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Specifications
Voltage Rating:
1kV
Capacitance:
39pF
Temperature Coefficient:
C0G
Tolerance:
±5%
Mfr. Part #:
1206C0G390J102NT
Model Number:
1206C0G390J102NT
Package:
1206
Key Attributes
Product Description
Product Overview
This product is a Multi-Layer Ceramic Capacitor (MLCC) designed for high-voltage circuits. It serves critical functions such as coupling, wave filtering, and resonance in a wide range of power supply applications, including switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamps. These MLCCs are suitable for medium and high voltage applications, offering reliable performance and meeting stringent industry standards.
Product Attributes
- Terminal Composition: Au/Ag-Ni-Sn (from the inside out)
- Certifications: RoHS compliant, REACH compliant
Technical Specifications
| Item | Description | Specification/Requirement | Testing Method | ||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|
| Application Field | Coupling, wave filtering, resonant in high voltage circuits, switch power supplier, AC-DC power charger, DC-DC power charger, networking/Communication interface, LCD backlight unit power supplier, amperite of energy saving lamps, etc. (Medium and High voltage MLCC). | ||||||||||
| Testing Conditions: Normal: Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa Relative: Temperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa | |||||||||||
| Part Number Description Example: 1812 X7R 684 M 251 N T | 1. Dimension Code | 0201 (0.02*0.01 inch / 0.50*0.25 mm) to 2225 (0.22*0.25 inch / 5.70*6.30 mm) | N/A | ||||||||
| 2. Temperature Characteristic | C0G (030 PPM/), X7R (15%), X5R (15%) | N/A | |||||||||
| 3. Nominal Electrostatic Capacity | 8R0 (8.0 pF), 100 (10 pF), 101 (100 pF) | N/A | |||||||||
| 4. Tolerance of Electrostatic Capacity | B: 0.1pF, C: 0.25pF, D: 0.5pF, F: 1%, G: 2%, J: 5%, K: 10%, M: 20%, Z: +80%/-20% | N/A | |||||||||
| 5. Rated Voltage (DC) | 250 (25V), 251 (250V), 252 (2500V) | N/A | |||||||||
| 6. Terminal Composition | Au/Ag-Ni-Sn (From the inside out) | N/A | |||||||||
| 7. Packing | T (Tape/Reel), P (Bag packing) | N/A | |||||||||
| Construction | 1. Ceramic dielectric | N/A | |||||||||
| 2. Inner electrode | N/A | ||||||||||
| Outer Electrode | 3. Outer electrode | N/A | |||||||||
| 4. Nickle layer | N/A | ||||||||||
| Tin Layer | 5. Tin layer | N/A | |||||||||
| Dimension (mm) | Part Number | L | W | T | WB | ||||||
| 0201 (0603) | 0.600.10 | 0.300.05 | 0.300.05 | 0.100.05 | |||||||
| 0402 (1005) | 1.000.15 | 0.500.15 | 0.500.10 | 0.200.10 | |||||||
| 0603 (1608) | 1.600.20 | 0.800.15 | 0.800.15 | 0.300.10 | |||||||
| 0805 (2012) | 2.000.20 | 1.250.20 | 0.800.20 | 0.500.20 | |||||||
| 1206 (3216) | 3.200.30 | 1.600.30 | 1.000.20 | 0.600.30 | |||||||
| 1210 (3225) | 3.200.30 | 2.500.30 | 2.70 | 0.800.30 | |||||||
| 1808 (4520) | 4.500.40 | 2.000.20 | 2.70 | 0.800.30 | |||||||
| 1812 (4532) | 4.500.40 | 3.200.30 | 3.50 | 0.800.30 | |||||||
| 1825 (4563) | 4.500.40 | 6.300.50 | 3.50 | 0.800.30 | |||||||
| 2220 (5750) | 5.700.50 | 5.000.50 | 3.50 | 1.000.40 | |||||||
| 2225 (5763) | 5.700.50 | 6.300.50 | 6.20 | 1.000.40 | |||||||
| Specification and Testing Method | Temperature | -55~+125 | Naked eye (Visual inspection), Digital calliper | ||||||||
| Visual/Dimension | 1. No Damage 2. Dimension meet Spec | Naked eye (Visual inspection), Digital calliper | |||||||||
| Static Capacity | Meet standard specification and tolerance | Details provided for NPO and X7R/X7T/X7P characteristics | |||||||||
| Dissipation Factor (DF) | Details provided for NPO and X7R/X7T/X7P characteristics | Details provided | |||||||||
| IR Insulation Resistance | Details provided for NPO and X7R/X7T/X7P characteristics | Details provided | |||||||||
| Hi-pot (DC) | No dielectric breakdown or damage | Voltage Raising time: 110S, Voltage maintaining time2S. Specific voltage multipliers based on Ur. | |||||||||
| Solderability | soldering area90% | Pre-heating temperature 80-120, time 10-30s, lead free solder, flux. Soldering temperature 2455, Solder time 20.5s. | |||||||||
| Resistance to the heat of soldering | Visual-No damage, soldering area90% | Pre-heating temperature 100-200, time 102 s, soldering temperature: 2655, Soldering time: 51s. Cleaning with solvent. Room temperature, time: 242 hours. | |||||||||
| Electrostatic Capacity Change Rate | NPO Characteristic: C/C0.5% or 0.5pF (larger reading) X7R: C/C15% X7T: -33% C/C22% X7P: C/C10% | N/A | |||||||||
| Flexural Strength | No damage | Base board: Al2O3 /PCB. Flexural depth: 1mm. Bend speed: 0.5mm/sec. | |||||||||
| Terminal Bonding Strength | No visual damage | Applied Force: 5N Duration: 101S | |||||||||
| Thermal Shock | Capacity change rate and DF/IR specifications provided for NPO, X7R/X7P, X7T characteristics. | Run 5 cycles. Test after 242 hours at normal temp & humidity. | |||||||||
| Temperature Moisture Exposure | Visual: No visual damage. Capacity change rate, DF, IR specifications provided for NPO, X7R/X7T/X7P characteristics. | Temperature 402, Humidity 90~95%RH, time 50024 hours. Test after 242 hours at normal temp & humidity. | |||||||||
| High Temperature Exposure | Visual: No visual damage. Capacity change rate, DF, IR specifications provided for NPO, X7R/X7T/X7P characteristics. | Temperature 1253, Time 100048 hours. Voltage specifications provided. Test after 48 hours at normal pressure & temperature. | |||||||||
| PCB Flexural Strength | No crack and other defect | IR Soldering the MLCC on the PCB. Pressing direction based on provided diagrams. | |||||||||
| Embossed Plastic Taping | Dimensions (mm) | A | B | C | D | E | F | G | H | J | T |
| 0805 | 1.55 0.20 | 2.35 0.20 | 8.00 0.20 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.10 | 1.50 -0/+0.10 | 1.50 Max | |
| 1206 | 1.95 0.20 | 3.60 0.20 | 8.00 0.20 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.1 | 1.50 -0/+0.10 | 1.85 Max | |
| 1210 | 2.70 0.10 | 3.42 0.10 | 8.00 0.10 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.05 | 4.00 0.10 | 1.55 -0/+0.10 | 3.2 Max | |
| 1808 | 2.20 0.10 | 4.95 0.10 | 12.00 0.10 | 5.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.05 | 4.00 0.10 | 1.50 -0/+0.10 | 3.0 Max | |
| 1812 | 3.66 0.10 | 4.95 0.10 | 12.00 0.10 | 5.50 0.05 | 1.75 0.10 | 8.00 0.10 | 2.00 0.05 | 4.00 0.10 | 1.55 -0/+0.10 | 4.0 Max | |
| Paper Tape Reel Packing | Size | W1 | L1 | D | C | B | P1 | P2 | P0 | d | t |
| 1005 | 0.24 0.02 | 0.45 0.02 | 8.00 0.10 | 3.50 0.05 | 1.75 0.10 | 2.00 0.05 | 2.00 0.05 | 4.00 0.10 | 1.50 -0/+0.10 | 0.30 Below | |
| 0201 | 0.37 0.10 | 0.67 0.10 | 8.00 0.10 | 3.50 0.05 | 1.75 0.10 | 2.00 0.05 | 2.00 0.05 | 4.00 0.10 | 1.50 -0/+0.10 | 0.80 Below | |
| 0402 | 0.65 0.10 | 1.15 0.10 | 8.00 0.10 | 3.50 0.05 | 1.75 0.10 | 2.00 0.05 | 2.00 0.05 | 4.00 0.10 | 1.50 -0/+0.10 | 0.80 Below | |
| 0603 | 1.10 0.10 | 1.90 0.10 | 8.00 0.10 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.10 | 1.50 -0/+0.10 | 1.10 Max | |
| 0805 | 1.45 0.15 | 2.30 0.15 | 8.0 0.15 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.10 | 1.50 -0/+0.10 | 1.10 Max | |
| 1206 | 1.80 0.20 | 3.40 0.20 | 8.00 0.20 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.10 | 1.50 -0/+0.10 | 1.10 Max | |
| Reel Dimensions (unit: mm) | 7REEL | 1782.0 | 3.0 | 130.5 | 210.5 | 21 or Bigger | 1010.5 | 12max | |||
| 13REEL | 3302.0 | 3.0 | 130.5 | 210.5 | 21 or Bigger | 1010.5 | 12max | ||||
| Taping Specification | Top tape peeling strength | Standard: 0.1N < peeling strength < 0.7N. No paper dirty remains on the scotch when peeling, and sticks to top and bottom tape. | N/A | ||||||||
| Packing Quantity | Dimension | Paper T/R (Pcs) | Plastic T/R (Pcs) | ||||||||
| 0603 | 4000 | - | |||||||||
| 0805 | 4000 | 3000 (T1.35mm) | |||||||||
| 1206 | - | 3000 (T1.60mm) / 2000 (T1.60mm) | |||||||||
| 1210 | - | 1000 (T1.85mm) / 800 (T1.85mm) | |||||||||
| 1812 | - | 500 | |||||||||
| Precautions For Use | MLCCs may fail in short or open circuit mode under severe electrical/mechanical stress beyond ratings, potentially causing burnout, flaming, or glowing. Adhere to safety precautions and application notes. Contact engineering for handling questions. | ||||||||||
| Soldering Profile | Follow the temperature profile graph to avoid cracks from sudden temperature change. | ||||||||||
| Manual Soldering | Risk of thermal cracks. Handle soldering iron carefully, pay attention to tip selection and temperature contact to avoid direct contact with the ceramic body. | ||||||||||
| Recommended Soldering Method | Details provided for various sizes and characteristics (RReflow Soldering, WWave Soldering). | ||||||||||
| Soldering Temperature Profile | Keep temperature difference between soldering temperature and surface temperature of chips T150 during preheating. | ||||||||||
2509251626_AIDE-CAPACITOR-1206C0G390J102NT_C48579668.pdf
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