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Specifications
Voltage Rating:
100V
Capacitance:
4.7nF
Temperature Coefficient:
X7R
Tolerance:
±10%
Mfr. Part #:
0805X7R472K101NT
Model Number:
0805X7R472K101NT
Package:
0805
Key Attributes
Product Description
Product Overview
This product is a Multi-layer Ceramic Capacitor (MLCC) designed for high-voltage applications. It is utilized for coupling, wave filtering, and resonant functions in various power supply and electronic circuits. Key applications include switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamps. The MLCCs are available in a range of sizes and temperature characteristics, offering reliable performance under specified conditions.
Product Attributes
- Material: Ceramic dielectric, Inner electrode, Outer electrode, Nickel layer, Tin layer
- Terminal Composition: Au/Ag-Ni-Sn (From the inside out)
- Certifications: ROHS compliant, REACH compliant
Technical Specifications
| Item | Description | Specification/Requirement | Testing Method | |||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Application Field | Coupling, wave filtering, resonant in high voltage circuits | |||||||||||
| Switch power supplier, AC-DC power charger, DC-DC power charger, networking/Communication interface, LCD backlight unit power supplier, amperite of energy saving lamps, etc. (Medium and High voltage MLCC) | ||||||||||||
| Testing Condition | Normal Condition | Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa | N/A | |||||||||
| Relative Condition | Temperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa | Used when data does not match testing specification | ||||||||||
| Part Number Description | 1. Dimension Code | 0201 (0.02*0.01 inch / 0.50*0.25 mm), 0402 (0.04*0.02 inch / 1.00*0.50 mm), 0603 (0.06*0.03 inch / 1.60*0.80 mm), 0805 (0.08*0.05 inch / 2.00*1.25 mm), 1206 (0.12*0.06 inch / 3.20*1.60 mm), 1210 (0.12*0.10 inch / 3.20*2.50 mm), 1808 (0.18*0.08 inch / 4.50*2.00 mm), 1812 (0.18*0.12 inch / 4.50*3.20 mm), 1825 (0.18*0.25 inch / 4.50*6.30 mm), 2211 (0.22*0.11 inch / 5.70*2.8 mm), 2225 (0.22*0.25 inch / 5.70*6.30 mm) | ||||||||||
| 2. Temperature Characteristic | C0G (030 PPM/), X7R (15%), X5R (15%) | |||||||||||
| 3. Nominal Electrostatic Capacity | 8R0 = 8.0 pF, 100 = 10 pF, 101 = 100 pF | |||||||||||
| 4. Tolerance of Electrostatic Capacity | B: 0.1pF, C: 0.25pF, D: 0.5pF, F: 1%, G: 2%, J: 5%, K: 10%, M: 20%, Z: +80%/-20% | |||||||||||
| 5. Rated Voltage (DC) | 250 = 25V, 251 = 250V, 252 = 2500V | |||||||||||
| 6. Terminal Composition | Au/Ag-Ni-Sn (From the inside out) | |||||||||||
| 7. Packing | T = Tape/Reel, P = Bag packing (PE) | |||||||||||
| Construction and Dimension | Construction | 1. Ceramic dielectric, 2. Inner electrode, 3. Outer electrode, 4. Nickel layer, 5. Tin layer | ||||||||||
| Dimension (mm) | Part number | L | W | T | WB | |||||||
| 0201 (0603) | 0.600.10 | 0.300.05 | 0.300.05 | 0.100.05 | ||||||||
| 0402 (1005) | 1.000.15 | 0.500.15 | 0.500.10 | 0.200.10 | ||||||||
| 0603 (1608) | 1.600.20 | 0.800.15 | 0.800.15 | 0.300.10 | ||||||||
| 0805 (2012) | 2.000.20 | 1.250.20 | 0.800.20 | 0.500.20 | ||||||||
| 1206 (3216) | 3.200.30 | 1.600.30 | 1.000.20 | 0.600.30 | ||||||||
| 1210 (3225) | 3.200.30 | 2.500.30 | 2.70 | 0.800.30 | ||||||||
| 1808 (4520) | 4.500.40 | 2.000.20 | 2.70 | 0.800.30 | ||||||||
| 1812 (4532) | 4.500.40 | 3.200.30 | 3.50 | 0.800.30 | ||||||||
| 1825 (4563) | 4.500.40 | 6.300.50 | 3.50 | 0.800.30 | ||||||||
| 2220 (5750) | 5.700.50 | 5.000.50 | 3.50 | 1.000.40 | ||||||||
| 2225 (5763) | 5.700.50 | 6.300.50 | 6.20 | 1.000.40 | ||||||||
| Specification and Testing Method | 1. Temperature | -55~+125 | N/A | |||||||||
| 2. Visual/Dimension | 1. No Damage, 2. Dimension meet Spec | Naked eye (Visual inspection), Digital calliper | ||||||||||
| 3. Static Capacity | Meet standard specification and tolerance | NPO: 1000pF: 1MHz10%, 1.00.2Vrms; >1000pF: 1KHz10%, 1.00.2Vrms X7R/X7T/X7P: 10uF: 1KHz10%, 1.00.2Vrms; >10uF: 120Hz24, 0.50.1Vrms | ||||||||||
| 4. Dissipation Factor (DF) | NPO: DF0.56, Cr5 pF; DF1.5[(150/Cr)+7]10-4 (5pFCr50pF); DF0.15%, (50pFCr) X7R/X7T/X7P: See Note 1 | NPO: Cr1000pF: 1MHz10%, 1V0.2rms; Cr1000pF: 1KHz10%, 1V0.2rms X7R/X7T/X7P: Cr10uF: 1KHz10%, 1V0.1rms; Cr10uF: 120Hz24, 0.5V0.1rms | ||||||||||
| 5. IR Insulation Resistance | NPO: IR50000M, C10nF; IR*Cr500S, C10nF X7R/X7T/X7P: IR10000M, C25nF; IR*Cr100S, C25nF | Testing condition: Rated voltage, Time: 605s, Humidity: 75%, Temperature: 255, Current: 50mA | ||||||||||
| 6. Hi-pot (DC) | No dielectric breakdown or damage | Ur=100V: 2.5 x rated voltage; Ur=200V/250V: 2.0 x rated voltage; Ur=450/500/630V: 1.5 x rated voltage; 1KVUr2KV: 1.2 x rated voltage; 2KVUr: 1.1 x rated voltage. Voltage Raising time: 110S, Voltage maintaining time: 2S | ||||||||||
| 7. Solderability | Soldering area 90% | Pre-heating temperature 80-120, time 10-30s, lead free solder, flux. Soldering temperature 2455, Solder time 20.5s | ||||||||||
| 8. Resistance to the heat of soldering | No visual damage, soldering area 90% | Pre-heating temperature 100-200, time 102 s, soldering temperature: 2655, Soldering time: 51s. Cleaning with solvent. Room temperature, time: 242 hours. | ||||||||||
| 9. Flexural strength | No damage | Base board: Al2O3 /PCB. PCB dimension: Thickness: 1.6mm, Length: 100mm, Width: 40mm. Flexural depth: 1mm. Bend speed: 0.5mm/sec. Test under flexural status. | ||||||||||
| 10. Terminal bonding strength | No visual damage | Applied Force: 5N, Duration: 101S | ||||||||||
| 11. Thermal shock | NPO: C/C2.5% or 0.25pF (larger reading) X7R/X7P: C/C0.5% X7T: C/C10% | Pre-condition (X7R h characteristic): Upper limit temperature 1hour, place 241 hours, start testing. Run 5 cycles Thermal shock. Test after place 242 hours normal temp & humidity. | ||||||||||
| 12. Temperature moisture exposure | Visual: No visual damage Capacitance change rate: NPO: C/C2% or 1pF (larger reading); X7R/X7T/X7P: C/C10% DF: 2 times initial standard IR: NPO: IR2500M or IR*Cr25S (Lower reading); X7R/X7T/X7P: IR1000M or IR*Cr25S (Lower reading) | Temperature 402, Humidity 90~95%RH, time 50024 hours. Test after place 242 hours normal temp & humidity. | ||||||||||
| 13. High temperature exposure | Visual: No visual damage Capacitance change rate: NPO: C/C2% or 1pF (larger reading); X7R/X7T/X7P: C/C20% DF: 2 X initial standard IR: NPO: IR4000M or IR*Cr40S (Lower reading); X7R/X7T/X7P: IR2000M or IR*Cr50S (Lower reading) | Temperature 1253, Time 100048 hours. Voltage: 100VV250V: 2x Rated voltage; 250VV1KV: 1.5x rated voltage; 1KVV: 1.2x rated voltage. Test after place 48 hours under normal pressure & temperature. | ||||||||||
| 14. PCB flexural strength | No crack and other defect | IR Soldering the MLCC on the PCB, then pressing direction based on the photo. | ||||||||||
| EMBOSSED PLASTIC TAPING | Embossed tape reel packing for 0805(2012)~1812(4532) type | Code | Tapesize | A | B | C | D | E | F | G | H | J | T | ||||||||||
| 0805 | 1.55 0.20 | 2.35 0.20 | 8.00 0.20 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.10 | 1.50 -0/+0.10 | 1.50 Max | ||
| 1206 | 1.95 0.20 | 3.60 0.20 | 8.00 0.20 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.1 | 1.50 -0/+0.10 | 1.85 Max | ||
| 1210 | 2.70 0.10 | 3.42 0.10 | 8.00 0.10 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.05 | 4.00 0.10 | 1.55 -0/+0.10 | 3.2 Max | ||
| 1808 | 2.20 0.10 | 4.95 0.10 | 12.00 0.10 | 5.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.05 | 4.00 0.10 | 1.50 -0/+0.10 | 3.0 Max | ||
| 1812 | 3.66 0.10 | 4.95 0.10 | 12.00 0.10 | 5.50 0.05 | 1.75 0.10 | 8.00 0.10 | 2.00 0.05 | 4.00 0.10 | 1.55 -0/+0.10 | 4.0 Max | ||
| Paper tape reel packing | 1005 (0402), 0201, 0402 type | Code | Papersize | W1 | L1 | D | C | B | P1 | P2 | P0 | d | t | ||||||||||
| 1005 | 0.24 0.02 | 0.45 0.02 | 8.00 0.10 | 3.50 0.05 | 1.75 0.10 | 2.00 0.05 | 2.00 0.05 | 4.00 0.10 | 1.50 -0/+0.10 | 0.30 Below | ||
| 0201 | 0.37 0.10 | 0.67 0.10 | 8.00 0.10 | 3.50 0.05 | 1.75 0.10 | 2.00 0.05 | 2.00 0.05 | 4.00 0.10 | 1.50 -0/+0.10 | 0.80 Below | ||
| 0402 | 0.65 0.10 | 1.15 0.10 | 8.00 0.10 | 3.50 0.05 | 1.75 0.10 | 2.00 0.05 | 2.00 0.05 | 4.00 0.10 | 1.50 -0/+0.10 | 0.80 Below | ||
| 0603, 0805, 1206 types | Code | Papersize | A | B | C | D | E | F | G | H | J | T | |||||||||||
| 0603 | 1.10 0.10 | 1.90 0.10 | 8.00 0.10 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.10 | 1.50 -0/+0.10 | 1.10 Max | ||
| 0805 | 1.45 0.15 | 2.30 0.15 | 8.0 0.15 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.10 | 1.50 -0/+0.10 | 1.10 Max | ||
| 1206 | 1.80 0.20 | 3.40 0.20 | 8.00 0.20 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.10 | 1.50 -0/+0.10 | 1.10 Max | ||
| Reel Dimensions | Unit: mm | Type | A | B | C | D | E | F | G | ||||||||||
| 7REEL | 1782.0 | 3.0 | 130.5 | 210.5 | 21 or Bigger | 1010.5 | 12 max | |||||
| 13REEL | 3302.0 | 3.0 | 130.5 | 210.5 | 21 or Bigger | 1010.5 | 12 max | |||||
| Taping specification | Top tape peeling strength | Standard: 0.1N < peeling strength < 0.7N. No paper dirty remains on the scotch when peeling, and sticks to top and bottom tape. | ||||||||||
| Packing quantity | Dimension | Paper T/R (Pcs) | Plastic T/R (Pcs) | |||||||||
| 0603 | 4000 | |||||||||||
| 0805 | 4000 | 3000 (T1.35mm) | ||||||||||
| 1206 | 3000 (T>1.35mm) | |||||||||||
| 1210 | 2000 (T1.60mm) | |||||||||||
| 1808 | 3000 (T>1.60mm) | |||||||||||
| 1812 | 2000 | |||||||||||
| 1812 | 1000 | |||||||||||
| 8 Precautions For Use | MLCCs may fail in a short circuit mode when subjected to severe conditions beyond specified ratings, potentially leading to burnout, flaming, or glowing. Adhere to safety precautions and application notes. Contact engineering for handling questions. | |||||||||||
| 9 Recommended Soldering Method | Size | Temperature Characteristics | Rated Voltage | Capacitance | Soldering Method 1005 | NPO / X7R/X5R/X7S/X6S / | / | / | R 0201 | NPO / X7R/X5R/X7S/X6S / Y5V | / | / | R 0402 | NPO / X7R/X5R/X7S/X6S / Y5V | / | / | R 0603 | NPO / X7R/X5R/X7S/X6S / Y5V | / | C1uf R, C1uf R/W | R/W 0805 | NPO / X7R/X5R/X7S/X6S / Y5V | / | C4.7uf R, C4.7uf R/W | R/W 1206 | NPO / X7R/X5R/X7S/X6S / Y5V | / | C10uf R, C10uf R/W | R/W 1210 | NPO / X7R/X5R/X7S/X6S / Y5V | / | / | R Soldering method: RReflow Soldering, WWave Soldering | |||||||||||
| 10 The temperature profile for soldering | While in preheating, keep the temperature difference between soldering temperature and surface temperature of chips as: T150. | |||||||||||
2509251626_AIDE-CAPACITOR-0805X7R472K101NT_C48579636.pdf
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