Product Overview
This product is a Multi-Layer Ceramic Capacitor (MLCC) designed for high-voltage applications. It is suitable for coupling, wave filtering, and resonant functions in various high-voltage circuits, including switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamps. These MLCCs are available in medium and high voltage ratings.
Product Attributes
- Terminal Composition: Au/Ag-Ni-Sn (From the inside out)
- Compliance: RoHS/REACH compliant
Technical Specifications
| Item | Description | Specification | |||
|---|---|---|---|---|---|
| Application Field | Coupling, wave filtering, resonant in high voltage circuits | ||||
| Switch power supplier | |||||
| AC-DC power charger | |||||
| DC-DC power charger | |||||
| Networking/Communication interface | |||||
| LCD backlight unit power supplier, amperite of energy saving lamps | |||||
| Testing Condition (Normal) | Temperature | 15~35 | |||
| Humidity | 45~75%RH | ||||
| Atmosphere | 86~106kPa | ||||
| Testing Condition (Relative) | Temperature | 252 | |||
| Humidity | 60~70%RH | ||||
| Atmosphere | 86~106kPa | ||||
| Part Number Description | 1. Dimension Code | 0201, 0402, 0603, 0805, 1206, 1210, 1808, 1812, 1825, 2211, 2225 | |||
| 2. Temperature Characteristic | C0G (030 PPM/), X7R (15%), X5R (15%) | ||||
| 3. Nominal Electrostatic Capacity | 8R08.0, 10010, 101100 (pF) | ||||
| 4. Tolerance of Electrostatic Capacity | B:0.1pF, C:0.25pF, D:0.5pF, F:1%, G: 2%, J:5%, K:10%, M:20%, Z:+80%/-20% | ||||
| 5. Rated Voltage (DC) | 25025, 251250, 2522500 (V) | ||||
| 6. Terminal Composition | Au/Ag-Ni-Sn (From the inside out) | ||||
| 7. Packing | T Tape/Reel, P Bag packing (PE) | ||||
| Construction | 1. Ceramic dielectric | N/A | |||
| 2. Inner electrode | N/A | ||||
| 3. Outer electrode | N/A | ||||
| 4. Nickle layer | N/A | ||||
| 5. Tin layer | N/A | ||||
| Dimension (mm) | Part number | L | W | T | WB |
| 0201 (0603) | 0.600.10 | 0.300.05 | 0.300.05 | 0.100.05 | |
| 0402 (1005) | 1.000.15 | 0.500.15 | 0.500.10 | 0.200.10 | |
| 0603 (1608) | 1.600.20 | 0.800.15 | 0.800.15 | 0.300.10 | |
| 0805 (2012) | 2.000.20 | 1.250.20 | 0.800.20 | 0.500.20 | |
| 1206 (3216) | 3.200.30 | 1.600.30 | 1.000.20 | 0.600.30 | |
| 1210 (3225) | 3.200.30 | 2.500.30 | 2.70 | 0.800.30 | |
| 1808 (4520) | 4.500.40 | 2.000.20 | 2.70 | 0.800.30 | |
| 1812 (4532) | 4.500.40 | 3.200.30 | 3.50 | 0.800.30 | |
| 1825 (4563) | 4.500.40 | 6.300.50 | 3.50 | 0.800.30 | |
| 2220 (5750) | 5.700.50 | 5.000.50 | 3.50 | 1.000.40 | |
| 2225 (5763) | 5.700.50 | 6.300.50 | 6.20 | 1.000.40 | |
| Temperature Range | -55~+125 | N/A | N/A | N/A | |
| Specification and Testing Method | Visual/Dimension | 1. No Damage 2. Dimension meet Spec | Naked eye (Visual inspection), Digital calliper | N/A | |
| Static Capacity | Meet standard specification and tolerance | See detailed specification in document | N/A | ||
| Dissipation Factor (DF) | See detailed specification in document | See detailed specification in document | N/A | ||
| IR Insulation Resistance | See detailed specification in document | Testing condition: Rated voltage, Time: 605s, Humidity: 75%, Temperature: 255, Current: 50mA | N/A | ||
| Hi-pot (DC) | No dielectric breakdown or damage | See detailed specification in document | N/A | ||
| Solderability | Soldering area 90% | Pre-heating temperature 80-120, time 10-30s, lead free solder, flux. Soldering temperature 2455, Solder time 20.5s | N/A | ||
| Resistance to the heat of soldering | Visual-No damage, soldering area 90% | Pre-heating temperature 100-200, time 102 s, soldering temperature: 2655, Soldering time: 51s. Cleaning with solvent. Room temperature, time: 242 hours. | N/A | ||
| Electrostatic Capacity Change Rate | NPO Characteristic: C/C 0.5% or 0.5pF X7R: C/C 15% X7T: -33% C/C 22% X7P: C/C 10% | Pre-heating 150 1hour, then place 48 hours under normal pressure & temperature. | N/A | ||
| Flexural Strength | No damage | Base board: Al2O3 /PCB. PCB dimension: Thickness: 1.6mm, Length: 100mm, Width: 40mm. Flexural depth: 1mm. Bend speed: 0.5mm/sec. Test under flexural status. Electro static capacity change rate C/C 10% | N/A | ||
| Terminal Bonding Strength | No visual damage | Applied Force: 5N, Duration: 101S | N/A | ||
| Thermal Shock | NPO Characteristic: C/C 2.5% or 0.25pF X7R/X7P: C/C 0.5% X7T: C/C 10% | Pre-condition (X7R h characteristic): Upper limit temperature 1hour, place 241 hours, start to testing. Run 5 cycles Thermal shock. Test after place 242 hours normal temp & humidity. | N/A | ||
| Temperature Moisture Exposure | Visual: No visual damage Capacitance Change Rate: NPO: C/C 2% or 1pF X7R/X7T/X7P: C/C 10% DF: 2 times initial standard IR: NPO: IR2500M or IR*Cr25S X7R/X7T/X7P: IR1000M or IR*Cr25S | Temperature 402, Humidity 90~95%RH, time 50024 hours. Test after place 242 hours normal temp & humidity. | N/A | ||
| High Temperature Exposure | Visual: No visual damage Capacitance Change Rate: NPO: C/C 2% or 1pF X7R/X7T/X7P: C/C 20% DF: 2 X initial standard IR: NPO: IR4000M or IR*Cr40S X7R/X7T/X7P: IR2000M or IR*Cr50S | Temperature 1253, Time 100048 hours. Voltage: 100VV250V (2x Rated voltage), 250VV1KV (1.5x rated voltage), 1KVV (1.2x rated voltage). Test after place 48 hours under normal pressure & temperature. | N/A | ||
| PCB Flexural Strength | No crack and other defect | IR Soldering the MLCC on the PCB. Pressing direction based on diagram. | N/A | ||
| Packing Quantity | See detailed table in document | N/A | N/A | ||
| Soldering Method | RReflow Soldering, WWave Soldering | Refer to Recommended Soldering Method table in document | N/A | ||
Note: Detailed specifications for each item are available in the provided documentation.
2509251626_AIDE-CAPACITOR-0805X7R471K201NT_C48579632.pdf
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