Product Overview
High-performance Multi-Layer Ceramic Capacitors (MLCCs) designed for demanding applications in medium and high voltage circuits. These capacitors are engineered for coupling, wave filtering, and resonant functions, making them ideal for switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight units, and energy-saving lamps. They offer reliable performance under various environmental and electrical conditions.
Product Attributes
- Material: Ceramic dielectric, Inner electrode, Outer electrode, Nickel layer, Tin layer
- Terminal Composition: Au/Ag-Ni-Sn (From the inside out)
- Certifications: RoHS compliant, REACH compliant
Technical Specifications
| Item | Description | Specification | |||
|---|---|---|---|---|---|
| Application Field | Coupling, wave filtering, resonant in high voltage circuits | ||||
| Switch power supplier, AC-DC power charger, DC-DC power charger, networking/Communication interface, LCD backlight unit power supplier, amperite of energy saving lamps, etc. (Medium and High voltage MLCC) | |||||
| Testing Conditions | Normal Condition | Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa | |||
| Relative Condition | Temperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa | ||||
| Initial Capacitance Testing Pre-heating | 150 for 1 hour, then 48 hours under normal pressure & temperature. | ||||
| Part Number Description Example | 1812 X7R 684 M 251 N T | ||||
| Item Breakdown | Dimension Code, Temperature Characteristic, Nominal Electrostatic Capacity, Tolerance, Rated Voltage, Terminal Composition, Packing | ||||
| Dimension Codes (L*W) | Inch | Metric (mm) | |||
| 0201 | 0.02*0.01 | 0.50*0.25 | |||
| 0402 | 0.04*0.02 | 1.00*0.50 | |||
| 0603 | 0.06*0.03 | 1.60*0.80 | |||
| 0805 | 0.08*0.05 | 2.00*1.25 | |||
| 1206 | 0.12*0.06 | 3.20*1.60 | |||
| 1210 | 0.12*0.10 | 3.20*2.50 | |||
| 1808 | 0.18*0.08 | 4.50*2.00 | |||
| 1812 | 0.18*0.12 | 4.50*3.20 | |||
| 1825 | 0.18*0.25 | 4.50*6.30 | |||
| 2211 | 0.22*0.11 | 5.70*2.80 | |||
| 2225 | 0.22*0.25 | 5.70*6.30 | |||
| Temperature Characteristic | Code | Tolerance | |||
| C0G | 0 30 PPM/ | ||||
| X7R | 15% | ||||
| X5R | 15% | ||||
| Nominal Electrostatic Capacity | e.g., 8R0 = 8.0pF, 100 = 10pF, 101 = 100pF | ||||
| Tolerance of Electrostatic Capacity | B: 0.1pF, C: 0.25pF, D: 0.5pF, F: 1%, G: 2%, J: 5%, K: 10%, M: 20%, Z: +80%/-20% | ||||
| Rated Voltage (DC) | e.g., 250 = 25V, 251 = 250V, 252 = 2500V | ||||
| Dimensions (mm) | Part Number | L | W | T | WB |
| 0201 (0603) | 0.600.10 | 0.300.05 | 0.300.05 | 0.100.05 | |
| 0402 (1005) | 1.000.15 | 0.500.15 | 0.500.10 | 0.200.10 | |
| 0603 (1608) | 1.600.20 | 0.800.15 | 0.800.15 | 0.300.10 | |
| 0805 (2012) | 2.000.20 | 1.250.20 | 0.800.20 | 0.500.20 | |
| 1206 (3216) | 3.200.30 | 1.600.30 | 1.000.20 | 0.600.30 | |
| 1210 (3225) | 3.200.30 | 2.500.30 | 2.70 | 0.800.30 | |
| 1808 (4520) | 4.500.40 | 2.000.20 | 2.70 | 0.800.30 | |
| 1812 (4532) | 4.500.40 | 3.200.30 | 3.50 | 0.800.30 | |
| 1825 (4563) | 4.500.40 | 6.300.50 | 3.50 | 0.800.30 | |
| 2220 (5750) | 5.700.50 | 5.000.50 | 3.50 | 1.000.40 | |
| 2225 (5763) | 5.700.50 | 6.300.50 | 6.20 | 1.000.40 | |
| Temperature Range | -55~+125 | ||||
| Dissipation Factor (DF) | Refer to Note 1 | ||||
| Insulation Resistance (IR) | NPO: 50000M, C10nF; IR*C500S, C>10nF. X7R/X7T/X7P: 10000M, C25nF; IR*C100S, C>25nF | ||||
| Hi-pot (DC) | 2.5 x rated voltage (Ur=100V), 2.0 x rated voltage (Ur=200V/250V), 1.5 x rated voltage (Ur=450/500/630V), 1.2 x rated voltage (1KVUr2KV), 1.1 x rated voltage (2KVUr) | ||||
| Solderability | Soldering area 90%, No damage. Pre-heating: 80-120 (10-30s). Soldering: 2455 (20.5s). | ||||
| Resistance to the heat of soldering | No damage, soldering area 90%. Pre-heating: 100-200 (102s). Soldering: 2655 (51s). | ||||
| Flexural Strength | Electrostatic capacity change rate: NPO: C/C0.5% or 0.5pF (larger reading); X7R: C/C15%; X7T: -33% C/C22%; X7P: C/C10%. | ||||
| Terminal Bonding Strength | No visual damage. Applied Force: 5N (101S). | ||||
| Thermal Shock | NPO: C/C2.5% or 0.25pF (larger reading). X7R/X7P: C/C0.5%. X7T: C/C10%. | ||||
| Temperature Moisture Exposure | NPO: C/C2% or 1pF (larger reading). X7R/X7T/X7P: C/C10%. DF 2 times initial standard. IR: NPO 2500M or IR*C25S. X7R/X7T/X7P 1000M or IR*C25S. | ||||
| High Temperature Exposure | NPO: C/C2% or 1pF (larger reading). X7R/X7T/X7P: C/C20%. DF 2 X initial standard. IR: NPO 4000M or IR*C40S. X7R/X7T/X7P 2000M or IR*C50S. | ||||
| PCB Flexural Strength | No crack and other defect. | ||||
| Embossed Plastic Taping Dimensions (mm) | Refer to Page 8 for detailed dimensions (A, B, C, D, E, F, G, H, J, T) for sizes 0805 to 1812. | ||||
| Paper Tape Reel Packing Dimensions (mm) | Refer to Page 9 for detailed dimensions (W1, L1, D, C, B, P1, P2, P0, d, t) for sizes 1005, 0201, 0402, 0603, 0805, 1206. | ||||
| Reel Dimensions (mm) | 7' REEL: 1782.0, 13' REEL: 3302.0 | ||||
| Top Tape Peeling Strength | 0.1N < peeling strength < 0.7N | ||||
| Packing Quantity | Refer to Page 11 for quantities by size and tape type. | ||||
Precautions for Use
MLCCs may fail in short or open circuit modes under severe electrical or mechanical stress beyond specified ratings. To prevent failure modes such as burnout, flaming, or glowing, adhere to the following precautions:
- Soldering Profile: Follow the recommended temperature profile to avoid cracks due to sudden temperature changes.
- Manual Soldering: Exercise caution to prevent thermal cracks. Ensure the soldering iron tip is carefully selected and applied to the end terminations, avoiding direct contact with the ceramic body.
- Optimum Solder Amount for Reflow Soldering
- Recommended Soldering Method: RReflow Soldering, WWave Soldering.
- Soldering Temperature Profile: Maintain a temperature difference of T150 between soldering temperature and chip surface temperature during preheating.
2509251626_AIDE-CAPACITOR-1206C0G220J102NT_C48579663.pdf
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