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Specifications
Voltage Rating:
25V
Capacitance:
470nF
Temperature Coefficient:
X7R
Tolerance:
±10%
Mfr. Part #:
0805X7R474K250NT
Model Number:
0805X7R474K250NT
Package:
0805
Key Attributes
Product Description
Product Overview
This product is a Multi-layer Ceramic Capacitor (MLCC) designed for high-voltage applications. It is utilized for coupling, wave filtering, and resonant functions in various power supply circuits, including switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamps. The MLCCs are available in medium and high voltage ratings and are manufactured with a ceramic dielectric, inner and outer electrodes, nickel, and tin layers.
Product Attributes
- Terminal Composition: Au/Ag-Ni-Sn (From the inside out)
- RoHS/REACH Compliance: Meets standards
Technical Specifications
| Item | Description | Specification/Requirement | Testing Method | ||
|---|---|---|---|---|---|
| Application Field | Coupling, wave filtering, resonant in high voltage circuits such as switch power suppliers, AC-DC power chargers, DC-DC power chargers, networking/Communication interfaces, LCD backlight unit power suppliers, amperite of energy saving lamps, etc. (Medium and High voltage MLCC). | ||||
| Testing Conditions | |||||
| Normal Condition | Temperature: 15~35, Humidity: 45~75%RH, Normal atmosphere: 86~106kPa | (No special requirements) | |||
| Relative Condition | Temperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa | For data not matching testing specification | |||
| Part Number Description | 1. Dimension Code | 0201 (0.02*0.01 inch / 0.50*0.25 mm), 0402 (0.04*0.02 inch / 1.00*0.50 mm), 0603 (0.06*0.03 inch / 1.60*0.80 mm), 0805 (0.08*0.05 inch / 2.00*1.25 mm), 1206 (0.12*0.06 inch / 3.20*1.60 mm), 1210 (0.12*0.10 inch / 3.20*2.50 mm), 1808 (0.18*0.08 inch / 4.50*2.00 mm), 1812 (0.18*0.12 inch / 4.50*3.20 mm), 1825 (0.18*0.25 inch / 4.50*6.30 mm), 2211 (0.22*0.11 inch / 5.70*2.8 mm), 2225 (0.22*0.25 inch / 5.70*6.30 mm) | |||
| 2. Temperature Characteristic | C0G (030 PPM/), X7R (15%), X5R (15%) | ||||
| 3. Nominal Electrostatic Capacity | 8R08.0, 10010, 101100 (pF) | ||||
| 4. Tolerance of Electrostatic Capacity | B:0.1pF, C:0.25pF, D:0.5pF, F:1%, G: 2%, J:5%, K:10%, M:20%, Z:+80%/-20% | ||||
| 5. Rated Voltage (DC) | 250 25, 251 250, 252 2500 (V) | ||||
| 6. Terminal Composition | Au/Ag-Ni-Sn (From the inside out) | ||||
| 7. Packing | T Tape/Reel, P Bag packing (PE) | ||||
| Construction and Dimension | Construction | 1 Ceramic dielectric, 2 Inner electrode, 3 Outer electrode, 4 Nickel layer, 5 Tin layer | |||
| Dimension (mm) | Part Number | L | W | T | WB |
| 0201 (0603) | 0.600.10 | 0.300.05 | 0.300.05 | 0.100.05 | |
| 0402 (1005) | 1.000.15 | 0.500.15 | 0.500.10 | 0.200.10 | |
| 0603 (1608) | 1.600.20 | 0.800.15 | 0.800.15 | 0.300.10 | |
| 0805 (2012) | 2.000.20 | 1.250.20 | 0.800.20 | 0.500.20 | |
| 1206 (3216) | 3.200.30 | 1.600.30 | 1.000.20 | 0.600.30 | |
| 1210 (3225) | 3.200.30 | 2.500.30 | 2.70 | 0.800.30 | |
| 1808 (4520) | 4.500.40 | 2.000.20 | 2.70 | 0.800.30 | |
| 1812 (4532) | 4.500.40 | 3.200.30 | 3.50 | 0.800.30 | |
| 1825 (4563) | 4.500.40 | 6.300.50 | 3.50 | 0.800.30 | |
| 2220 (5750) | 5.700.50 | 5.000.50 | 3.50 | 1.000.40 | |
| 2225 (5763) | 5.700.50 | 6.300.50 | 6.20 | 1.000.40 | |
| Specification and Testing Method | 1. Temperature | -55~+125 | |||
| 2. Visual/Dimension | 1. No Damage, 2. Dimension meet Spec. (Visual inspection with naked eye, Digital calliper) | ||||
| 3. Static Capacity | Meet standard specification and tolerance. (NPO, X7R/X7T/X7P characteristics specified with frequency and voltage) | ||||
| 4. Dissipation Factor (DF) | NPO Characteristic: DF0.56, Cr5 pF; DF1.5[(150/Cr)+7]10-4 (5pFCr50pF); DF0.15%, (50pFCr). X7R/X7T/X7P characteristic: See Note 1. (Specified with frequency and voltage) | ||||
| 5. IR Insulation Resistance | NPO Characteristic: IR50000M,C10nF; IR*Cr500S,C10nF. X7R/X7T/X7P Characteristic: IR10000M,C25nF; IR*Cr100S,C25nF. (Testing condition: Rated voltage, Time: 605s, Humidity: 75%, Temperature: 255, Current: 50mA) | ||||
| 6. Hi-pot (DC) | No dielectric breakdown or damage. (Ur=100V, 2.5 x rated voltage; Ur=200V/250V, 2.0 x rated voltage; Ur=450/500/630V, 1.5 x rated voltage; 1KVUr2KV, 1.2 x rated voltage; 2KVUr, 1.1 x rated voltage. Voltage Raising time: 110S, Voltage maintaining time: 2S) | ||||
| 7. Solderability | Soldering area90%, Visual-No damage. (Pre-heating temperature 80-120, time 10-30s, lead free solder, flux. Soldering temperature 2455, Solder time 20.5s) | ||||
| 8. Resistance to the heat of soldering | Visual-No damage, soldering area90%. (Pre-heating temperature 100-200, time 102 s, soldering temperature: 2655, Soldering time: 51s. Cleaning with solvent. Room temperature, time: 242 hours.) | ||||
| 9. Flexural Strength | No damage. (Base board: Al2O3 /PCB, PCB dimension: Thickness: 1.6mm, Length: 100mm, Width: 40mm, Flexural depth: 1mm, Bend speed: 0.5mm/sec. Test under flexural status. Electro static capacity change rate: C/C10%) | ||||
| 10. Terminal Bonding Strength | No visual damage. (Applied Force: 5N, Duration: 101S) | ||||
| 11. Thermal Shock | NPO Characteristic: C/C2.5% or 0.25pF (larger reading). X7R/X7P- characteristic: C/C0.5%. X7T characteristic: C/C10%. (Run 5 cycles Thermal shock. Test after place 242 hours normal temp & humidity) | ||||
| 12. Temperature Moisture Exposure | Visual No visual damage. (Temperature 402, Humidity 90~95%RH, time 500+24 hours. Electrostatic capacitance change rate: NPO characteristic: C/C2% or 1pF (larger reading); X7R/X7T/X7P characteristic: C/C10%. DF 2 times initial standard. IR: NPO characteristic: IR2500M or IR*Cr25S (Lower reading); X7R/X7T/X7P: IR1000M or IR*Cr25S (Lower reading)) | ||||
| 13. High Temperature Exposure | Visual No visual damage. (Temperature 1253, Time 100048 hours. Voltage: 100VV250V 2x Rated voltage; 250VV1KV 1.5x rated voltage; 1KVV 1.2x rated voltage. Electrostatic capacitance change rate: NPO: C/C2% or 1pF (larger reading); X7R/X7T/X7P: C/C20%. DF 2 X initial standard. IR: NPO: IR4000M or IR*Cr40S (Lower reading); X7R/X7T/X7P: IR2000M or IR*Cr50S (Lower reading)) | ||||
| 14. PCB Flexural Strength | No crack and other defect. (IR Soldering the MLCC on the PCB, then pressing direction base on the photo. SIZE A B C: 0805(2012) 1.2 4 1.65; 1206(3216) 2.2 5 2; 1210(3225) 2.2 5 2.9; 1812(4532) 3.5 7 3.7; 2220(5750) 4.5 8 5.6) | ||||
| EMBOSSED PLASTIC TAPING | Embossed tape reel packing for 0805(2012)~1812(4532) type | Dimensions (A, B, C, D, E, F, G, H, J, T) specified for 0805, 1206, 1210, 1808, 1812 sizes. | |||
| Paper tape reel packing for 10050402~12063216 | Dimensions (W1, L1, D, C, B, P1, P2, P0, d, t) specified for 1005, 0201, 0402 sizes. Dimensions (A, B, C, D, E, F, G, H, J, T) specified for 0603, 0805, 1206 sizes. | ||||
| Reel Dimensions | 7REEL (1782.0), 13REEL (3302.0) | ||||
| Taping specification | Top tape peeling strength | (a) Paper Taping Reel type: Specified values. (b) Embossed Taping Standard: 0.1N < peeling strength < 0.7N | |||
| Packing quantity | Paper T/R (Pcs) | 0603: 4000, 0805: 4000 | |||
| Plastic T/R (Pcs) | 0805: 3000 (T1.35mm); 1206: 3000 (T1.60mm), 2000 (T1.60mm); 1210: 2000; 1808: 1000 (T1.85mm), 800 (T1.85mm); 1812: 500 | ||||
| Precautions For Use | MLCC may fail in short circuit mode under severe conditions. Follow "precautions for safety" and "Application Notes". Consider soldering profile, manual soldering risks, optimum solder amount, and recommended soldering methods. | ||||
| Recommended Soldering Method | Specified for different sizes (1005, 0201, 0402, 0603, 0805, 1206, 1210) and temperature characteristics (NPO, X7R/X5R/X7S/X6S, Y5V). RReflow Soldering, WWave Soldering. | ||||
| Soldering Temperature Profile | Keep temperature difference between soldering temperature and surface temperature of chips as T150 during preheating. | ||||
2509251626_AIDE-CAPACITOR-0805X7R474K250NT_C48579644.pdf
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