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Specifications
Voltage Rating:
50V
Capacitance:
330nF
Temperature Coefficient:
X7R
Tolerance:
±10%
Mfr. Part #:
0805X7R334K500NT
Model Number:
0805X7R334K500NT
Package:
0805
Key Attributes
Product Description
Product Overview
These Multi-Layer Ceramic Capacitors (MLCCs) are designed for high-voltage applications, serving critical roles in coupling, wave filtering, and resonance within power supplies and communication interfaces. They are suitable for switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamps. Available in various sizes and temperature characteristics (C0G, X7R, X5R), these MLCCs offer reliable performance under specified conditions.
Product Attributes
- Certifications: RoHS compliant, REACH compliant
Technical Specifications
| Item | Description | Specification/Requirement | Testing Method | |||||||
|---|---|---|---|---|---|---|---|---|---|---|
| Application Field | ||||||||||
| Coupling, wave filtering, resonant in high voltage circuits, switch power supplier, AC-DC power charger, DC-DC power charger, networking/Communication interface, LCD backlight unit power supplier, amperite of energy saving lamps (Medium and High voltage MLCC). | ||||||||||
| Testing Conditions | ||||||||||
| Normal Condition | Temperature | 15~35 | (No special requirements) | |||||||
| Humidity | 45~75%RH | |||||||||
| Normal atmosphere | 86~106kPa | |||||||||
| Relative Condition | Temperature | 252 | For data not matching testing specification | |||||||
| Humidity | 60~70%RH | |||||||||
| Atmosphere | 86~106kPa | |||||||||
| Part Number Description Example: 1812 X7R 684 M 251 N T | ||||||||||
| Dimension Code | Examples | 0201, 0402, 0603, 0805, 1206, 1210, 1808, 1812, 1825, 2211, 2225 | (See Page 1 for L*W in inch/mm) | |||||||
| Temperature Characteristic | C0G | 030 PPM/ | ||||||||
| X7R | 15% | |||||||||
| X5R | 15% | |||||||||
| Nominal Electrostatic Capacity | 8R0 | 8.0 (pF) | ||||||||
| 100 | 10 (pF) | |||||||||
| 101 | 100 (pF) | |||||||||
| Tolerance of Electrostatic Capacity | B | 0.1pF | ||||||||
| C | 0.25pF | |||||||||
| D | 0.5pF | |||||||||
| F | 1% | |||||||||
| G | 2% | |||||||||
| J | 5% | |||||||||
| K | 10% | |||||||||
| M | 20% | |||||||||
| Z | +80%/-20% | |||||||||
| Rated Voltage (DC) | 250 | 25V | ||||||||
| 251 | 250V | |||||||||
| 252 | 2500V | |||||||||
| Terminal Composition | Au/Ag-Ni-Sn (From the inside out) | |||||||||
| Packing | T: Tape/Reel, P: Bag packing (PE) | |||||||||
| Construction | ||||||||||
| Item | Description | |||||||||
| 1 | Ceramic dielectric | |||||||||
| 2 | Inner electrode | |||||||||
| 3 | Outer electrode | |||||||||
| 4 | Nickle layer | |||||||||
| 5 | Tin layer | |||||||||
| Dimension (mm) | ||||||||||
| Part Number | L | W | T | |||||||
| 0201 (0603) | 0.600.10 | 0.300.05 | 0.300.05 | |||||||
| 0402 (1005) | 1.000.15 | 0.500.15 | 0.500.10 | |||||||
| 0603 (1608) | 1.600.20 | 0.800.15 | 0.800.15 | |||||||
| 0805 (2012) | 2.000.20 | 1.250.20 | 0.800.20 | |||||||
| 1206 (3216) | 3.200.30 | 1.600.30 | 1.000.20 | |||||||
| 1210 (3225) | 3.200.30 | 2.500.30 | 2.70 | |||||||
| 1808 (4520) | 4.500.40 | 2.000.20 | 2.70 | |||||||
| 1812 (4532) | 4.500.40 | 3.200.30 | 3.50 | |||||||
| 1825 (4563) | 4.500.40 | 6.300.50 | 3.50 | |||||||
| 2220 (5750) | 5.700.50 | 5.000.50 | 3.50 | |||||||
| 2225 (5763) | 5.700.50 | 6.300.50 | 6.20 | |||||||
| Specification and Testing Method | ||||||||||
| 1 | Temperature | -55~+125 | ||||||||
| 2 | Visual/Dimension | 1. No Damage 2. Dimension meet Spec | Naked eye (Visual inspection), Digital calliper | |||||||
| 3 | Static Capacity | Meet standard specification and tolerance | (See Page 3 for details on NPO and X7R/X7T/X7P characteristics) | |||||||
| 4 | Dissipation Factor (DF) | (See Page 3 for details on NPO and X7R/X7T/X7P characteristics) | (See Page 3 for details on NPO and X7R/X7T/X7P characteristics) | |||||||
| 5 | IR Insulation Resistance | (See Page 3 for details on NPO and X7R/X7T/X7P characteristics) | (See Page 3 for details on NPO and X7R/X7T/X7P characteristics) | |||||||
| 6 | Hi-pot (DC) | No dielectric breakdown or damage | (See Page 3 for voltage ratings and test conditions) | |||||||
| 7 | Solderability | Soldering area90% | (See Page 5 for pre-heating, solder temperature, and time) | |||||||
| 8 | Resistance to the heat of soldering | No damage, soldering area90% | (See Page 5 for pre-heating, solder temperature, and time) | |||||||
| 9 | Flexural strength | No damage | (See Page 5 for test conditions) | |||||||
| 10 | Terminal bonding strength | No visual damage | Applied Force: 5N, Duration: 101S | |||||||
| 11 | Thermal shock | (See Page 6 for capacity change rate, DF, and IR for NPO, X7R/X7P, X7T characteristics) | (See Page 6 for pre-condition and test cycles) | |||||||
| 12 | Temperature moisture exposure | (See Page 6 for visual, capacity change rate, DF, and IR for NPO, X7R/X7T/X7P characteristics) | (See Page 6 for test conditions: Temp, Humidity, Time) | |||||||
| 13 | High temperature exposure | (See Page 6 for visual, capacity change rate, DF, and IR for NPO, X7R/X7T/X7P characteristics) | (See Page 6 for test conditions: Temp, Time, Voltage) | |||||||
| 14 | PCB flexural strength | No crack and other defect | (See Page 7 for test conditions and dimensions) | |||||||
| Embossed Plastic Taping Dimensions (mm) | ||||||||||
| Code | Tape size A | B | C | D | E | F | G | H | J | T |
| 0805 | 1.55 0.20 | 2.35 0.20 | 8.00 0.20 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.10 | 1.50 -0/+0.10 | 1.50 Max |
| 1206 | 1.95 0.20 | 3.60 0.20 | 8.00 0.20 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.1 | 1.50 -0/+0.10 | 1.85 Max |
| 1210 | 2.70 0.10 | 3.42 0.10 | 8.00 0.10 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.05 | 4.00 0.10 | 1.55 -0/+0.10 | 3.2 Max |
| 1808 | 2.20 0.10 | 4.95 0.10 | 12.00 0.10 | 5.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.05 | 4.00 0.10 | 1.50 -0/+0.10 | 3.0 Max |
| 1812 | 3.66 0.10 | 4.95 0.10 | 12.00 0.10 | 5.50 0.05 | 1.75 0.10 | 8.00 0.10 | 2.00 0.05 | 4.00 0.10 | 1.55 -0/+0.10 | 4.0 Max |
| Paper Tape Reel Packing Dimensions (mm) | ||||||||||
| Code | Paper size W1 | L1 | D | C | B | P1 | P2 | P0 | d | t |
| 1005 | 0.24 0.02 | 0.45 0.02 | 8.00 0.10 | 3.50 0.05 | 1.75 0.10 | 2.00 0.05 | 2.00 0.05 | 4.00 0.10 | 1.50 -0/+0.10 | 0.30 Below |
| 0201 | 0.37 0.10 | 0.67 0.10 | 8.00 0.10 | 3.50 0.05 | 1.75 0.10 | 2.00 0.05 | 2.00 0.05 | 4.00 0.10 | 1.50 -0/+0.10 | 0.80 Below |
| 0402 | 0.65 0.10 | 1.15 0.10 | 8.00 0.10 | 3.50 0.05 | 1.75 0.10 | 2.00 0.05 | 2.00 0.05 | 4.00 0.10 | 1.50 -0/+0.10 | 0.80 Below |
| Code | Papersize A | B | C | D | E | F | G | H | J | T |
| 0603 | 1.10 0.10 | 1.90 0.10 | 8.00 0.10 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.10 | 1.50 -0/+0.10 | 1.10 Max |
| 0805 | 1.45 0.15 | 2.30 0.15 | 8.0 0.15 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.10 | 1.50 -0/+0.10 | 1.10 Max |
| 1206 | 1.80 0.20 | 3.40 0.20 | 8.00 0.20 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.10 | 1.50 -0/+0.10 | 1.10 Max |
| Reel Dimensions (unit: mm) | ||||||||||
| Unit | A | B | C | D | E | F | G | |||
| 7REEL | 1782.0 | 3.0 | 130.5 | 210.5 | 21 or Bigger | 1010.5 | 12max | |||
| 13REEL | 3302.0 | 3.0 | 130.5 | 210.5 | 21 or Bigger | 1010.5 | 12max | |||
| Taping Specification | ||||||||||
| Top tape peeling strength | (a) Paper Taping: 0.1N < peeling strength < 0.7N (b) Embossed Taping: Standard: 0.1N < peeling strength < 0.7N | |||||||||
| Packing Quantity | ||||||||||
| Size | Paper T/R (Pcs) | Plastic T/R (Pcs) | ||||||||
| 0603 | 4000 | - | ||||||||
| 0805 | 4000 | 3000 (T1.35mm) | ||||||||
| 1206 | - | 3000 (T>1.35mm), 2000 (T1.60mm) | ||||||||
| 1210 | - | 3000 (T>1.60mm), 2000 | ||||||||
| 1808 | - | 1000 (T1.85mm) | ||||||||
| 1812 | - | 1000 (T>1.85mm), 800 | ||||||||
| 1812 | - | 500 | ||||||||
| Precautions For Use | ||||||||||
| MLCCs may fail in a short circuit or open circuit mode when subjected to severe conditions beyond specified ratings. Follow safety precautions and application notes. Contact engineering for handling questions. | ||||||||||
| 1 | Soldering Profile: Avoid sudden temperature changes; follow the recommended profile (refer to graph in enclosure page). | |||||||||
| 2 | Manual Soldering: Exercise caution to prevent thermal cracks. Ensure proper soldering iron tip selection and temperature. | |||||||||
| 3 | Optimum Solder Amount for Reflow Soldering: Recommended amounts provided. | |||||||||
| 4 | Recommended Soldering amounts: Provided. | |||||||||
| Recommended Soldering Method | ||||||||||
| Size | Temperature Characteristics | Rated Voltage | Capacitance | Soldering Method | ||||||
| 1005 | NPO | / | / | R | ||||||
| X7R/X5R/X7S/X6S | / | / | R | |||||||
| 0201 | NPO | / | / | R | ||||||
| X7R/X5R/X7S/X6S | / | / | R | |||||||
| Y5V | / | / | R | |||||||
| 0402 | NPO | / | / | R | ||||||
| X7R/X5R/X7S/X6S | / | / | R | |||||||
| Y5V | / | / | R | |||||||
| 0603 | NPO | / | / | R/W | ||||||
| X7R/X5R/X7S/X6S | / | C1uf | R | |||||||
| C1uf | R/W | |||||||||
| Y5V | / | C1uf | R | |||||||
| C1uf | R/W | |||||||||
| 0805 | NPO | / | / | R/W | ||||||
| X7R/X5R/X7S/X6S | / | C4.7uf | R | |||||||
| C4.7uf | R/W | |||||||||
| Y5V | / | C1uf | R | |||||||
| C1uf | R/W | |||||||||
| 1206 | NPO | / | / | R/W | ||||||
| X7R/X5R/X7S/X6S | / | C10uf | R | |||||||
| C10uf | R/W | |||||||||
| Y5V | / | C10uf | R | |||||||
| C10uf | R/W | |||||||||
| 1210 | NPO | / | / | R | ||||||
| X7R/X5R/X7S/X6S | / | / | R | |||||||
| Y5V | / | / | R | |||||||
| Soldering method: RReflow Soldering, WWave Soldering | ||||||||||
| Soldering Temperature Profile: Keep temperature difference T150 between soldering temperature and surface temperature of chips during preheating. | ||||||||||
2509251626_AIDE-CAPACITOR-0805X7R334K500NT_C48579630.pdf
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