperature Characteristic | C0G (030 PPM/), X7R (15%), X5R (15%) | - | |||||||||
| Nominal Electrostatic Capacity | 8R08.0, 10010, 101100 (pF) | - | |||||||||
| Tolerance of Electrostatic Capacity | B:0.1pF, C:0.25pF, D:0.5pF, F:1%, G: 2%, J:5%, K:10%, M:20%, Z:+80%/-20% | - | |||||||||
| Rated Voltage (DC) | 250 (25V), 251 (250V), 252 (2500V) | - | |||||||||
| Packing | T (Tape/Reel), P (Bag packing) | - | |||||||||
| 4 | Construction and Dimension | ||||||||||
| Dimension (mm) | Part number | L | W | T | WB | ||||||
| - | 0201 (0603) | 0.600.10 | 0.300.05 | 0.300.05 | 0.100.05 | ||||||
| - | 0402 (1005) | 1.000.15 | 0.500.15 | 0.500.10 | 0.200.10 | ||||||
| - | 0603 (1608) | 1.600.20 | 0.800.15 | 0.800.15 | 0.300.10 | ||||||
| - | 0805 (2012) | 2.000.20 | 1.250.20 | 0.800.20 | 0.500.20 | ||||||
| - | 1206 (3216) | 3.200.30 | 1.600.30 | 1.000.20 | 0.600.30 | ||||||
| - | 1210 (3225) | 3.200.30 | 2.500.30 | 2.70 | 0.800.30 | ||||||
| - | 1808 (4520) | 4.500.40 | 2.000.20 | 2.70 | 0.800.30 | ||||||
| - | 1812 (4532) | 4.500.40 | 3.200.30 | 3.50 | 0.800.30 | ||||||
| - | 1825 (4563) | 4.500.40 | 6.300.50 | 3.50 | 0.800.30 | ||||||
| - | 2220 (5750) | 5.700.50 | 5.000.50 | 3.50 | 1.000.40 | ||||||
| - | 2225 (5763) | 5.700.50 | 6.300.50 | 6.20 | 1.000.40 | ||||||
| 5 | Specification and testing method | - | |||||||||
| - | Temperature | -55~+125 | - | ||||||||
| - | Visual/Dimension | 1. No Damage, 2. Dimension meet Spec | Naked eye (Visual inspection), Digital calliper | ||||||||
| - | Static Capacity | Meet standard specification and tolerance | As per NPO/X7R/X7T/X7P characteristic | ||||||||
| - | Dissipation Factor (DF) | NPO Characteristic: DF0.56, Cr5 pF; DF1.5[(150/Cr)+7]10-4 (5pFCr50pF); DF0.15%, (50pFCr) X7R/X7T/X7P characteristic: see Note 1 | As per specification | ||||||||
| - | IR Insulation Resistance | NPO Characteristic: IR50000M,C10nF; IR*Cr500S,C10nF X7R/X7T/X7P Characteristic: IR10000M,C25nF; IR*Cr100S,C25nF | Rated voltage, Time: 605s, Humidity: 75%, Temperature: 255, Current: 50mA | ||||||||
| - | Hi-pot (DC) | No dielectric breakdown or damage (Voltage varies based on rated voltage Ur) | Voltage Raising time: 110S, Voltage maintaining time: 2S | ||||||||
| - | Solderability | Soldering area90% | Pre-heating temperature 80-120, time 10-30s, lead free solder, flux; Soldering temperature 2455; Solder time 20.5s | ||||||||
| - | Resistance to the heat of soldering | No visual damage, soldering area90% | Pre-heating temperature 100-200, time 102 s, soldering temperature: 2655, Soldering time: 51s. Cleaning with solvent. Room temperature, time: 242 hours. | ||||||||
| - | Electrostatic capacity change rate | NPO: C/C0.5% or 0.5pF; X7R: C/C15%; X7T: -33% C/C22%; X7P: C/C10% | - | ||||||||
| - | Flexural strength | No damage; Electro static capacity change rate C/C10% | Base board: Al2O3 /PCB; PCB dimension: Thickness: 1.6mm, Length: 100mm, Width: 40mm, Flexural depth: 1mm, Bend speed: 0.5mm/sec. | ||||||||
| - | Terminal bonding strength | No visual damage | Applied Force: 5N, Duration: 101S | ||||||||
| - | Thermal shock | NPO: C/C2.5% or 0.25pF; X7R/X7P: C/C0.5%; X7T: C/C10% | 5 cycles, tested after 242 hours at normal temp & humidity | ||||||||
| - | Temperature moisture exposure | Visual: No visual damage; Capacitance change rate: NPO: C/C2% or 1pF; X7R/X7T/X7P: C/C10%; DF 2 times initial standard; IR: NPO: IR2500M or IR*Cr25S; X7R/X7T/X7P: IR1000M or IR*Cr25S | Temperature 402, Humidity 90~95%RH, time 50024 hours | ||||||||
| - | High temperature exposure | Visual: No visual damage; Capacitance change rate: NPO: C/C2% or 1pF; X7R/X7T/X7P: C/C20%; DF 2 X initial standard; IR: NPO: IR4000M or IR*Cr40S; X7R/X7T/X7P: IR2000M or IR*Cr50S | Temperature 1253, Time 100048 hours, Voltage varies based on rated voltage | ||||||||
| - | PCB flexural strength | No crack and other defect | IR measurement after soldering MLCC on PCB, pressing direction based on provided diagrams | ||||||||
| 6 | Embossed Plastic Taping Dimensions (mm) | - | |||||||||
| - | Code | Tape size A | B | C | D | E | F | G | H | J | T |
| - | 0805 | 1.55 0.20 | 2.35 0.20 | 8.00 0.20 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.10 | 1.50 -0/+0.10 | 1.50 Max |
| - | 1206 | 1.95 0.20 | 3.60 0.20 | 8.00 0.20 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.1 | 1.50 -0/+0.10 | 1.85 Max |
| - | 1210 | 2.70 0.10 | 3.42 0.10 | 8.00 0.10 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.05 | 4.00 0.10 | 1.55 -0/+0.10 | 3.2 Max |
| - | 1808 | 2.20 0.10 | 4.95 0.10 | 12.00 0.10 | 5.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.05 | 4.00 0.10 | 1.50 -0/+0.10 | 3.0 Max |
| - | 1812 | 3.66 0.10 | 4.95 0.10 | 12.00 0.10 | 5.50 0.05 | 1.75 0.10 | 8.00 0.10 | 2.00 0.05 | 4.00 0.10 | 1.55 -0/+0.10 | 4.0 Max |
| - | Paper Tape Reel Packing Dimensions (mm) | ||||||||||
| - | Code | Paper size W1 | L1 | D | C | B | P1 | P2 | P0 | d | t |
| - | 1005 | 0.240.02 | 0.450.02 | 8.000.10 | 3.500.05 | 1.750.10 | 2.000.05 | 2.000.05 | 4.000.10 | 1.50 -0/+0.10 | 0.30 Below |
| - | 0201 | 0.370.10 | 0.670.10 | 8.000.10 | 3.500.05 | 1.750.10 | 2.000.05 | 2.000.05 | 4.000.10 | 1.50 -0/+0.10 | 0.80 Below |
| - | 0402 | 0.650.10 | 1.150.10 | 8.000.10 | 3.500.05 | 1.750.10 | 2.000.05 | 2.000.05 | 4.000.10 | 1.50 -0/+0.10 | 0.80 Below |
| - | Code | Paper size A | B | C | D | E | F | G | H | J | T |
| - | 0603 | 1.10 0.10 | 1.90 0.10 | 8.00 0.10 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.10 | 1.50 -0/+0.10 | 1.10 Max |
| - | 0805 | 1.45 0.15 | 2.30 0.15 | 8.0 0.15 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.10 | 1.50 -0/+0.10 | 1.10 Max |
| - | 1206 | 1.80 0.20 | 3.40 0.20 | 8.00 0.20 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.10 | 1.50 -0/+0.10 | 1.10 Max |
| - | Reel Dimensions (unit: mm) | ||||||||||
| - | Unit | A | B | C | D | E | F | G | - | - | - |
| - | 7REEL | 1782.0 | 3.0 | 130.5 | 210.5 | 21 or Bigger | 1010.5 | 12max | - | - | - |
| - | 13REEL | 3302.0 | 3.0 | 130.5 | 210.5 | 21 or Bigger | 1010.5 | 12max | - | - | - |
| - | Top tape peeling strength | 0.1N < peeling strength < 0.7N | Standard | ||||||||
| - | Packing quantity | (Pcs) | Paper T/R | Plastic T/R | - | - | - | - | - | - | - |
| - | 0603 | 4000 | - | - | - | - | - | - | - | - | |
| - | 0805 | 4000 | 3000 (T1.35mm) | - | - | - | - | - | - | - | |
| - | 1206 | - | 3000 (T1.60mm) | 2000 (T1.85mm) | - | - | - | - | - | - | |
| - | 1210 | - | 2000 | 1000 | - | - | - | - | - | - | |
| - | 1812 | - | 800 | 500 | - | - | - | - | - | - | |
| 7.1 | RoHS | Meet the standard | - | ||||||||
| 7.2 | REACH | Meet the standard | - | ||||||||
Precautions For Use
MLCCs may fail short circuit or open circuit under severe electrical or mechanical stress beyond specified ratings. To prevent burnout, flaming, or glowing, adhere to safety precautions and application notes. Contact the engineering section or factory for handling questions.
- Soldering Profile: Follow the recommended temperature profile to avoid cracks due to sudden temperature changes.
- Manual Soldering: Exercise caution to prevent thermal cracks. Ensure proper soldering iron tip selection and temperature control.
- Optimum Solder Amount for Reflow Soldering
- Recommended Soldering amounts
Recommended Soldering Method
| Size | Temperature Characteristics | Rated Voltage | Capacitance | Soldering Method |
|---|---|---|---|---|
| 1005 | NPO | / | / | R |
| X7R/X5R/X7S/X6S | / | / | R | |
| 0201 | NPO | / | / | R |
| X7R/X5R/X7S/X6S | / | / | R | |
| Y5V | / | / | R | |
| 0402 | NPO | / | / | R |
| X7R/X5R/X7S/X6S | / | / | R | |
| Y5V | / | / | R | |
| 0603 | NPO | / | / | R/W |
| X7R/X5R/X7S/X6S | / | C1uf | R | |
| - | C1uf | R/W | ||
| Y5V | / | C1uf | R | |
| - | C1uf | R/W | ||
| 0805 | NPO | / | / | R/W |
| X7R/X5R/X7S/X6S | / | C4.7uf | R | |
| - | C4.7uf | R/W | ||
| Y5V | / | C1uf | R | |
| - | C1uf | R/W | ||
| 1206 | NPO | / | / | R/W |
| X7R/X5R/X7S/X6S | / | C10uf | R | |
| - | C10uf | R/W | ||
| Y5V | / | C10uf | R | |
| - | C10uf | R/W | ||
| 1210 | NPO | / | / | R |
| X7R/X5R/X7S/X6S | / | / | R | |
| Y5V | / | / | R |
Soldering method: RReflow Soldering, WWave Soldering
Soldering Temperature Profile
During preheating, maintain the temperature difference between soldering temperature and chip surface temperature as T150.
2509251626_AIDE-CAPACITOR-0805X7R331K500NT_C48579624.pdf
Please Use Our Online Inquiry Contact Form Below If You Have Any Questions, Our Team Will Get Back To You As Soon As Possible