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Specifications
Voltage Rating:
50V
Capacitance:
8.2nF
Temperature Coefficient:
X7R
Tolerance:
±10%
Mfr. Part #:
0805X7R822K500NT
Model Number:
0805X7R822K500NT
Package:
0805
Key Attributes
Product Description
Product Overview
This product is a Multi-layer Ceramic Capacitor (MLCC) designed for high-voltage applications. It is ideal for coupling, wave filtering, and resonant functions in various power supply and electronic circuits, including switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamps. Available in a range of standard sizes and dielectric characteristics, these MLCCs offer reliable performance under specified electrical and environmental conditions.
Product Attributes
- Dielectric Characteristics: C0G (030 PPM/), X7R (15%), X5R (15%)
- Terminal Composition: Au/Ag-Ni-Sn (From the inside out)
- Packing Options: Tape/Reel (T), Bag packing (P)
- Compliance: ROHS/REACH compliant
Technical Specifications
| Item | Description/Specification | Testing Method/Conditions |
|---|---|---|
| Application Field | ||
| Coupling, wave filtering, resonant in high voltage circuits, switch power supplier, AC-DC power charger, DC-DC power charger, networking/Communication interface, LCD backlight unit power supplier, amperite of energy saving lamps, etc. (Medium and High voltage MLCC). | ||
| Testing Conditions | ||
| Normal Condition | Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa | (No special requirements) |
| Relative Condition | Temperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa | For data not matching testing specification |
| Part Number Description Example: 1812 X7R 684 M 251 N T | ||
| 1. Dimension Code | 0201, 0402, 0603, 0805, 1206, 1210, 1808, 1812, 1825, 2211, 2225 | See Page 1 for L*W (inch/mm) details |
| 2. Temperature Characteristic | C0G (030 PPM/), X7R (15%), X5R (15%) | |
| 3. Nominal Electrostatic Capacity | 8R08.0, 10010, 101100 (pF) | |
| 4. Tolerance of Electrostatic Capacity | B:0.1pF, C:0.25pF, D:0.5pF, F:1%, G: 2%, J:5%, K:10%, M:20%, Z:+80%/-20% | |
| 5. Rated Voltage (DC) | 25025, 251250, 2522500 (V) | |
| 6. Terminal Composition | Au/Ag-Ni-Sn | (From the inside out) |
| 7. Packing | T Tape/Reel, P Bag packing(PE) | |
| Construction | ||
| 1. Ceramic dielectric | ||
| 2. Inner electrode | ||
| 3. Outer electrode | ||
| 4. Nickle layer | ||
| 5. Tin layer | ||
| Dimension (mm) | ||
| Part number | L, W, T, WB | See Page 2 for specific values and tolerances |
| Specification and Testing Method | ||
| 1. Temperature | -55~+125 | |
| 2. Visual/ Dimension | 1. No Damage, 2. Dimension meet Spec | Naked eye (Visual inspection), Digital calliper |
| 3. Static Capacity | Meet standard specification and tolerance | See Page 3 for NPO and X7R/X7T/X7P characteristic testing details |
| 4. Dissipation Factor (DF) | See Page 3 for NPO and X7R/X7T/X7P characteristic specifications | See Page 3 for testing frequencies and voltages |
| 5. IR Insulation Resistance | NPO: IR50000M, C10nF; IR*Cr500S, C10nF X7R/X7T/X7P: IR10000M, C25nF; IR*Cr100S, C25nF | Testing condition: Rated voltage, Time: 605s, Humidity: 75%, Temperature: 255, Current: 50mA |
| 6. Hi-pot (DC) | No dielectric breakdown or damage | See Page 3 for Ur values and test conditions |
| 7. Solderability | Soldering area90% | Pre-heating temperature 80-120, time 10-30s, lead free solder, flux. Soldering temperature 2455, Solder time 20.5s. |
| 8. Resistance to the heat of soldering | No visual damage, soldering area90% | Pre-heating temperature 100-200, time 102 s, soldering temperature: 2655, Soldering time: 51s. Cleaning with solvent. Room temperature, time: 242 hours. |
| 9. Flexural Strength | No damage, Electro static capacity change rate C/C10% | Base board: Al2O3 /PCB, PCB dimension: Thickness: 1.6mm, Length: 100mm, Width: 40mm, Flexural depth: 1mm, Bend speed: 0.5mm/sec. |
| 10. Terminal Bonding Strength | No visual damage | Applied Force: 5N, Duration: 101S |
| 11. Thermal Shock | See Page 6 for capacity change rate and characteristic specifications | Run 5 cycles, Test after 242 hours normal temp & humidity |
| 12. Temperature Moisture Exposure | See Page 6 for capacity change rate, DF, and IR specifications | Temperature 402, Humidity 90~95%RH, time 50024 hours. Test after 242 hours normal temp & humidity. |
| 13. High Temperature Exposure | See Page 6 for capacity change rate, DF, and IR specifications | Temperature 1253, Time 100048 hours. Test after 48 hours under normal pressure & temperature. |
| 14. PCB Flexural Strength | No crack and other defect | IR Soldering the MLCC on the PCB, then pressing direction based on photo. See Page 7 for SIZE A, B, C values. |
| Embossed Plastic Taping Dimensions (unit: mm) | ||
| Code | Tape size A, B, C, D, E, F, G, H, J, T | See Page 8 for specific values |
| Paper Tape Reel Packing Dimensions (unit: mm) | ||
| Code | Paper size W1, L1, D, C, B, P1, P2, P0, d, t | See Page 9 for specific values |
| Reel Dimensions (unit: mm) | ||
| 7REEL | 1782.0, 3.0, 130.5, 210.5, 21 or Bigger, 1010.5, 12max | |
| 13REEL | 3302.0, 3.0, 130.5, 210.5, 21 or Bigger, 1010.5, 12max | |
| Taping Specification | ||
| Top tape peeling strength | 0.1N < peeling strength < 0.7N | No paper dirty remains on the scotch when peeling, and sticks to top and bottom tape. |
| Packing Quantity (Pcs) | ||
| Dimension | Paper T/R | Plastic T/R |
| 0603 | 4000 | - |
| 0805 | 4000 | 3000 (T1.35mm) |
| 1206 | - | 3000 (T1.60mm), 2000 (T1.60mm) |
| 1210 | - | 3000 (T1.85mm), 1000 (T1.85mm) |
| 1808 | - | 2000 |
| 1812 | - | 1000 |
| 1812 | - | 800 |
| 500 | ||
| Recommended Soldering Method | ||
| Size | Temperature Characteristics | Soldering Method |
| 1005 | NPO / X7R/X5R/X7S/X6S | R |
| 0201 | NPO / X7R/X5R/X7S/X6S / Y5V | R |
| 0402 | NPO / X7R/X5R/X7S/X6S / Y5V | R |
| 0603 | NPO / X7R/X5R/X7S/X6S / Y5V | R/W (See Page 13 for capacitance details) |
| 0805 | NPO / X7R/X5R/X7S/X6S / Y5V | R/W (See Page 13 for capacitance details) |
| 1206 | NPO / X7R/X5R/X7S/X6S / Y5V | R/W (See Page 13 for capacitance details) |
| 1210 | NPO / X7R/X5R/X7S/X6S / Y5V | R |
| Soldering method | RReflow Soldering, WWave Soldering | |
2509251626_AIDE-CAPACITOR-0805X7R822K500NT_C48579651.pdf
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