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quality Multi Layer Ceramic Capacitor AIDE CAPACITOR 1206C0G200J102NT for High Voltage Power Supply Applications factory
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quality Multi Layer Ceramic Capacitor AIDE CAPACITOR 1206C0G200J102NT for High Voltage Power Supply Applications factory
>
Specifications
Voltage Rating:
1kV
Capacitance:
20pF
Temperature Coefficient:
C0G
Tolerance:
±5%
Mfr. Part #:
1206C0G200J102NT
Model Number:
1206C0G200J102NT
Package:
1206
Key Attributes
Product Description

Product Overview

These Multi-Layer Ceramic Capacitors (MLCCs) are designed for high-voltage applications, serving critical roles in coupling, wave filtering, and resonance within power supplies and communication interfaces. They are suitable for use in switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamps. The MLCCs are available in various sizes and dielectric characteristics, including C0G, X7R, and X5R, with options for different tolerances, rated voltages, and packing methods.

Product Attributes

  • Dielectric Characteristics: C0G (030 PPM/), X7R (15%), X5R (15%)
  • Terminal Composition: Au/Ag-Ni-Sn (From the inside out)
  • Packing Options: Tape/Reel (T), Bag packing (P)
  • Compliance: ROHS/REACH compliant

Technical Specifications

Item Description/Specification Details
Dimension Code 0201 L*W (inch): 0.02*0.01 | L*W (mm): 0.50*0.25
0402 L*W (inch): 0.04*0.02 | L*W (mm): 1.00*0.50
0603 L*W (inch): 0.06*0.03 | L*W (mm): 1.60*0.80
0805 L*W (inch): 0.08*0.05 | L*W (mm): 2.00*1.25
1206 L*W (inch): 0.12*0.06 | L*W (mm): 3.20*1.60
1210 L*W (inch): 0.12*0.10 | L*W (mm): 3.20*2.50
1808 L*W (inch): 0.18*0.08 | L*W (mm): 4.50*2.00
1812 L*W (inch): 0.18*0.12 | L*W (mm): 4.50*3.20
1825 L*W (inch): 0.18*0.25 | L*W (mm): 4.50*6.30
2225 L*W (inch): 0.22*0.25 | L*W (mm): 5.70*6.30
Nominal Electrostatic Capacity 8R0 = 8.0 pF, 100 = 10 pF, 101 = 100 pF
Example: 684 indicates 68 x 10^4 pF = 680,000 pF = 680 nF = 0.68 F
Tolerance of Electrostatic Capacity B: 0.1pF, C: 0.25pF, D: 0.5pF, F: 1%, G: 2%, J: 5%, K: 10%, M: 20%, Z: +80%/-20%
Example: M indicates 20%
Rated Voltage (DC) 250 = 25V
251 = 250V
252 = 2500V
Example: 251 indicates 250V
Ur=100V, 200V, 250V, 450V, 500V, 630V, 1KV, 2KV
Operating Temperature Range -55~+125
Construction 1. Ceramic dielectric, 2. Inner electrode, 3. Outer electrode, 4. Nickel layer, 5. Tin layer
Dimensions (mm) See Page 2 for detailed dimensions (L, W, T, WB) for each size code (e.g., 0603, 1005, 1608, etc.).
Testing Conditions Normal: Temp: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa
Relative: Temp: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa
Static Capacity Test NPO: 1MHz10%, 1.00.2Vrms (1000pF); 1KHz10%, 1.00.2Vrms (>1000pF)
X7R/X7T/X7P: 1KHz10%, 1.00.2Vrms (10uF); 120Hz24, 0.50.1Vrms (>10uF)
Dissipation Factor (DF) Refer to Page 3 and Note 1 for specific values based on characteristic and capacitance.
Insulation Resistance (IR) NPO: 50000M (C10nF) or IR*Cr500S (C>10nF)
X7R/X7T/X7P: 10000M (C25nF) or IR*Cr100S (C>25nF)
Testing Condition: Rated voltage, 605s, Humidity: 75%, Temp: 255, Current: 50mA
Hi-pot (DC) 1.1x to 2.5x rated voltage depending on rated voltage (Ur). Voltage Raising time: 110S, Voltage maintaining time: 2S.
Solderability Soldering area 90%. Pre-heating: 80-120 (10-30s). Soldering temp: 2455 (20.5s).
Resistance to the heat of soldering No damage, soldering area 90%. Pre-heating: 100-200 (102s). Soldering temp: 2655 (51s).
Electrostatic Capacity Change Rate NPO: 0.5% or 0.5pF
X7R: 15%
X7T: -33% to +22%
X7P: 10%
Flexural Strength Capacity change rate 10% under flexural depth of 452mm.
Terminal Bonding Strength No visual damage under 5N force for 101S.
Thermal Shock Capacity change rate: NPO 2.5% or 0.25pF; X7R/X7P 0.5%; X7T 10%. Test after 5 cycles.
Temperature Moisture Exposure Capacity change rate: NPO 2% or 1pF; X7R/X7T/X7P 10%. DF 2x initial. IR: NPO 2500M or IR*Cr25S; X7R/X7T/X7P 1000M or IR*Cr25S. Test after 50024 hours at 402 / 90~95%RH.
High Temperature Exposure Capacity change rate: NPO 2% or 1pF; X7R/X7T/X7P 20%. DF 2x initial. IR: NPO 4000M or IR*Cr40S; X7R/X7T/X7P 2000M or IR*Cr50S. Test after 100048 hours at 1253 with various voltages.
PCB Flexural Strength No crack or defects after soldering MLCC on PCB and applying specified force. See Page 7 for dimensions A, B, C for different sizes.
Embossed Plastic Taping Dimensions See Page 8 for detailed dimensions (A, B, C, D, E, F, G, H, J, T) for tape sizes 0805 to 1812.
Paper Tape Reel Packing Dimensions See Page 9 for detailed dimensions (W1, L1, D, C, B, P1, P2, P0, d, t) for sizes 1005, 0201, 0402, 0603, 0805, 1206.
Reel Dimensions 7' REEL: 1782.0mm; 13' REEL: 3302.0mm.
Top Tape Peeling Strength Paper Taping: Standard specified. Embossed Taping: 0.1N < peeling strength < 0.7N.
Packing Quantity See Page 11 for quantity per reel for different sizes and tape types.
Soldering Method Recommendations Refer to Page 13 for recommended soldering methods (R - Reflow, W - Wave) based on size, characteristic, rated voltage, and capacitance.

2509251626_AIDE-CAPACITOR-1206C0G200J102NT_C48579662.pdf

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