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Specifications
Voltage Rating:
500V
Capacitance:
4.7nF
Temperature Coefficient:
X7R
Tolerance:
±10%
Mfr. Part #:
0805X7R472K501NT
Model Number:
0805X7R472K501NT
Package:
0805
Key Attributes
Product Description
Product Overview
This product is a Multi-layer Ceramic Capacitor (MLCC) designed for high-voltage applications. It is suitable for coupling, wave filtering, and resonant functions in various power supply and electronic circuits, including switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamps. The MLCCs are available in a range of sizes and temperature characteristics, offering reliable performance under specified conditions.
Product Attributes
- Material: Ceramic dielectric, Inner electrode, Outer electrode, Nickle layer, Tin layer
- Terminal Composition: Au/Ag-Ni-Sn (From the inside out)
- Certifications: RoHS compliant, REACH compliant
Technical Specifications
| Item | Description | Specification/Requirement | Testing Method |
|---|---|---|---|
| 1. Application Field | Coupling, wave filtering, resonant in high voltage circuits, switch power supplier, AC-DC power charger, DC-DC power charger, networking/Communication interface, LCD backlight unit power supplier, amperite of energy saving lamps, etc. (Medium and High voltage MLCC). | ||
| Testing Condition: Normal Condition: Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa Relative Condition: Temperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa | |||
| 2. Part Number Description | Example: 1812 X7R 684 M 251 N T Dimension Code (e.g., 0201, 0402, 0603, 0805, 1206, 1210, 1808, 1812, 1825, 2211, 2225) Temperature Characteristic (C0G, X7R, X5R) Nominal Electrostatic Capacity (e.g., 8R0, 100, 101 in pF) Tolerance of Electrostatic Capacity (B, C, D, F, G, J, K, M, Z) Rated Voltage (DC) (e.g., 250, 251, 252 in V) Terminal Composition (Au/Ag-Ni-Sn) Packing (T: Tape/Reel, P: Bag packing) | ||
| 3. Construction | Ceramic dielectric, Inner electrode, Outer electrode, Nickle layer, Tin layer | ||
| 4. Dimension | Part Number Dimension (mm) See detailed table in source document for specific codes (0201 to 2225) and their L, W, T, WB dimensions. | ||
| Example Dimensions (mm): 0201 (0603): L 0.600.10, W 0.300.05, T 0.300.05, WB 0.100.05 0402 (1005): L 1.000.15, W 0.500.15, T 0.500.10, WB 0.200.10 0603 (1608): L 1.600.20, W 0.800.15, T 0.800.15, WB 0.300.10 0805 (2012): L 2.000.20, W 1.250.20, T 0.800.20, WB 0.500.20 1206 (3216): L 3.200.30, W 1.600.30, T 1.000.20, WB 0.600.30 1210 (3225): L 3.200.30, W 2.500.30 (2.70), T 0.800.30 1812 (4532): L 4.500.40, W 3.200.30 (3.50), T 0.800.30 | |||
| 5. Specification and Testing Method | Temperature | -55~+125 | Naked eye (Visual inspection), Digital calliper |
| Visual/Dimension | 1. No Damage 2. Dimension meet Spec | Naked eye (Visual inspection), Digital calliper | |
| Static Capacity | Meet standard specification and tolerance (NPO, X7R/X7T/X7P characteristics) | Frequency and Voltage dependent, refer to source document for details. | |
| Dissipation Factor (DF) | See Note 1 and source document for specific values based on characteristic and capacitance. | Frequency and Voltage dependent, refer to source document for details. | |
| IR Insulation Resistance | NPO: 50000M, C10nF; IR*Cr500S, C>10nF X7R/X7T/X7P: IR10000M, C25nF; IR*Cr100S, C>25nF | Testing condition: Rated voltage, Time: 605s, Humidity: 75%, Temperature: 255, Current: 50mA | |
| Hi-pot (DC) | No dielectric breakdown or damage. Voltage multiplier based on rated voltage (Ur). | Voltage Raising time: 110S, Voltage maintaining time: 2S | |
| Solderability | Soldering area 90%, No damage | Pre-heating: 80-120, 10-30s; Solder: 2455, 20.5s | |
| Resistance to the heat of soldering | No damage, soldering area 90% | Pre-heating: 100-200, 102s; Soldering: 2655, 51s. Cleaning, Room temperature, 242 hours. | |
| Electrostatic Capacity Change Rate | NPO: 0.5% or 0.5pF X7R: 15% X7T: -33% C/C 22% X7P: 10% | Pre-heating 150 1hour, then 48 hours under normal conditions. | |
| Flexural Strength | No damage. Electrostatic capacity change rate 10% | Base board: Al2O3 /PCB, Thickness: 1.6mm, Length: 100mm, Width: 40mm, Flexural depth: 1mm, Bend speed: 0.5mm/sec. | |
| Terminal Bonding Strength | No visual damage | Applied Force: 5N, Duration: 101S | |
| Thermal Shock | NPO: 2.5% or 0.25pF X7R/X7P: 0.5% X7T: 10% | 5 cycles, testing after 242 hours at normal temp & humidity. | |
| Temperature Moisture Exposure | Visual: No damage Capacity Change Rate: NPO 2% or 1pF; X7R/X7T/X7P 10% DF: 2 times initial standard IR: NPO 2500M or IR*Cr25S; X7R/X7T/X7P 1000M or IR*Cr25S | Temperature: 402, Humidity: 90~95%RH, Time: 50024 hours. Test after 242 hours at normal temp & humidity. | |
| High Temperature Exposure | Visual: No damage Capacity Change Rate: NPO 2% or 1pF; X7R/X7T/X7P 20% DF: 2 X initial standard IR: NPO 4000M or IR*Cr40S; X7R/X7T/X7P 2000M or IR*Cr50S | Temperature: 1253, Time: 100048 hours. Voltage dependent. Test after 48 hours under normal conditions. | |
| PCB Flexural Strength | No crack and other defect | Soldering MLCC on PCB, pressing direction based on diagram. See source document for size details (0805 to 2220). | |
| 6. Embossed Plastic Taping | Details for 0805 to 1812 types, including tape size dimensions (A, B, C, D, E, F, G, H, J, T). | ||
| 7. Paper Tape Reel Packing | Details for 1005, 0201, 0402, 0603, 0805, 1206 types, including paper size dimensions (W1, L1, D, C, B, P1, P2, P0, d, t) and general dimensions (A, B, C, D, E, F, G, H, J, T). | ||
| 8. Reel Dimensions | 7' REEL: 1782.0, 3.0, 130.5, 210.5, 21 or Bigger, 1010.5, 12max 13' REEL: 3302.0, 3.0, 130.5, 210.5, 21 or Bigger, 1010.5, 12max | ||
| 9. Taping Specification | Top tape peeling strength: 0.1N < peeling strength < 0.7N. No paper dirty remains on the scotch when peeling. | ||
| 10. Packing Quantity | See source document for quantities per size and packing type (Paper T/R, Plastic T/R). Examples: 0603 Paper T/R: 4000 Pcs 0805 Plastic T/R: 3000 Pcs | ||
| 11. Precautions For Use | Soldering Profile: Follow temperature profile to avoid cracks. Manual Soldering: Handle carefully to avoid thermal cracks and damage. Optimum Solder Amount for Reflow Soldering: Refer to adjacent graphs. Recommended Soldering Method: RReflow Soldering, WWave Soldering. See source document for details by size, characteristic, voltage, and capacitance. | ||
| 12. Soldering Temperature Profile | Preheating temperature difference T 150. | ||
2509251626_AIDE-CAPACITOR-0805X7R472K501NT_C48579638.pdf
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