Product Overview
This product is a Multi-layer Ceramic Capacitor (MLCC) designed for high-voltage applications. It is suitable for coupling, wave filtering, and resonant functions in various power supply and electronic circuits, including switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight units, and energy-saving lamps. The MLCCs are available in various sizes and temperature characteristics, offering reliable performance under specified conditions.
Product Attributes
- Temperature Characteristics: C0G (030 PPM/), X7R (15%), X5R (15%)
- Terminal Composition: Au/Ag-Ni-Sn (From the inside out)
- Packing Options: Tape/Reel (T), Bag packing (P)
- Compliance: ROHS/REACH compliant
Technical Specifications
| Item | Description | Specification/Requirement | Testing Method | ||
|---|---|---|---|---|---|
| 1. Application Field | Coupling, wave filtering, resonant in high voltage circuits (switch power supplier, AC-DC power charger, DC-DC power charger, networking/Communication interface, LCD backlight unit power supplier, amperite of energy saving lamps, etc.) (Medium and High voltage MLCC). | ||||
| Testing Conditions: Normal Condition: Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa Relative Condition: Temperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa | |||||
| 2. Part Number Description | Example: 1812 X7R 684 M 251 N T Dimension Code Temperature characteristic Nominal electrostatic capacity Tolerance of electrostatic capacity Rated voltage (DC) Terminal composition Packing | ||||
| 3. Dimension Codes & Sizes | Code | L*W (inch) | L*W (mm) | ||
| 0201 | 0.02*0.01 | 0.50*0.25 | |||
| 0402 | 0.04*0.02 | 1.00*0.50 | |||
| 0603 | 0.06*0.03 | 1.60*0.80 | |||
| 0805 | 0.08*0.05 | 2.00*1.25 | |||
| 1206 | 0.12*0.06 | 3.20*1.60 | |||
| 1210 | 0.12*0.10 | 3.20*2.50 | |||
| 1808 | 0.18*0.08 | 4.50*2.00 | |||
| 1812 | 0.18*0.12 | 4.50*3.20 | |||
| 1825 | 0.18*0.25 | 4.50*6.30 | |||
| 2211 | 0.22*0.11 | 5.70*2.80 | |||
| 2225 | 0.22*0.25 | 5.70*6.30 | |||
| 4. Construction | Item | Description | |||
| 1 | Ceramic dielectric | ||||
| 2 | Inner electrode | ||||
| 3 | Outer electrode | ||||
| 4 | Nickle layer | ||||
| 5 | Tin layer | ||||
| 5. Dimensions (mm) | Part number | L | W | T | WB |
| 0201 (0603) | 0.600.10 | 0.300.05 | 0.300.05 | 0.100.05 | |
| 0402 (1005) | 1.000.15 | 0.500.15 | 0.500.10 | 0.200.10 | |
| 0603 (1608) | 1.600.20 | 0.800.15 | 0.800.15 | 0.300.10 | |
| 0805 (2012) | 2.000.20 | 1.250.20 | 0.800.20 | 0.500.20 | |
| 1206 (3216) | 3.200.30 | 1.600.30 | 1.000.20 | 0.600.30 | |
| 1210 (3225) | 3.200.30 | 2.500.30 | 2.70 | 0.800.30 | |
| 1808 (4520) | 4.500.40 | 2.000.20 | 2.70 | 0.800.30 | |
| 1812 (4532) | 4.500.40 | 3.200.30 | 3.50 | 0.800.30 | |
| 1825 (4563) | 4.500.40 | 6.300.50 | 3.50 | 0.800.30 | |
| 2220 (5750) | 5.700.50 | 5.000.50 | 3.50 | 1.000.40 | |
| 2225 (5763) | 5.700.50 | 6.300.50 | 6.20 | 1.000.40 | |
| 6. Specification and Testing Method | Item | Specification/Requirement | Testing method | ||
| Temperature | -55~+125 | ||||
| Visual/Dimension | 1. No Damage 2. Dimension meet Spec | Naked eye (Visual inspection) Digital calliper | |||
| Static Capacity | NPO characteristic: 1000pF: 1MHz10%, 1.00.2Vrms >1000pF: 1KHz10%, 1.00.2Vrms X7R/X7T/X7P characteristic: 10uF: 1KHz10%, 1.00.2Vrms >10uF: 120Hz24, 0.50.1Vrms | ||||
| Dissipation factor (DF) | NPO Characteristic: DF0.56, Cr5 pF DF1.5[(150/Cr)+7]10-4 (5pFCr50pF) DF0.15%, (50pFCr) Cr1000pF, 110%MHz, 1V0.2rms Cr1000pF, 110%KHz, 1V0.2rms X7R/X7T/X7P characteristic: Cr10uF, 110%KHz, 1V0.1rms Cr10uF, 12024Hz, 0.5V0.1rms | ||||
| IR Insulation Resistance | NPO Characteristic: IR50000M, C10nF; IR*Cr500S, C10nF X7R/X7T/X7P Characteristic: IR10000M, C25nF; IR*Cr100S, C25nF Testing condition: Rated voltage, Time: 605s, Humidity: 75%, Temperature: 255, Current: 50mA | ||||
| Hi-pot (DC) | No dielectric breakdown or damage Ur=100V: 2.5 x rated voltage Ur=200V/250V: 2.0 x rated voltage Ur=450/500/630V: 1.5 x rated voltage 1KVUr2KV: 1.2 x rated voltage 2KVUr: 1.1 x rated voltage Voltage Raising time: 110S, Voltage maintaining time: 2S | ||||
| Solderability | Soldering area90%, No damage | Pre-heating temperature 80-120, time 10-30s, lead free solder, flux. Soldering temperature 2455, Solder time 20.5s. | |||
| Resistance to the heat of soldering | No damage, soldering area90% | Pre-heating temperature 100-200, time 102 s, soldering temperature: 2655, Soldering time: 51s. Cleaning with solvent. Room temperature, time: 242 hours. | |||
| Electrostatic capacity change rate | NPO: C/C0.5% or 0.5pF (larger reading) X7R: C/C15% X7T: -33% C/C22% X7P: C/C10% | ||||
| Flexural strength | No damage. Electro static capacity change rate C/C10%. Flexural depth 452 | Base board: Al2O3 /PCB. PCB dimension: Thickness: 1.6mm, Length: 100mm, Width: 40mm. Flexural depth: 1mm. Bend speed: 0.5mm/sec. | |||
| Terminal bonding strength | No visual damage | Applied Force: 5N, Duration: 101S | |||
| Thermal shock | NPO: C/C2.5% or 0.25pF (larger reading) X7R/X7P: C/C0.5% X7T: C/C10% | Pre-condition (X7R h characteristic): Upper limit temperature 1hour, place 241 hours, start testing. Run 5 cycles Thermal shock. Test after place 242 hours normal temp & humidity. | |||
| Temperature moisture exposure | Visual: No visual damage Capacitance change rate: NPO: C/C2% or 1pF (larger reading) X7R/X7T/X7P: C/C10% DF: 2 times initial standard IR: NPO: IR2500M or IR*Cr25S (Lower reading) X7R/X7T/X7P: IR1000M or IR*Cr25S (Lower reading) | Temperature 402, Humidity 90~95%RH, time 50024 hours. Test after place 242 hours normal temp & humidity. | |||
| High temperature exposure | Visual: No visual damage Capacitance change rate: NPO: C/C2% or 1pF (larger reading) X7R/X7T/X7P: C/C20% DF: 2 X initial standard IR: NPO: IR4000M or IR*Cr40S (Lower reading) X7R/X7T/X7P: IR2000M or IR*Cr50S (Lower reading) | Temperature 1253, Time 100048 hours. Voltage: 100VV250V (2x Rated voltage), 250VV1KV (1.5x rated voltage), 1KVV (1.2x rated voltage). Test after place 48 hours under normal pressure & temperature. | |||
| PCB flexural strength | No crack and other defect | Soldering the MLCC on the PCB. Pressing direction based on diagram. IR measurement. | |||
| Packing Quantity | Paper T/R (Pcs): 0603: 4000 0805: 4000 1206: 3000 1210: 2000 1812: 1000 Plastic T/R (Pcs): 0805: 3000 1206: 3000 (T1.35mm), 2000 (T>1.35mm) 1210: 3000 (T1.60mm), 2000 (T>1.60mm) 1808: 1000 1812: 800 (T1.85mm), 500 (T>1.85mm) | ||||
| 8. Precautions for Use | MLCCs may fail in a short circuit mode when subjected to severe conditions beyond specified ratings. Following precautions for safety and application notes are recommended. Contact engineering or factory for handling questions. | ||||
| 9. Recommended Soldering Method | Size | Temperature Characteristics | Rated Voltage | Capacitance | Soldering Method 1005 | NPO / X7R/X5R/X7S/X6S | / | / | R 0201 | NPO / X7R/X5R/X7S/X6S / Y5V | / | / | R 0402 | NPO / X7R/X5R/X7S/X6S / Y5V | / | / | R 0603 | NPO / X7R/X5R/X7S/X6S / Y5V | / | C1uf / C1uf | R / R/W 0805 | NPO / X7R/X5R/X7S/X6S / Y5V | / | C4.7uf / C4.7uf (X7R) / C1uf / C1uf (Y5V) | R / R/W 1206 | NPO / X7R/X5R/X7S/X6S / Y5V | / | C10uf / C10uf | R / R/W 1210 | NPO / X7R/X5R/X7S/X6S / Y5V | / | / | R Soldering method: RReflow Soldering, WWave Soldering | ||||
| 10. Soldering Temperature Profile | Preheating: Keep temperature difference between soldering temperature and surface temperature of chips as T150. | ||||
2509251626_AIDE-CAPACITOR-1206C0G330J102NT_C48579666.pdf
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