Product Overview
These Multi-Layer Ceramic Capacitors (MLCCs) are designed for high-voltage applications, serving critical roles in coupling, wave filtering, and resonance within power supplies and communication interfaces. They are suitable for use in switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamps. The MLCCs are available in various sizes and dielectric characteristics, including C0G, X7R, and X5R, with options for different tolerances, rated voltages, and packing methods.
Product Attributes
- Dielectric Characteristics: C0G (030 PPM/), X7R (15%), X5R (15%)
- Terminal Composition: Au/Ag-Ni-Sn (From the inside out)
- Packing Options: Tape/Reel (T), Bag packing (P)
- Compliance: ROHS/REACH compliant
Technical Specifications
| Item | Description/Specification | Details |
|---|---|---|
| Dimension Code | 0201 | L*W (inch): 0.02*0.01 | L*W (mm): 0.50*0.25 |
| 0402 | L*W (inch): 0.04*0.02 | L*W (mm): 1.00*0.50 | |
| 0603 | L*W (inch): 0.06*0.03 | L*W (mm): 1.60*0.80 | |
| 0805 | L*W (inch): 0.08*0.05 | L*W (mm): 2.00*1.25 | |
| 1206 | L*W (inch): 0.12*0.06 | L*W (mm): 3.20*1.60 | |
| 1210 | L*W (inch): 0.12*0.10 | L*W (mm): 3.20*2.50 | |
| 1808 | L*W (inch): 0.18*0.08 | L*W (mm): 4.50*2.00 | |
| 1812 | L*W (inch): 0.18*0.12 | L*W (mm): 4.50*3.20 | |
| 1825 | L*W (inch): 0.18*0.25 | L*W (mm): 4.50*6.30 | |
| 2225 | L*W (inch): 0.22*0.25 | L*W (mm): 5.70*6.30 | |
| Nominal Electrostatic Capacity | 8R0 = 8.0 pF, 100 = 10 pF, 101 = 100 pF | |
| Example: 684 indicates 68 x 10^4 pF = 680,000 pF = 680 nF = 0.68 F | ||
| Tolerance of Electrostatic Capacity | B: 0.1pF, C: 0.25pF, D: 0.5pF, F: 1%, G: 2%, J: 5%, K: 10%, M: 20%, Z: +80%/-20% | |
| Example: M indicates 20% | ||
| Rated Voltage (DC) | 250 = 25V | |
| 251 = 250V | ||
| 252 = 2500V | ||
| Example: 251 indicates 250V | ||
| Ur=100V, 200V, 250V, 450V, 500V, 630V, 1KV, 2KV | ||
| Operating Temperature Range | -55~+125 | |
| Construction | 1. Ceramic dielectric, 2. Inner electrode, 3. Outer electrode, 4. Nickel layer, 5. Tin layer | |
| Dimensions (mm) | See Page 2 for detailed dimensions (L, W, T, WB) for each size code (e.g., 0603, 1005, 1608, etc.). | |
| Testing Conditions | Normal: Temp: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa Relative: Temp: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa | |
| Static Capacity Test | NPO: 1MHz10%, 1.00.2Vrms (1000pF); 1KHz10%, 1.00.2Vrms (>1000pF) X7R/X7T/X7P: 1KHz10%, 1.00.2Vrms (10uF); 120Hz24, 0.50.1Vrms (>10uF) | |
| Dissipation Factor (DF) | Refer to Page 3 and Note 1 for specific values based on characteristic and capacitance. | |
| Insulation Resistance (IR) | NPO: 50000M (C10nF) or IR*Cr500S (C>10nF) X7R/X7T/X7P: 10000M (C25nF) or IR*Cr100S (C>25nF) Testing Condition: Rated voltage, 605s, Humidity: 75%, Temp: 255, Current: 50mA | |
| Hi-pot (DC) | 1.1x to 2.5x rated voltage depending on rated voltage (Ur). Voltage Raising time: 110S, Voltage maintaining time: 2S. | |
| Solderability | Soldering area 90%. Pre-heating: 80-120 (10-30s). Soldering temp: 2455 (20.5s). | |
| Resistance to the heat of soldering | No damage, soldering area 90%. Pre-heating: 100-200 (102s). Soldering temp: 2655 (51s). | |
| Electrostatic Capacity Change Rate | NPO: 0.5% or 0.5pF X7R: 15% X7T: -33% to +22% X7P: 10% | |
| Flexural Strength | Capacity change rate 10% under flexural depth of 452mm. | |
| Terminal Bonding Strength | No visual damage under 5N force for 101S. | |
| Thermal Shock | Capacity change rate: NPO 2.5% or 0.25pF; X7R/X7P 0.5%; X7T 10%. Test after 5 cycles. | |
| Temperature Moisture Exposure | Capacity change rate: NPO 2% or 1pF; X7R/X7T/X7P 10%. DF 2x initial. IR: NPO 2500M or IR*Cr25S; X7R/X7T/X7P 1000M or IR*Cr25S. Test after 50024 hours at 402 / 90~95%RH. | |
| High Temperature Exposure | Capacity change rate: NPO 2% or 1pF; X7R/X7T/X7P 20%. DF 2x initial. IR: NPO 4000M or IR*Cr40S; X7R/X7T/X7P 2000M or IR*Cr50S. Test after 100048 hours at 1253 with various voltages. | |
| PCB Flexural Strength | No crack or defects after soldering MLCC on PCB and applying specified force. See Page 7 for dimensions A, B, C for different sizes. | |
| Embossed Plastic Taping Dimensions | See Page 8 for detailed dimensions (A, B, C, D, E, F, G, H, J, T) for tape sizes 0805 to 1812. | |
| Paper Tape Reel Packing Dimensions | See Page 9 for detailed dimensions (W1, L1, D, C, B, P1, P2, P0, d, t) for sizes 1005, 0201, 0402, 0603, 0805, 1206. | |
| Reel Dimensions | 7' REEL: 1782.0mm; 13' REEL: 3302.0mm. | |
| Top Tape Peeling Strength | Paper Taping: Standard specified. Embossed Taping: 0.1N < peeling strength < 0.7N. | |
| Packing Quantity | See Page 11 for quantity per reel for different sizes and tape types. | |
| Soldering Method Recommendations | Refer to Page 13 for recommended soldering methods (R - Reflow, W - Wave) based on size, characteristic, rated voltage, and capacitance. | |
2509251626_AIDE-CAPACITOR-1206C0G200J102NT_C48579662.pdf
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