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quality Multi Layer Ceramic Capacitor AIDE CAPACITOR 1206C0G131J102NT for High Voltage Circuit Applications factory
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quality Multi Layer Ceramic Capacitor AIDE CAPACITOR 1206C0G131J102NT for High Voltage Circuit Applications factory
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Specifications
Voltage Rating:
1kV
Capacitance:
130pF
Temperature Coefficient:
C0G
Tolerance:
±5%
Mfr. Part #:
1206C0G131J102NT
Model Number:
1206C0G131J102NT
Package:
1206
Key Attributes
Product Description

Product Overview

This product is a Multi-Layer Ceramic Capacitor (MLCC) designed for high-voltage applications. It is suitable for coupling, wave filtering, and resonant functions in various power supply and electronic circuits, including switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamps. The MLCCs are available in a range of sizes and temperature characteristics, ensuring reliable performance in demanding environments.

Product Attributes

  • Material: Ceramic dielectric, Inner electrode, Outer electrode, Nickel layer, Tin layer
  • Terminal Composition: Au/Ag-Ni-Sn (From the inside out)
  • Certifications: RoHS compliant, REACH compliant

Technical Specifications

Item Description Specification/Requirement Testing Method
1 Application Field Coupling, wave filtering, resonant in high voltage circuits (switch power supplier, AC-DC power charger, DC-DC power charger, networking/Communication interface, LCD backlight unit power supplier, amperite of energy saving lamps, etc.) N/A
2.1 Normal Testing Condition Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa N/A
2.2 Relative Testing Condition Temperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa N/A
3 Part Number Description Example: 1812 X7R 684 M 251 N T N/A
3.1 Dimension Code 0201, 0402, 0603, 0805, 1206, 1210, 1808, 1812, 1825, 2211, 2225 N/A
3.2 Temperature Characteristic C0G (030 PPM/), X7R (15%), X5R (15%) N/A
3.3 Nominal Electrostatic Capacity 8R08.0, 10010, 101100 (pF) N/A
3.4 Tolerance of Electrostatic Capacity B:0.1pF, C:0.25pF, D:0.5pF, F:1%, G: 2%, J:5%, K:10%, M:20%, Z:+80%/-20% N/A
3.5 Rated Voltage (DC) 250 25, 251 250, 252 2500 (V) N/A
3.6 Terminal Composition Au/Ag-Ni-Sn (From the inside out) N/A
3.7 Packing T Tape/Reel, P Bag packing(PE) N/A
4.1 Construction 1 Ceramic dielectric, 2 Inner electrode, 3 Outer electrode, 4 Nickel layer, 5 Tin layer N/A
4.2 Dimension (mm)
Part NumberDimension (mm) LWTWB
0201 (0603)0.600.100.300.050.300.050.100.05
0402 (1005)1.000.150.500.150.500.100.200.10
0603 (1608)1.600.200.800.150.800.150.300.10
0805 (2012)2.000.201.250.200.800.201.000.20
1206 (3216)3.200.301.600.301.000.201.250.20
1210 (3225)3.200.302.500.302.700.800.30
1808 (4520)4.500.402.000.202.700.800.30
1812 (4532)4.500.403.200.303.500.800.30
1825 (4563)4.500.406.300.503.500.800.30
2220 (5750)5.700.505.000.503.501.000.40
2225 (5763)5.700.506.300.506.201.000.40
N/A
5.1 Temperature -55~+125 Naked eye (Visual inspection), Digital calliper
5.2 Visual/Dimension 1, No Damage; 2, Dimension meet Spec Naked eye (Visual inspection), Digital calliper
5.3 Static Capacity
  • NPO characteristic: 1000pF 1MHz10% 1.0 0.2Vrms; 1000 pF 1KHz10% 1.0 0.2Vrms
  • X7R/X7T/X7P characteristic: 10uF 1KHz10% 1.0 0.2Vrms; 10uF 120Hz24 0.5 0.1Vrms
 N/A
5.4 Dissipation Factor (DF)
  • NPO Characteristic: DF0.56, Cr5 pF; DF1.5[(150/Cr)+7]10-4 (5pFCr50pF); DF0.15%, (50pFCr)
  • X7R/X7T/X7P Characteristic: Cr10uF, Test frequency 110%KHz,Voltage 1V0.1rms; Cr10uF, Frequency 12024Hz, Voltage 0.5V0.1rms
 N/A
5.5 IR Insulation Resistance
  • NPO Characteristic: IR50000M,C10nF; IR*Cr500S,C10nF
  • X7R/X7T/X7P Characteristic: IR10000M,C25nF; IR*Cr100S,C25nF
 Rated voltage, Time: 605s, Humidity: 75%, Temperature: 255, Current: 50mA
5.6 Hi-pot (DC) No dielectric breakdown or damage. Ur=100V, 2.5 x rated voltage; Ur=200V/250V, 2.0 x rated voltage; Ur=450/500/630V, 1.5 x rated voltage; 1KVUr2KV, 1.2 x rated voltage; 2KVUr, 1.1 x rated voltage Voltage Raising time: 110S, Voltage maintaining time: 2S
5.7 Solderability Soldering area90% Pre-heating temperature 80-120, time 10-30s, lead free solder, flux. Soldering temperature 2455, Solder time 20.5s
5.8 Resistance to the heat of soldering No visual damage, soldering area90% Pre-heating temperature 100-200, time 102 s, soldering temperature :2655, Soldering time:51s. Cleaning with solvent. Room temperature, time :242 hours.
5.9 Electrostatic capacity change rate
  • NPO Characteristic: C/C0.5% or 0.5pF (larger reading)
  • X7R: C/C15%
  • X7T: -33% C/C22%
  • X7P: C/C10%
 N/A
5.10 Flexural Strength No damage. Electro static capacity change rate C/C10% Base board: Al2O3 /PCB. PCB dimension: Thickness: 1.6mm, Length: 100mm, Width: 40mm. Flexural depth: 1mm. Bend speed: 0.5mm/sec.
5.11 Terminal Bonding Strength No visual damage Applied Force: 5N, Duration: 101S
5.12 Thermal Shock
  • NPO Characteristic: C/C2.5% or 0.25pF (larger reading)
  • X7R/X7P characteristic: C/C0.5%
  • X7T characteristic: C/C10%
 Pre-condition(X7R h characteristic): Upper limit temperature 1hour, place 241 hours, start to testing. Run 5 cycles Thermal shock. Test it after place 242 hours normal temp & humidity.
5.13 Temperature Moisture Exposure
  • NPO characteristic: C/C2% or 1pF (larger reading)
  • X7R/X7T/X7P characteristic: C/C10%
  • DF 2 times initial standard
  • IR (NPO): IR2500M or IR*Cr25S (Lower reading)
  • IR (X7R/X7T/X7P): IR1000M or IR*Cr25S (Lower reading)
 Temperature 402, Humidity 90~95%RH, time 50024 hours. Test it after place 242 hours normal temp & humidity.
5.14 High Temperature Exposure
  • NPO: C/C2% or 1pF (larger reading)
  • X7R/X7T/X7P: C/C20%
  • DF 2 X initial standard
  • IR (NPO): IR4000M or IR*Cr40S (Lower reading)
  • IR (X7R/X7T/X7P): IR2000M or IR*Cr50S (Lower reading)
 Temperature 1253, Time 100048 hours. Voltage: 100VV250V 2x Rated voltage; 250VV1KV 1.5x rated voltage; 1KVV 1.2x rated voltage. Test it after place 48 hours under normal pressure & temperature. Charging and discharging current 50mA Max.
5.15 PCB Flexural Strength No crack and other defect Soldering the MLCC on the PCB, then pressing direction base on the photo.
6.1 Embossed Plastic Taping
CodeTape size ABCDEFGHJT
08051.55 0.202.35 0.208.00 0.203.50 0.051.75 0.104.00 0.102.00 0.104.00 0.101.50 -0/+0.101.50 Max
12061.95 0.203.60 0.208.00 0.203.50 0.051.75 0.104.00 0.102.00 0.104.00 0.11.50 -0/+0.101.85 Max
12102.70 0.103.42 0.108.00 0.103.50 0.051.75 0.104.00 0.102.00 0.054.00 0.101.55 -0/+0.103.2 Max
18082.20 0.104.95 0.1012.00 0.105.50 0.051.75 0.104.00 0.102.00 0.054.00 0.101.50 -0/+0.103.0 Max
18123.66 0.104.95 0.1012.00 0.105.50 0.051.75 0.108.00 0.102.00 0.054.00 0.101.55 -0/+0.104.0 Max
N/A
6.2 Paper Tape Reel Packing
CodePaper size W1L1DCBP1P2P0dt
10050.24 0.020.45 0.028.00 0.103.50 0.051.75 0.102.00 0.052.00 0.054.00 0.101.50 -0/+0.100.30 Below
02010.37 0.100.67 0.108.00 0.103.50 0.051.75 0.102.00 0.052.00 0.054.00 0.101.50 -0/+0.100.80 Below
04020.65 0.101.15 0.108.00 0.103.50 0.051.75 0.102.00 0.052.00 0.054.00 0.101.50 -0/+0.100.80 Below
CodePaper size ABCDEFGHJT
06031.10 0.101.90 0.108.00 0.103.50 0.051.75 0.104.00 0.102.00 0.104.00 0.101.50 -0/+0.101.10 Max
08051.45 0.152.30 0.158.0 0.153.50 0.051.75 0.104.00 0.102.00 0.104.00 0.101.50 -0/+0.101.10 Max
12061.80 0.203.40 0.208.00 0.203.50 0.051.75 0.104.00 0.102.00 0.104.00 0.101.50 -0/+0.101.10 Max
N/A
6.3 Reel Dimensions 7REEL: 1782.0, 3.0, 130.5, 210.5, 21 or Bigger, 1010.5, 12max; 13REEL: 3302.0, 3.0, 130.5, 210.5, 21 or Bigger, 1010.5, 12max N/A
6.4 Taping Specification Top tape peeling strength: 0.1N < peeling strength < 0.7N. No paper dirty remains on the scotch when peeling, and sticks to top and bottom tape. N/A
7.1 ROHS Compliance Meet the standard N/A
7.2 REACH Compliance Meet the standard N/A
8 Precautions For Use MLCC may fail in a short circuit mode when subjected to severe conditions beyond specified ratings. Follow safety precautions and application notes. N/A
9 Recommended Soldering Method
SizeTemperature CharacteristicsRated VoltageCapacitanceSoldering Method
1005NPO//R
1005X7R/X5R/X7S/X6S//R
0201NPO//R
0201X7R/X5R/X7S/X6S//R
0201Y5V//R
0402NPO//R
0402X7R/X5R/X7S/X6S//R
0402Y5V//R
0603NPO//R/W
0603X7R/X5R/X7S/X6S/C1ufR
0603X7R/X5R/X7S/X6S/C1ufR/W
0603Y5V/C1ufR
0603Y5V/C1ufR/W
0805NPO//R/W
0805X7R/X5R/X7S/X6S/C4.7ufR
0805X7R/X5R/X7S/X6S/C4.7ufR/W
0805Y5V/C1ufR
0805Y5V/C1ufR/W
1206NPO//R/W
1206X7R/X5R/X7S/X6S/C10ufR
1206X7R/X5R/X7S/X6S/C10ufR/W
1206Y5V/C10ufR
1206Y5V/C10ufR/W
1210NPO//R
1210X7R/X5R/X7S/X6S//R
1210Y5V//R

Soldering method: RReflow Soldering, WWave Soldering

 N/A
10 Soldering Temperature Profile Keep the temperature difference between soldering temperature and surface temperature of chips as: T150. N/A

2509251626_AIDE-CAPACITOR-1206C0G131J102NT_C48579656.pdf

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