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Specifications
Voltage Rating:
50V
Capacitance:
33nF
Temperature Coefficient:
X7R
Tolerance:
±10%
Mfr. Part #:
0805X7R333K500NT
Model Number:
0805X7R333K500NT
Package:
0805
Key Attributes
Product Description
Product Overview
This product is a Multi-Layer Ceramic Capacitor (MLCC) designed for high-voltage applications. It is suitable for coupling, wave filtering, and resonant functions in various power supply and electronic circuits, including switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight units, and energy-saving lamps. The MLCCs are available in various sizes and temperature characteristics, offering reliable performance under specified conditions.
Product Attributes
- Terminal Composition: Au/Ag-Ni-Sn (From the inside out)
- Compliance: ROHS/REACH compliant
Technical Specifications
| Item | Description | Specification/Requirement | Testing Method | |||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Application Field | Coupling, wave filtering, resonant in high voltage circuits, switch power supplier, AC-DC power charger, DC-DC power charger, networking/Communication interface, LCD backlight unit power supplier, amperite of energy saving lamps, etc. (Medium and High voltage MLCC). | |||||||||||
| Testing Conditions | ||||||||||||
| Normal Condition | Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa | - | ||||||||||
| Relative Condition | Temperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa | - | ||||||||||
| Part Number Description | Item | Description | Example | |||||||||
| 1. Dimension Code | 0201, 0402, 0603, 0805, 1206, 1210, 1808, 1812, 1825, 2211, 2225 | 1812 | ||||||||||
| 2. Temperature Characteristic | C0G (030 PPM/), X7R (15%), X5R (15%) | X7R | ||||||||||
| 3. Nominal Electrostatic Capacity | 8R08.0, 10010, 101100 (pF) | 684 | ||||||||||
| 4. Tolerance of Electrostatic Capacity | B:0.1pF, C:0.25pF, D:0.5pF, F:1%, G: 2%, J:5%, K:10%, M:20%, Z:+80%/-20% | M | ||||||||||
| 5. Rated Voltage (DC) | 25025, 251250, 2522500 (V) | 251 | ||||||||||
| 6. Terminal Composition | Au/Ag-Ni-Sn (From the inside out) | - | ||||||||||
| 7. Packing | T Tape/Reel, P Bag packing(PE) | T | ||||||||||
| Construction | 1. Ceramic dielectric | - | - | |||||||||
| 2. Inner electrode | - | - | ||||||||||
| 3. Outer electrode | - | - | ||||||||||
| 4. Nickle layer | - | - | ||||||||||
| 5. Tin layer | - | - | ||||||||||
| Dimension | Part number | Dimension (mm) - British system | Dimension (mm) - Metric system | |||||||||
| 0201 | L*W (inch): 0.02*0.01 | L*W (mm): 0.50*0.25 | ||||||||||
| 0402 | L*W (inch): 0.04*0.02 | L*W (mm): 1.00*0.50 | ||||||||||
| 0603 | L*W (inch): 0.06*0.03 | L*W (mm): 1.60*0.80 | ||||||||||
| 0805 | L*W (inch): 0.08*0.05 | L*W (mm): 2.00*1.25 | ||||||||||
| 1206 | L*W (inch): 0.12*0.06 | L*W (mm): 3.20*1.60 | ||||||||||
| 1210 | L*W (inch): 0.12*0.10 | L*W (mm): 3.20*2.50 | ||||||||||
| 1808 | L*W (inch): 0.18*0.08 | L*W (mm): 4.50*2.00 | ||||||||||
| 1812 | L*W (inch): 0.18*0.12 | L*W (mm): 4.50*3.20 | ||||||||||
| 1825 | L*W (inch): 0.18*0.25 | L*W (mm): 4.50*6.30 | ||||||||||
| 2211 | L*W (inch): 0.22*0.11 | L*W (mm): 5.70*2.8 | ||||||||||
| 2225 | L*W (inch): 0.22*0.25 | L*W (mm): 5.70*6.30 | ||||||||||
| Detailed Dimensions (mm) | Part number | L | W | T | WB | |||||||
| 0201 (0603) | 0.600.10 | 0.300.05 | 0.300.05 | 0.100.05 | ||||||||
| 0402 (1005) | 1.000.15 | 0.500.15 | 0.500.10 | 0.200.10 | ||||||||
| 0603 (1608) | 1.600.20 | 0.800.15 | 0.800.15 | 0.300.10 | ||||||||
| 0805 (2012) | 2.000.20 | 1.250.20 | 0.800.20 | 0.500.20 | ||||||||
| 1206 (3216) | 3.200.30 | 1.600.30 | 1.000.20 | 0.600.30 | ||||||||
| 1210 (3225) | 3.200.30 | 2.500.30 | 2.70 | 0.800.30 | ||||||||
| 1808 (4520) | 4.500.40 | 2.000.20 | 2.70 | 0.800.30 | ||||||||
| 1812 (4532) | 4.500.40 | 3.200.30 | 3.50 | 0.800.30 | ||||||||
| 1825 (4563) | 4.500.40 | 6.300.50 | 3.50 | 0.800.30 | ||||||||
| 2220 (5750) | 5.700.50 | 5.000.50 | 3.50 | 1.000.40 | ||||||||
| 2225 (5763) | 5.700.50 | 6.300.50 | 6.20 | 1.000.40 | ||||||||
| Specification and Testing Method | Temperature | -55~+125 | - | |||||||||
| Visual/Dimension | 1. No Damage, 2. Dimension meet Spec | Naked eye (Visual inspection), Digital calliper | ||||||||||
| Static Capacity | Meet standard specification and tolerance | NPO characteristic: 1MHz10%, 1.00.2Vrms (1000pF); 1KHz10%, 1.00.2Vrms (>1000 pF) X7R/X7T/X7P characteristic: 1KHz10%, 1.00.2Vrms (10uF); 120Hz24, 0.50.1Vrms (>10uF) | ||||||||||
| Dissipation Factor (DF) | NPO Characteristic: DF0.56, Cr5 pF; DF1.5[(150/Cr)+7]10-4 (5pFCr50pF); DF0.15%, (50pFCr) X7R/X7T/X7P characteristic: See Note 1 | NPO: 110%MHz, 1V0.2rms (Cr1000pF); 110%KHz, 1V0.2rms (Cr1000pF) X7R/X7T/X7P: 110%KHz, 1V0.1rms (Cr10uF); 12024Hz, 0.5V0.1rms (Cr10uF) | ||||||||||
| IR Insulation Resistance | NPO Characteristic: IR50000M, C10nF; IR*Cr500S, C10nF X7R/X7T/X7P Characteristic: IR10000M, C25nF; IR*Cr100S, C25nF | Rated voltage, Time: 605s, Humidity: 75%, Temperature: 255, Current: 50mA | ||||||||||
| Hi-pot (DC) | No dielectric breakdown or damage | Ur=100V, 2.5 x rated voltage; Ur=200V/250V, 2.0 x rated voltage; Ur=450/500/630V, 1.5 x rated voltage; 1KVUr2KV, 1.2 x rated voltage; 2KVUr, 1.1 x rated voltage. Voltage Raising time: 110S, Voltage maintaining time: 2S | ||||||||||
| Solderability | Soldering area90% | Pre-heating temperature 80-120, time 10-30s, lead free solder, flux. Soldering temperature 2455, Solder time 20.5s. | ||||||||||
| Resistance to the heat of soldering | No visual damage, soldering area90% | Pre-heating temperature 100-200, time 102 s, soldering temperature :2655, Soldering time:51s. Cleaning with solvent. Room temperature, time :242 hours. | ||||||||||
| Electrostatic capacity change rate | NPO Characteristic: C/C0.5% or 0.5pF; X7R :C/C15%; X7T -33% C/C22%; X7PC/C10% | - | ||||||||||
| Flexural strength | No damage | Base board: Al2O3 /PCB. PCB dimension: Thickness: 1.6mm, Length: 100mm, Width: 40mm. Flexural depth: 1mm, Bend speed: 0.5mm/sec. Test it under the flexural status. Electro static capacity change rate C/C10% | ||||||||||
| Terminal bonding strength | No visual damage | Applied Force: 5N, Duration: 101S | ||||||||||
| Thermal shock | NPO Characteristic; C/C2.5% or 0.25pF; X7R/X7P- characteristic: C/C0.5%; X7T characteristicC/C10% | Pre-condition(X7R h characteristic):Upper limit temperature 1hour, place 241 hours, start to testing. Run 5 cycles Thermal shock. Test it after place 242 hours normal temp & humidity | ||||||||||
| Temperature moisture exposure | Visual: No visual damage. Electrostatic capacitance change rate: NPO characteristic: C/C2% or 1pF; X7R/X7T/X7P characteristic: C/C10%. DF 2 times initial standard. IR: NPO characteristic: IR2500M or IR*Cr25S; X7R/X7T/X7P: IR1000M or IR*Cr25S. | Temperature 402, Humidity 90~95%RH, time 500+24 hours. Test it after place 242 hours normal temp & humidity. | ||||||||||
| High temperature exposure | Visual: No visual damage. Electrostatic capacitance change rate: NPO : C/C2% or 1pF; X7R/X7T/X7P: C/C20%. DF 2 X initial standard. IR: NPO : IR4000M or IR*Cr40S; X7R/X7T/X7P : IR2000M or IR*Cr50S. | Temperature 1253, Time 100048 hours. Voltage: 100VV250V 2x Rated voltage; 250VV1KV 1.5x rated voltage; 1KVV 1.2x rated voltage. Test it after place 48 hours under normal pressure & temperature. | ||||||||||
| PCB flexural strength | No crack and other defect | IR Soldering the MLCC on the PCB, Then pressing direction base on the photo. SIZE A B C: 0805(2012) 1.2 4 1.65; 1206(3216) 2.2 5 2; 1210(3225) 2.2 5 2.9; 1812(4532) 3.5 7 3.7; 2220(5750) 4.5 8 5.6 | ||||||||||
| Embossed Plastic Taping | Type | Tape size (mm) | A | B | C | D | E | F | G | H | J | T |
| 0805 | 1.55 0.20 | 2.35 0.20 | 8.00 0.20 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.10 | 1.50 -0/+0.10 | 1.50 Max | ||
| 1206 | 1.95 0.20 | 3.60 0.20 | 8.00 0.20 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.1 | 1.50 -0/+0.10 | 1.85 Max | ||
| 1210 | 2.70 0.10 | 3.42 0.10 | 8.00 0.10 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.05 | 4.00 0.10 | 1.55 -0/+0.10 | 3.2 Max | ||
| 1808 | 2.20 0.10 | 4.95 0.10 | 12.00 0.10 | 5.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.05 | 4.00 0.10 | 1.50 -0/+0.10 | 3.0 Max | ||
| 1812 | 3.66 0.10 | 4.95 0.10 | 12.00 0.10 | 5.50 0.05 | 1.75 0.10 | 8.00 0.10 | 2.00 0.05 | 4.00 0.10 | 1.55 -0/+0.10 | 4.0 Max | ||
| Paper Tape Reel Packing | Code | Paper size (mm) | W1 | L1 | D | C | B | P1 | P2 | P0 | d | t |
| 1005 | 0.24 0.02 | 0.45 0.02 | 8.00 0.10 | 3.50 0.05 | 1.75 0.10 | 2.00 0.05 | 2.00 0.05 | 4.00 0.10 | 1.50 -0/+0.10 | 0.30 Below | ||
| 0201 | 0.37 0.10 | 0.67 0.10 | 8.00 0.10 | 3.50 0.05 | 1.75 0.10 | 2.00 0.05 | 2.00 0.05 | 4.00 0.10 | 1.50 -0/+0.10 | 0.80 Below | ||
| 0402 | 0.65 0.10 | 1.15 0.10 | 8.00 0.10 | 3.50 0.05 | 1.75 0.10 | 2.00 0.05 | 2.00 0.05 | 4.00 0.10 | 1.50 -0/+0.10 | 0.80 Below | ||
| 0603 | 1.10 0.10 | 1.90 0.10 | 8.00 0.10 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.10 | 1.50 -0/+0.10 | 1.10 Max | ||
| 0805 | 1.45 0.15 | 2.30 0.15 | 8.0 0.15 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.10 | 1.50 -0/+0.10 | 1.10 Max | ||
| 1206 | 1.80 0.20 | 3.40 0.20 | 8.00 0.20 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.10 | 1.50 -0/+0.10 | 1.10 Max | ||
| Reel Dimensions | Type | A | B | C | D | E | F | G | - | - | - | |
| 7REEL | 1782.0 | 3.0 | 130.5 | 210.5 | 21 or Bigger | 1010.5 | 12max | - | - | - | ||
| 13REEL | 3302.0 | 3.0 | 130.5 | 210.5 | 21 or Bigger | 1010.5 | 12max | - | - | - | ||
| Top tape peeling strength | Standard: 0.1N < peeling strength < 0.7N. No paper dirty remains on the scotch when peeling, and sticks to top and bottom tape. | - | ||||||||||
| Packing quantity | Dimension | Paper T/R (Pcs) | Plastic T/R (Pcs) | - | - | - | - | - | - | - | - | |
| 0603 | 4000 | - | - | - | - | - | - | - | - | |||
| 0805 | 4000 | 3000 (T1.35mm) | 3000 (T>1.35mm) | - | - | - | - | - | - | |||
| 1206 | - | 2000 (T1.60mm) | 3000 (T>1.60mm) | - | - | - | - | - | - | |||
| 1210 | - | 2000 | 1000 (T1.85mm) | - | - | - | - | - | - | |||
| 1812 | - | 800 | 500 (T1.85mm) | - | - | - | - | - | - | |||
| 1812 | - | - | - | - | - | - | - | - | - | |||
| Precautions For Use | The Multi-layer Ceramic Capacitors (MLCC) may fail in a short circuit modern in an open circuit mode when subjected to severe conditions of electrical environment and / or mechanical stress beyond the specified rating and specified conditions in the specification, which will result in burn out, flaming or glowing in the worst case. Following precautions for safety and Application Notes shall be taken in your major consideration. If you have a question about the precautions for handling, please contact our engineering section or factory. | |||||||||||
| 1. Soldering Profile To avoid the crack problem by sudden temperature change, follow the temperature profile in the adjacent graph (refer to the graph in the enclosure page). | ||||||||||||
| 2. Manual Soldering Manual soldering can pose a great risk of creating thermal cracks in capacitors. The hot soldering iron tip comes into direct contact with the end terminations, and operators careless may cause the tip of the soldering iron to come into direct contact with the ceramic body of the capacitor. Therefore the soldering iron must be handled carefully, and pay much attention to the selection of the soldering iron tip and temperature contact of the tip. | ||||||||||||
| 3. Optimum Solder Amount for Reflow Soldering | ||||||||||||
| 4. Recommended Soldering amounts | ||||||||||||
| Recommended Soldering Method | Size | Temperature Characteristics | Rated Voltage | Capacitance | Soldering Method | - | - | - | - | - | - | |
| 1005 | NPO | / | / | R | - | - | - | - | - | - | ||
| X7R/X5R/X7S/X6S | / | / | R | - | - | - | - | - | - | |||
| 0201 | NPO | / | / | R | - | - | - | - | - | - | ||
| X7R/X5R/X7S/X6S | / | / | R | - | - | - | - | - | - | |||
| Y5V | / | / | R | - | - | - | - | - | - | |||
| 0402 | NPO | / | / | R | - | - | - | - | - | - | ||
| X7R/X5R/X7S/X6S | / | / | R | - | - | - | - | - | - | |||
| Y5V | / | / | R | - | - | - | - | - | - | |||
| 0603 | NPO | / | / | R/W | - | - | - | - | - | - | ||
| X7R/X5R/X7S/X6S | / | C1uf | R | C1uf | R/W | - | - | - | - | - | ||
| Y5V | / | C1uf | R | C1uf | R/W | - | - | - | - | - | ||
| 0805 | NPO | / | / | R/W | - | - | - | - | - | - | ||
| X7R/X5R/X7S/X6S | / | C4.7uf | R | C4.7uf | R/W | - | - | - | - | - | ||
| Y5V | / | C1uf | R | C1uf | R/W | - | - | - | - | - | ||
| 1206 | NPO | / | / | R/W | - | - | - | - | - | - | ||
| X7R/X5R/X7S/X6S | / | C10uf | R | C10uf | R/W | - | - | - | - | - | ||
| Y5V | / | C10uf | R | C10uf | R/W | - | - | - | - | - | ||
| 1210 | NPO | / | / | R | - | - | - | - | - | - | ||
| X7R/X5R/X7S/X6S | / | / | R | - | - | - | - | - | - | |||
| Y5V | / | / | R | - | - | - | - | - | - | |||
| The temperature profile for soldering | While in preheating, please keep the temperature difference between soldering temperature and surface temperature of chips as: T150. | |||||||||||
2509251626_AIDE-CAPACITOR-0805X7R333K500NT_C48579629.pdf
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