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Specifications
Voltage Rating:
250V
Capacitance:
3.3nF
Temperature Coefficient:
X7R
Tolerance:
±10%
Mfr. Part #:
0805X7R332K251NT
Model Number:
0805X7R332K251NT
Package:
0805
Key Attributes
Product Description
Product Overview
These Multi-Layer Ceramic Capacitors (MLCCs) are designed for high-voltage applications, including coupling, wave filtering, and resonant functions in switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamps. They are suitable for medium and high voltage circuits, offering reliable performance under specified conditions.
Product Attributes
- Material: Ceramic dielectric, Inner electrode, Outer electrode, Nickle layer, Tin layer
- Terminal Composition: Au/Ag-Ni-Sn (From the inside out)
- Certifications: RoHS compliant, REACH compliant
Technical Specifications
| Item | Description | Specification/Requirement | Testing Method |
|---|---|---|---|
| Application Field | Coupling, wave filtering, resonant in high voltage circuits | ||
| Switch power supplier, AC-DC power charger, DC-DC power charger, networking/Communication interface, LCD backlight unit power supplier, amperite of energy saving lamps, etc. (Medium and High voltage MLCC) | |||
| Testing Condition: Normal (15~35, 45~75%RH, 86~106kPa) | |||
| Part Number Description | Dimension Code | 0201, 0402, 0603, 0805, 1206, 1210, 1808, 1812, 1825, 2211, 2225 | (See Page 1 for L*W in inch/mm) |
| Temperature Characteristic | C0G (030 PPM/), X7R (15%), X5R (15%) | - | |
| Nominal Electrostatic Capacity | 8R08.0, 10010, 101100 (pF) | - | |
| Tolerance of Electrostatic Capacity | B:0.1pF, C:0.25pF, D:0.5pF, F:1%, G: 2%, J:5%, K:10%, M:20%, Z:+80%/-20% | ||
| Rated Voltage (DC) | 250 (25V), 251 (250V), 252 (2500V) | ||
| Packing | T Tape/Reel, P Bag packing (PE) | ||
| Construction and Dimension | Construction | 1. Ceramic dielectric, 2. Inner electrode, 3. Outer electrode, 4. Nickle layer, 5. Tin layer | - |
| Dimension (mm) | Part number, British system, Metric system, L, W, T, WB | (See Page 2 for detailed dimensions) | |
| Temperature | -55~+125 | - | |
| Visual/Dimension | 1. No Damage, 2. Dimension meet Spec | Naked eye (Visual inspection), Digital caliper | |
| Static Capacity | Meet standard specification and tolerance | (See Page 3 for NPO, X7R/X7T/X7P characteristics) | |
| Dissipation Factor (DF) | (See Page 3 for NNPO and X7R/X7T/X7P characteristics) | - | |
| IR Insulation Resistance | (See Page 3 for NPO and X7R/X7T/X7P characteristics) | Rated voltage, Time:605s, Humidity:75%, Temperature:255, Current :50mA | |
| Hi-pot (DC) | No dielectric breakdown or damage | (See Page 3 for voltage ratings and test conditions) | |
| Solderability | Soldering area90% | Pre-heating temperature 80-120, time 10-30s, lead free solder, flux. Soldering temperature 2455, Solder time 20.5s. | |
| Resistance to the heat of soldering | No damage, soldering area90% | Pre-heating temperature 100-200, time 102 s, soldering temperature :2655, Soldering time:51s. Cleaning with solvent. Room temperature, time :242 hours. | |
| Electrostatic Capacity Change Rate | (See Page 5 for NPO, X7R, X7T, X7P characteristics) | - | |
| Flexural Strength | Visual | No damage | Base boardAl2O3 /PCB, PCB dimension: Thickness: 1.6mm, Length: 100mm, Width: 40mm, Flexural depth: 1mm, Bend speed: 0.5mm/sec. |
| Electro Static Capacity Change Rate | C/C10% | Test it under the flexural status. | |
| Flexural Deepth | 452 | - | |
| Terminal Bonding Strength | No visual damage | Applied Force: 5N, Duration: 101S | |
| Thermal Shock | NPO Characteristic | C/C2.5% or 0.25pF (larger reading) | Pre-condition(X7R h characteristic):Upper limit temperature 1hour, place 241 hours, start to testing. Run 5 cycles Thermal shock. Test it after place 242 hours normal temp & humidity |
| X7R/X7P Characteristic | C/C0.5% | - | |
| X7T Characteristic | C/C10% | - | |
| DF | Refer to NO#4 | - | |
| Temperature Moisture Exposure | Visual | No visual damage | Test it after place 242 hours normal temp & humidity |
| Temperature | 402 | Humidity 90~95%RH, time 500+24 hours | |
| Electrostatic Capacitance Change Rate | NPO: C/C2% or 1pF (larger reading); X7R/X7T/X7P: C/C10% | - | |
| DF | 2 times initial standard | - | |
| IR | NPO: IR2500M or IR*Cr25S (Lower reading); X7R/X7T/X7P: IR1000M or IR*Cr25S (Lower reading) | - | |
| High Temperature Exposure | Visual | No visual damage | Test it after place 48 hours under normal pressure & temperature |
| Temperature | 1253 | Time 100048 hours | |
| Voltage | 100VV250V (2x Rated voltage), 250VV1KV (1.5x rated voltage), 1KVV (1.2x rated voltage) | Charging and discharging current 50mA Max. | |
| Electrostatic Capacitance Change Rate | NPO: C/C2% or 1pF (larger reading); X7R/X7T/X7P: C/C20% | - | |
| IR | NPO: IR4000M or IR*Cr40S (Lower reading); X7R/X7T/X7P: IR2000M or IR*Cr50S (Lower reading) | DF 2 X initial standard | |
| PCB Flexural Strength | No crack and other defect | IR Soldering the MLCC on the PCB. Pressing direction based on diagram. (See Page 7 for SIZE A, B, C dimensions for 0805 to 2220) | |
| Embossed Plastic Taping | (See Page 8 for Tapesize A, B, C, D, E, F, G, H, J, T dimensions for 0805 to 1812) | - | |
| Paper Tape Reel Packing | (See Page 9 for Papersize W1, L1, D, C, B, P1, P2, P0, d, t dimensions for 1005, 0201, 0402, 0603, 0805, 1206) | - | |
| Reel Dimensions | (See Page 10 for 7REEL and 13REEL dimensions) | - | |
| Taping Specification | Top tape peeling strength: 0.1N < peeling strength < 0.7N | No paper dirty remains on the scotch when peeling, and sticks to top and bottom tape. | |
| Packing Quantity | (See Page 11 for Paper T/R and Plastic T/R quantities by size) | - | |
| Soldering Method | RReflow Soldering, WWave Soldering | (See Page 13 for recommended methods by size, characteristics, voltage, capacitance) | |
| Soldering Temperature Profile | T150 (temperature difference between soldering temperature and surface temperature of chips) | (See Page 14 for details) | |
2509251626_AIDE-CAPACITOR-0805X7R332K251NT_C48579627.pdf
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