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Specifications
Voltage Rating:
100V
Capacitance:
470pF
Temperature Coefficient:
X7R
Tolerance:
±10%
Mfr. Part #:
0805X7R471K101NT
Model Number:
0805X7R471K101NT
Package:
0805
Key Attributes
Product Description
Product Overview
This product is a Multi-layer Ceramic Capacitor (MLCC) designed for high-voltage applications. It is suitable for coupling, wave filtering, and resonant functions in various power supply and networking circuits. Applications include switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamps. These MLCCs are available for medium and high voltage requirements.
Product Attributes
- Terminal Composition: Au/Ag-Ni-Sn (From the inside out)
- RoHS/REACH Compliance: Meets RoHS and REACH standards.
Technical Specifications
| Item | Description | Details | |||
|---|---|---|---|---|---|
| Application Field | Coupling, wave filtering, resonant in high voltage circuits. | ||||
| Switch power supplier, AC-DC power charger, DC-DC power charger, networking/Communication interface, LCD backlight unit power supplier, amperite of energy saving lamps, etc. (Medium and High voltage MLCC). | |||||
| Testing Condition | Normal Condition | Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa | |||
| Relative Condition | Temperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa | ||||
| Part Number Description | 1. Dimension Code | 0201 (0.02*0.01 inch / 0.50*0.25 mm), 0402 (0.04*0.02 inch / 1.00*0.50 mm), 0603 (0.06*0.03 inch / 1.60*0.80 mm), 0805 (0.08*0.05 inch / 2.00*1.25 mm), 1206 (0.12*0.06 inch / 3.20*1.60 mm), 1210 (0.12*0.10 inch / 3.20*2.50 mm), 1808 (0.18*0.08 inch / 4.50*2.00 mm), 1812 (0.18*0.12 inch / 4.50*3.20 mm), 1825 (0.18*0.25 inch / 4.50*6.30 mm), 2211 (0.22*0.11 inch / 5.70*2.8 mm), 2225 (0.22*0.25 inch / 5.70*6.30 mm) | |||
| 2. Temperature Characteristic | C0G (030 PPM/), X7R (15%), X5R (15%) | ||||
| 3. Nominal Electrostatic Capacity | 8R0 (8.0pF), 100 (10pF), 101 (100pF) | ||||
| 4. Tolerance of Electrostatic Capacity | B: 0.1pF, C: 0.25pF, D: 0.5pF, F: 1%, G: 2%, J: 5%, K: 10%, M: 20%, Z: +80%/-20% | ||||
| 5. Rated Voltage (DC) | 250 (25V), 251 (250V), 252 (2500V) | ||||
| 6. Terminal Composition | Au/Ag-Ni-Sn (From the inside out) | ||||
| 7. Packing | T (Tape/Reel), P (Bag packing) | ||||
| Construction | Item | Description | |||
| 1 | Ceramic dielectric | ||||
| 2 | Inner electrode | ||||
| 3 | Outer electrode | ||||
| 4 | Nickle layer | ||||
| 5 | Tin layer | ||||
| Dimension (mm) | Part Number | L | W | T | WB |
| 0201 (0603) | 0.600.10 | 0.300.05 | 0.300.05 | 0.100.05 | |
| 0402 (1005) | 1.000.15 | 0.500.15 | 0.500.10 | 0.200.10 | |
| 0603 (1608) | 1.600.20 | 0.800.15 | 0.800.15 | 0.300.10 | |
| 0805 (2012) | 2.000.20 | 1.250.20 | 0.800.20 | 0.500.20 | |
| 1206 (3216) | 3.200.30 | 1.600.30 | 1.000.20 | 0.600.30 | |
| 1210 (3225) | 3.200.30 | 2.500.30 | 2.70 | 0.800.30 | |
| 1808 (4520) | 4.500.40 | 2.000.20 | 2.70 | 0.800.30 | |
| 1812 (4532) | 4.500.40 | 3.200.30 | 3.50 | 0.800.30 | |
| 1825 (4563) | 4.500.40 | 6.300.50 | 3.50 | 0.800.30 | |
| 2220 (5750) | 5.700.50 | 5.000.50 | 3.50 | 1.000.40 | |
| 2225 (5763) | 5.700.50 | 6.300.50 | 6.20 | 1.000.40 | |
| Specification and Testing Method | Item | Specification/Requirement | Testing Method | ||
| 1. Temperature | -55~+125 | - | |||
| 2. Visual/Dimension | 1. No Damage, 2. Dimension meet Spec | Naked eye (Visual inspection), Digital calliper | |||
| 3. Static Capacity | Meet standard specification and tolerance | NPO characteristic: Capacity 1000pF 1MHz10%, 1.00.2Vrms; >1000pF 1KHz10%, 1.00.2Vrms. X7R/X7T/X7P characteristic: 10uF 1KHz10%, 1.00.2Vrms; >10uF 120Hz24, 0.50.1Vrms. | |||
| 4. Dissipation Factor (DF) | NPO Characteristic: DF0.56, Cr5 pF; DF1.5[(150/Cr)+7]10-4 (5pFCr50pF); DF0.15%, (50pFCr). Cr1000pF, 1MHz10%, 1V0.2rms. Cr1000pF, 1KHz10%, 1V0.2rms. X7R/X7T/X7P characteristic: Cr10uF, 1KHz10%, 1V0.1rms. Cr10uF, 120Hz24Hz, 0.5V0.1rms. See Note 1 for exceptions. | - | |||
| 5. IR Insulation Resistance | NPO Characteristic: IR50000M, C10nF; IR*Cr500S, C10nF. X7R/X7T/X7P Characteristic: IR10000M, C25nF; IR*Cr100S, C25nF. Testing condition: Rated voltage, Time: 605s, Humidity: 75%, Temperature: 255, Current: 50mA. | - | |||
| 6. Hi-pot (DC) | Ur=100V, 2.5 x rated voltage; Ur=200V/250V, 2.0 x rated voltage; Ur=450/500/630V, 1.5 x rated voltage; 1KVUr2KV, 1.2 x rated voltage; 2KVUr, 1.1 x rated voltage. Voltage Raising time: 110S, Voltage maintaining time: 2S. No dielectric breakdown or damage. | - | |||
| 7. Solderability | soldering area90% | Pre-heating temperature 80-120, time 10-30s, lead free solder, flux. Soldering temperature 2455, Solder time 20.5s. Visual-No damage. | |||
| 8. Resistance to the heat of soldering | Visual-No damage, soldering area90% | Pre-heating temperature 100-200, time 102 s, soldering temperature: 2655, Soldering time: 51s. Cleaning with solvent. Room temperature, time: 242 hours. | |||
| 9. Electrostatic capacity change rate | NPO Characteristic: C/C0.5% or 0.5pF (larger reading). X7R: C/C15%. X7T: -33% C/C22%. X7P: C/C10%. | Pre-heating 150 for 1 hour, then place 48 hours under normal pressure & temperature. | |||
| 10. Flexural strength | Electro static capacity change rate C/C10% | Base board: Al2O3 /PCB. PCB dimension: Thickness: 1.6mm, Length: 100mm, Width: 40mm. Flexural depth: 1mm. Bend speed: 0.5mm/sec. Test under flexural status. No damage. | |||
| 11. Terminal bonding strength | No visual damage | Applied Force: 5N, Duration: 101S. | |||
| 12. Thermal shock | NPO Characteristic: C/C2.5% or 0.25pF (larger reading). X7R/X7P characteristic: C/C0.5%. X7T characteristic: C/C10%. | Pre-condition (X7R h characteristic): Upper limit temperature 1 hour, place 241 hours, start testing. Run 5 cycles Thermal shock. Test after placing 242 hours at normal temp & humidity. | |||
| 13. Temperature moisture exposure | Capacitance change rate: NPO characteristic: C/C2% or 1pF (larger reading). X7R/X7T/X7P characteristic: C/C10%. DF 2 times initial standard. IR: NPO characteristic: IR2500M or IR*Cr25S (Lower reading). X7R/X7T/X7P: IR1000M or IR*Cr25S (Lower reading). | Temperature 402, Humidity 90~95%RH, time 50024 hours. Test after placing 242 hours at normal temp & humidity. Visual No visual damage. | |||
| 14. High temperature exposure | Capacitance change rate: NPO: C/C2% or 1pF (larger reading). X7R/X7T/X7P: C/C20%. DF 2 X initial standard. IR: NPO: IR4000M or IR*Cr40S (Lower reading). X7R/X7T/X7P: IR2000M or IR*Cr50S (Lower reading). | Temperature 1253, Time 100048 hours. Voltage: 100VV250V (2x Rated voltage), 250VV1KV (1.5x rated voltage), 1KVV (1.2x rated voltage). Charging and discharging current 50mA Max. Test after placing 48 hours under normal pressure & temperature. Visual No visual damage. | |||
| 15. PCB flexural strength | No crack and other defect | IR Soldering the MLCC on the PCB, then pressing direction based on photo. SIZE A B C: 0805(2012) 1.2 4 1.65; 1206(3216) 2.2 5 2; 1210(3225) 2.2 5 2.9; 1812(4532) 3.5 7 3.7; 2220(5750) 4.5 8 5.6. | |||
| Embossed Plastic Taping | Code | Tape size (mm) | |||
| 0805 | A: 1.550.20, B: 2.350.20, C: 8.000.20, D: 3.500.05, E: 1.750.10, F: 4.000.10, G: 2.000.10, H: 4.000.10, J: 1.50 -0/+0.10, T: 1.50 Max | ||||
| 1206 | A: 1.950.20, B: 3.600.20, C: 8.000.20, D: 3.500.05, E: 1.750.10, F: 4.000.10, G: 2.000.10, H: 4.000.10, J: 1.50 -0/+0.10, T: 1.85 Max | ||||
| 1210 | A: 2.700.10, B: 3.420.10, C: 8.000.10, D: 3.500.05, E: 1.750.10, F: 4.000.10, G: 2.000.05, H: 4.000.10, J: 1.55 -0/+0.10, T: 3.2 Max | ||||
| 1808 | A: 2.200.10, B: 4.950.10, C: 12.000.10, D: 5.500.05, E: 1.750.10, F: 4.000.10, G: 2.000.05, H: 4.000.10, J: 1.50 -0/+0.10, T: 3.0 Max | ||||
| 1812 | A: 3.660.10, B: 4.950.10, C: 12.000.10, D: 5.500.05, E: 1.750.10, F: 8.000.10, G: 2.000.05, H: 4.000.10, J: 1.55 -0/+0.10, T: 4.0 Max | ||||
| Paper Tape Reel Packing | Code | Paper size (mm) | |||
| 1005 | W1: 0.240.02, L1: 0.450.02, D: 8.000.10, C: 3.500.05, B: 1.750.10, P1: 2.000.05, P2: 2.000.05, P0: 4.000.10, d: 1.50 -0/+0.10, t: 0.30 Below | ||||
| 0201 | W1: 0.370.10, L1: 0.670.10, D: 8.000.10, C: 3.500.05, B: 1.750.10, P1: 2.000.05, P2: 2.000.05, P0: 4.000.10, d: 1.50 -0/+0.10, t: 0.80 Below | ||||
| 0402 | W1: 0.650.10, L1: 1.150.10, D: 8.000.10, C: 3.500.05, B: 1.750.10, P1: 2.000.05, P2: 2.000.05, P0: 4.000.10, d: 1.50 -0/+0.10, t: 0.80 Below | ||||
| 0603 | A: 1.100.10, B: 1.900.10, C: 8.000.10, D: 3.500.05, E: 1.750.10, F: 4.000.10, G: 2.000.10, H: 4.000.10, J: 1.50 -0/+0.10, T: 1.10 Max | ||||
| 0805 | A: 1.450.15, B: 2.300.15, C: 8.00.15, D: 3.500.05, E: 1.750.10, F: 4.000.10, G: 2.000.10, H: 4.000.10, J: 1.50 -0/+0.10, T: 1.10 Max | ||||
| 1206 | A: 1.800.20, B: 3.400.20, C: 8.000.20, D: 3.500.05, E: 1.750.10, F: 4.000.10, G: 2.000.10, H: 4.000.10, J: 1.50 -0/+0.10, T: 1.10 Max | ||||
| Reel Dimensions (unit: mm) | 7REEL | 1782.0, 3.0, 130.5, 210.5, 21 or Bigger, 1010.5, 12max | |||
| 13REEL | 3302.0, 3.0, 130.5, 210.5, 21 or Bigger, 1010.5, 12max | ||||
| Taping specification | Top tape peeling strength | Standard: 0.1N < peeling strength < 0.7N. No paper dirty remains on the scotch when peeling, and sticks to top and bottom tape. | |||
| Packing quantity | Paper T/R (Pcs) | 0603: 4000, 0805: 4000, 1005: 4000, 1206: 4000 | |||
| Plastic T/R (Pcs) | 0805: 3000 (T1.35mm), 1206: 3000 (T1.60mm), 1210: 2000 (T1.85mm), 1812: 1000 (T1.85mm) | ||||
| Recommended Soldering Method | Size | Capacitance | Soldering Method | ||
| 1005 | / | R | |||
| 0201 | / | R | |||
| 0402 | / | R | |||
| 0603 | C1uf | R | |||
| C1uf | R/W | ||||
| 0805 | C4.7uf | R | |||
| C4.7uf | R/W | ||||
| 1206 | C10uf | R | |||
| C10uf | R/W | ||||
| 1210 | / | R | |||
| Soldering method: | RReflow Soldering, WWave Soldering | ||||
Precautions For Use
Multi-layer Ceramic Capacitors (MLCC) may fail in a short circuit or open circuit mode when subjected to severe electrical or mechanical stress beyond specified ratings. This can result in burn out, flaming, or glowing. Follow safety precautions and application notes. Contact the engineering section or factory for handling precautions.
- Soldering Profile: Avoid sudden temperature changes. Refer to the adjacent graph for the temperature profile.
- Manual Soldering: Risk of thermal cracks exists due to direct contact with soldering iron tip. Handle carefully and select appropriate tip and temperature.
- Optimum Solder Amount for Reflow Soldering
- Recommended Soldering amounts
Soldering Temperature Profile
During preheating, keep the temperature difference between soldering temperature and surface temperature of chips as T150.
2509251626_AIDE-CAPACITOR-0805X7R471K101NT_C48579631.pdf
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