<
>
Specifications
Voltage Rating:
500V
Capacitance:
330pF
Temperature Coefficient:
X7R
Tolerance:
±10%
Mfr. Part #:
0805X7R331K501NT
Model Number:
0805X7R331K501NT
Package:
0805
Key Attributes
Product Description
Product Overview
These Multi-Layer Ceramic Capacitors (MLCCs) are designed for high-voltage applications, including coupling, wave filtering, and resonant functions. They are suitable for use in switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamps. The MLCCs offer various temperature characteristics (C0G, X7R, X5R) and are available in a wide range of dimensions and electrical specifications to meet diverse industrial requirements.
Product Attributes
- Material: Ceramic dielectric, Inner electrode, Outer electrode, Nickel layer, Tin layer
- Terminal Composition: Au/Ag-Ni-Sn
- Certifications: ROHS/REACH compliance
Technical Specifications
| Item | Description | Specification/Requirement | Testing Method | ||
|---|---|---|---|---|---|
| Application Field | Coupling, wave filtering, resonant in high voltage circuits | ||||
| Switch power supplier, AC-DC power charger, DC-DC power charger, networking/Communication interface, LCD backlight unit power supplier, amperite of energy saving lamps, etc. (Medium and High voltage MLCC) | |||||
| Testing Condition | Normal condition | Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa | (No special requirements) | ||
| Relative condition | Temperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa | For any testing data that does not match testing specification | |||
| Part Number Description | Example: 1812 X7R 684 M 251 N T (Dimension Code, Temperature Characteristic, Nominal Capacity, Tolerance, Rated Voltage, Terminal Composition, Packing) | ||||
| Dimension Codes & Sizes | Code | L*W (inch) / L*W (mm) | |||
| 0201 | 0.02*0.01 / 0.50*0.25 | ||||
| 0402 | 0.04*0.02 / 1.00*0.50 | ||||
| 0603 | 0.06*0.03 / 1.60*0.80 | ||||
| 0805 | 0.08*0.05 / 2.00*1.25 | ||||
| 1206 | 0.12*0.06 / 3.20*1.60 | ||||
| 1210 | 0.12*0.10 / 3.20*2.50 | ||||
| 1808 | 0.18*0.08 / 4.50*2.00 | ||||
| 1812 | 0.18*0.12 / 4.50*3.20 | ||||
| 1825 | 0.18*0.25 / 4.50*6.30 | ||||
| 2211 | 0.22*0.11 / 5.70*2.8 | ||||
| 2225 | 0.22*0.25 / 5.70*6.30 | ||||
| Temperature Characteristic | C0G (030 PPM/), X7R (15%), X5R (15%) | ||||
| Nominal Electrostatic Capacity | 8R0=8.0pF, 100=10pF, 101=100pF | ||||
| Tolerance of Electrostatic Capacity | B:0.1pF, C:0.25pF, D:0.5pF, F:1%, G: 2%, J:5%, K:10%, M:20%, Z:+80%/-20% | ||||
| Rated Voltage (DC) | 250=25V, 251=250V, 252=2500V | ||||
| Construction | Ceramic dielectric, Inner electrode, Outer electrode, Nickel layer, Tin layer | ||||
| Dimensions (mm) | Part number | L | W | T | WB |
| 0201 (0603) | 0.600.10 | 0.300.05 | 0.300.05 | 0.100.05 | |
| 0402 (1005) | 1.000.15 | 0.500.15 | 0.500.10 | 0.200.10 | |
| 0603 (1608) | 1.600.20 | 0.800.15 | 0.800.15 | 0.300.10 | |
| 0805 (2012) | 2.000.20 | 1.250.20 | 0.800.20 | 0.500.20 | |
| 1206 (3216) | 3.200.30 | 1.600.30 | 1.000.20 | 0.600.30 | |
| 1210 (3225) | 3.200.30 | 2.500.30 | 2.70 | 0.800.30 | |
| 1808 (4520) | 4.500.40 | 2.000.20 | 2.70 | 0.800.30 | |
| 1812 (4532) | 4.500.40 | 3.200.30 | 3.50 | 0.800.30 | |
| 1825 (4563) | 4.500.40 | 6.300.50 | 3.50 | 0.800.30 | |
| 2220 (5750) | 5.700.50 | 5.000.50 | 3.50 | 1.000.40 | |
| 2225 (5763) | 5.700.50 | 6.300.50 | 6.20 | 1.000.40 | |
| Temperature Range | -55~+125 | ||||
| Static Capacity | NPO characteristic | 1000pF: 1MHz10%, 1.00.2Vrms; >1000pF: 1KHz10%, 1.00.2Vrms | |||
| X7R/X7T/X7P characteristic | 10uF: 1KHz10%, 1.00.2Vrms; >10uF: 120Hz24, 0.50.1Vrms | ||||
| Dissipation Factor (DF) | NPO Characteristic | DF0.56, Cr5 pF; DF1.5[(150/Cr)+7]10-4 (5pFCr50pF); DF0.15%, (50pFCr) | Cr1000pF, 110%MHz, 1V0.2rms; Cr1000pF, 110%KHz, 1V0.2rms | ||
| X7R/X7T/X7P characteristic | See Note 1 | Cr10uF, 110%KHz, 1V0.1rms; Cr10uF, 12024Hz, 0.5V0.1rms | |||
| Insulation Resistance (IR) | NPO Characteristic | IR50000M, C10nF; IR*Cr500S, C10nF | Rated voltage, 605s, Humidity:75%, Temperature:255, Current :50mA | ||
| X7R/X7T/X7P Characteristic | IR10000M, C25nF; IR*Cr100S, C25nF | ||||
| Hi-pot (DC) | No dielectric breakdown or damage. Ur=100V, 2.5 x rated voltage; Ur=200V/250V, 2.0 x rated voltage; Ur=450/500/630V, 1.5 x rated voltage; 1KVUr2KV, 1.2 x rated voltage; 2KVUr, 1.1 x rated voltage. Voltage Raising time: 110S, Voltage maintaining time: 2S | ||||
| Solderability | Soldering area90%, Visual-No damage. Pre-heating: 80-120, 10-30s; Solder: Lead-free, Flux; Soldering temp: 2455; Solder time: 20.5s | ||||
| Resistance to the heat of soldering | Visual-No damage, soldering area90%. Pre-heating: 100-200, 102s; Soldering temp: 2655; Soldering time: 51s. Cleaning with solvent. Room temperature, time: 242 hours. | ||||
| Electrostatic Capacity Change Rate | NPO Characteristic | C/C0.5% or 0.5pF (larger reading) | |||
| X7R | C/C15% | ||||
| X7T | -33% C/C22% | ||||
| X7P | C/C10% | ||||
| Flexural Strength | No damage. Base board: Al2O3 /PCB. PCB dimension: Thickness: 1.6mm, Length: 100mm, Width: 40mm. Flexural depth: 1mm. Bend speed: 0.5mm/sec. Electro static capacity change rate C/C10%. Flexural depth 452. | ||||
| Terminal Bonding Strength | No visual damage. Applied Force: 5N, Duration: 101S | ||||
| Thermal Shock | NPO Characteristic | C/C2.5% or 0.25pF (larger reading) | Pre-condition (X7R h characteristic): Upper limit temp 1hr, place 241 hrs, start testing. Run 5 cycles. Test after 242 hours normal temp & humidity. | ||
| X7R/X7P characteristic | C/C0.5% | ||||
| X7T characteristic | C/C10% | ||||
| Temperature Moisture Exposure | Visual | No visual damage | Test after 242 hours normal temp & humidity. Temperature: 402, Humidity: 90~95%RH, Time: 50024 hours. | ||
| Electrostatic capacitance change rate | NPO characteristic: C/C2% or 1pF (larger reading); X7R/X7T/X7P characteristic: C/C10% | ||||
| DF | 2 times initial standard | ||||
| IR | NPO characteristic: IR2500M or IR*Cr25S (Lower reading); X7R/X7T/X7P: IR1000M or IR*Cr25S (Lower reading) | ||||
| High Temperature Exposure | Visual | No visual damage | Test after 48 hours under normal pressure & temperature. Temperature: 1253, Time: 100048 hours. | ||
| Charging and discharging current | 50mA Max. | ||||
| Voltage | 100VV250V: 2x Rated voltage; 250VV1KV: 1.5x rated voltage; 1KVV: 1.2x rated voltage | ||||
| Electrostatic capacitance change rate | NPO: C/C2% or 1pF (larger reading); X7R/X7T/X7P: C/C20% | ||||
| DF | 2 X initial standard | ||||
| IR | NPO: IR4000M or IR*Cr40S (Lower reading); X7R/X7T/X7P: IR2000M or IR*Cr50S (Lower reading) | ||||
| PCB Flexural Strength | No crack and other defect. SIZE A B C: 0805(2012) 1.2 4 1.65; 1206(3216) 2.2 5 2; 1210(3225) 2.2 5 2.9; 1812(4532) 3.5 7 3.7; 2220(5750) 4.5 8 5.6 | IR Soldering the MLCC on the PCB, then pressing direction based on the photo. | |||
| Embossed Plastic Taping | Embossed tape reel packing for 0805(2012)~1812(4532) type. | ||||
| Paper Tape Reel Packing | For 1005(0402)~1206(3216) types. | ||||
| Reel Dimensions | 7' REEL: 1782.0, 3.0, 130.5, 210.5, 21 or Bigger, 1010.5, 12max. 13' REEL: 3302.0, 3.0, 130.5, 210.5, 21 or Bigger, 1010.5, 12max. | ||||
| Top Tape Peeling Strength | Paper Taping: 0.1N < peeling strength < 0.7N. Embossed Taping: No paper dirty remains on the scotch when peeling, and sticks to top and bottom tape. | ||||
| Packing Quantity | See table for Paper T/R and Plastic T/R quantities based on size and thickness. | ||||
| Soldering Method Recommendation | RReflow Soldering, WWave Soldering. Specific recommendations based on size, temperature characteristic, rated voltage, and capacitance. | ||||
| Soldering Temperature Profile | Preheating: keep temperature difference between soldering temperature and surface temperature of chips T150. | ||||
Precautions For Use
MLCCs may fail in short or open circuit modes under severe electrical or mechanical stress beyond specified ratings. To prevent failure modes like burn out, flaming, or glowing, adhere to the following precautions and application notes. For handling questions, contact the engineering section or factory.
- Soldering Profile: Follow the recommended temperature profile to avoid cracks due to sudden temperature changes.
- Manual Soldering: Exercise caution to prevent thermal cracks. Ensure the soldering iron tip is handled carefully, and pay attention to tip selection and temperature contact.
- Optimum Solder Amount for Reflow Soldering
- Recommended Soldering amounts
2509251626_AIDE-CAPACITOR-0805X7R331K501NT_C48579626.pdf
Request A Quote
Please Use Our Online Inquiry Contact Form Below If You Have Any Questions, Our Team Will Get Back To You As Soon As Possible
