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Specifications
Voltage Rating:
1kV
Capacitance:
18pF
Temperature Coefficient:
C0G
Tolerance:
±5%
Mfr. Part #:
1206C0G180J102NT
Model Number:
1206C0G180J102NT
Package:
1206
Key Attributes
Product Description
Product Overview
These Multi-Layer Ceramic Capacitors (MLCCs) are designed for high-voltage applications, including coupling, wave filtering, and resonant functions. They are suitable for use in switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamps. Available in various sizes and temperature characteristics, these MLCCs offer reliable performance in demanding electrical environments.
Product Attributes
- Material: Ceramic dielectric, Inner electrode, Outer electrode, Nickel layer, Tin layer
- Terminal Composition: Au/Ag-Ni-Sn (From the inside out)
- Certifications: ROHS/REACH compliance
Technical Specifications
| Item | Description/Specification | Testing Method | ||
|---|---|---|---|---|
| Application Field | ||||
| Coupling, wave filtering, resonant in high voltage circuits, switch power supplier, AC-DC power charger, DC-DC power charger, networking/Communication interface, LCD backlight unit power supplier, amperite of energy saving lamps, etc. (Medium and High voltage MLCC) | ||||
| Testing Conditions | ||||
| Normal Condition | Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa | |||
| Relative Condition | Temperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa | |||
| Part Number Description Example: 1812 X7R 684 M 251 N T | ||||
| 1. Dimension Code | 0201, 0402, 0603, 0805, 1206, 1210, 1808, 1812, 1825, 2211, 2225 | |||
| 2. Temperature Characteristic | C0G (030 PPM/), X7R (15%), X5R (15%) | |||
| 3. Nominal Electrostatic Capacity | 8R08.0, 10010, 101100 (pF) | |||
| 4. Tolerance of Electrostatic Capacity | B:0.1pF, C:0.25pF, D:0.5pF, F:1%, G: 2%, J:5%, K:10%, M:20%, Z:+80%/-20% | |||
| 5. Rated Voltage (DC) | 250 25, 251 250, 252 2500 (V) | |||
| 6. Terminal Composition | Au/Ag-Ni-Sn (From the inside out) | |||
| 7. Packing | T Tape/Reel, P Bag packing (PE) | |||
| Construction | ||||
| 1 | Ceramic dielectric | |||
| 2 | Inner electrode | |||
| 3 | Outer electrode | |||
| 4 | Nickle layer | |||
| 5 | Tin layer | |||
| Dimension (mm) | ||||
| Part Number | L | W | T | WB |
| 0201 (0603) | 0.600.10 | 0.300.05 | 0.300.05 | 0.100.05 |
| 0402 (1005) | 1.000.15 | 0.500.15 | 0.500.10 | 0.200.10 |
| 0603 (1608) | 1.600.20 | 0.800.15 | 0.800.15 | 0.300.10 |
| 0805 (2012) | 2.000.20 | 1.250.20 | 0.800.20 | 0.500.20 |
| 1206 (3216) | 3.200.30 | 1.600.30 | 1.000.20 | 0.600.30 |
| 1210 (3225) | 3.200.30 | 2.500.30 | 2.70 | 0.800.30 |
| 1808 (4520) | 4.500.40 | 2.000.20 | 2.70 | 0.800.30 |
| 1812 (4532) | 4.500.40 | 3.200.30 | 3.50 | 0.800.30 |
| 1825 (4563) | 4.500.40 | 6.300.50 | 3.50 | 0.800.30 |
| 2220 (5750) | 5.700.50 | 5.000.50 | 3.50 | 1.000.40 |
| 2225 (5763) | 5.700.50 | 6.300.50 | 6.20 | 1.000.40 |
| Specification and Testing Method | ||||
| 1. Temperature | -55~+125 | |||
| 2. Visual/Dimension | 1. No Damage, 2. Dimension meet Spec | Naked eye (Visual inspection), Digital calliper | ||
| 3. Static Capacity | Meet standard specification and tolerance | NPO: 1MHz10%, 1.00.2Vrms (1000pF); 1KHz10%, 1.00.2Vrms (>1000pF). X7R/X7T/X7P: 1KHz10%, 1.00.2Vrms (10uF); 120Hz24, 0.50.1Vrms (>10uF) | ||
| 4. Dissipation Factor (DF) | NPO: DF0.56, Cr5 pF; DF1.5[(150/Cr)+7]10-4 (5pFCr50pF); DF0.15%, (50pFCr). X7R/X7T/X7P: See Note 1. | NPO: 110%MHz, 1V0.2rms (Cr1000pF); 110%KHz, 1V0.2rms (Cr1000pF). X7R/X7T/X7P: 110%KHz, 1V0.1rms (Cr10uF); 12024Hz, 0.5V0.1rms (Cr10uF). | ||
| 5. IR Insulation Resistance | NPO: IR50000M, C10nF; IR*Cr500S, C10nF. X7R/X7T/X7P: IR10000M, C25nF; IR*Cr100S, C25nF. | Rated voltage, Time: 605s, Humidity: 75%, Temperature: 255, Current: 50mA | ||
| 6. Hi-pot (DC) | Ur=100V,.......2.5 x rated voltage; Ur=200V/250V,.... 2.0 x rated voltage; Ur=450/500/630V,1.5 x rated voltage; 1KVUr2KV,.......1.2 x rated voltage; 2KVUr,...............1.1 x rated voltage | Voltage Raising time: 110S, Voltage maintaining time2S | ||
| 7. Solderability | soldering area90% | Pre-heating temperature 80-120, time 10-30s, lead free solder, flux. Soldering temperature 2455, Solder time 20.5s | ||
| 8. Resistance to the heat of soldering | Visual-No damage, soldering area90% | Pre-heating temperature 100-200, time 102 s, soldering temperature :2655, Soldering time:51s. Cleaning with solvent. Room temperature, time :242 hours. | ||
| 9. Flexural strength | No damage. Electro static capacity change rate C/C10% | Base boardAl2O3 /PCB. PCB dimension Thickness: 1.6mm, Length: 100mm, Width: 40mm. Flexural depth: 1mm, Bend speed: 0.5mm/sec. | ||
| 10. Terminal bonding strength | No visual damage | Applied Force: 5N, Duration: 101S | ||
| 11. Thermal shock | NPO: C/C2.5% or 0.25pF (larger reading). X7R/X7P: C/C0.5%. X7T: C/C10%. | Pre-condition(X7R h characteristic):Upper limit temperature 1hour, place 241 hours, start to testing. Run 5 cycles Thermal shock. Test it after place 242 hours normal temp & humidity. | ||
| 12. Temperature moisture exposure | Visual No visual damage. Capacity change rate: NPO: C/C2% or 1pF (larger reading). X7R/X7T/X7P: C/C10%. DF 2 times initial standard. IR: NPO: IR2500M or IR*Cr25S (Lower reading). X7R/X7T/X7P: IR1000M or IR*Cr25S (Lower reading). | Temperature 402, Humidity 90~95%RH, time 500+24 hours. Test it after place 242 hours normal temp & humidity. | ||
| 13. High temperature exposure | Visual No visual damage. Capacity change rate: NPO: C/C2% or 1pF (larger reading). X7R/X7T/X7P: C/C20%. DF 2 X initial standard. IR: NPO: IR4000M or IR*Cr40S (Lower reading). X7R/X7T/X7P: IR2000M or IR*Cr50S (Lower reading). | Temperature 1253, Time 100048 hours. Voltage: 100VV250V (2x Rated voltage), 250VV1KV (1.5x rated voltage), 1KVV (1.2x rated voltage). Test it after place 48 hours under normal pressure & temperature. | ||
| 14. PCB flexural strength | No crack and other defect | Soldering the MLCC on the PCB, then pressing direction base on the photo. | ||
| Packing Quantity | 7" Reel (Pcs) | 13" Reel (Pcs) | ||
| 0603 | 4000 | - | ||
| 0805 | 4000 | 3000 (T1.35mm) | ||
| 1206 | - | 3000 (T1.60mm) | ||
| 1210 | - | 2000 (T1.85mm) | ||
| 1808 | - | 1000 (T1.85mm) | ||
| 1812 | - | 800 | ||
| 1812 above | - | 500 | ||
| Soldering Method Codes | RReflow Soldering, WWave Soldering | |||
Precautions For Use
Multi-layer Ceramic Capacitors (MLCCs) may fail in a short circuit or open circuit mode when subjected to severe electrical or mechanical stress beyond specified ratings. To prevent issues like burn out, flaming, or glowing, adhere to the following precautions and application notes. For handling questions, contact the engineering section or factory.
- Soldering Profile: Follow the temperature profile to avoid cracks due to sudden temperature changes.
- Manual Soldering: Handle soldering irons carefully to prevent thermal cracks. Pay attention to tip selection and temperature.
- Optimum Solder Amount for Reflow Soldering
- Recommended Soldering amounts
Soldering Temperature Profile: During preheating, maintain a temperature difference (T) of 150 between the soldering temperature and the surface temperature of the chips.
2509251626_AIDE-CAPACITOR-1206C0G180J102NT_C48579661.pdf
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