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Specifications
Voltage Rating:
1kV
Capacitance:
56pF
Temperature Coefficient:
C0G
Tolerance:
±5%
Mfr. Part #:
1206C0G560J102NT
Model Number:
1206C0G560J102NT
Package:
1206
Key Attributes
Product Description
Product Overview
This product is a Multi-Layer Ceramic Capacitor (MLCC) designed for high-voltage applications. It is suitable for coupling, wave filtering, and resonant functions in various power supply circuits, including switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight units, and energy-saving lamps. These MLCCs are available in medium and high voltage ratings.
Product Attributes
- Terminal Composition: Au/Ag-Ni-Sn (from inside out)
- RoHS/REACH Compliance: Meets RoHS and REACH standards.
Technical Specifications
| Item | Description | Specification/Requirement | Testing Method |
|---|---|---|---|
| Application Field | Coupling, wave filtering, resonant in high voltage circuits, switch power supplier, AC-DC power charger, DC-DC power charger, networking/Communication interface, LCD backlight unit power supplier, amperite of energy saving lamps, etc. (Medium and High voltage MLCC). | ||
Testing Conditions:
| |||
| Part Number Description | 1. Dimension Code | 0201 (0.02x0.01 inch / 0.50x0.25 mm), 0402 (0.04x0.02 inch / 1.00x0.50 mm), 0603 (0.06x0.03 inch / 1.60x0.80 mm), 0805 (0.08x0.05 inch / 2.00x1.25 mm), 1206 (0.12x0.06 inch / 3.20x1.60 mm), 1210 (0.12x0.10 inch / 3.20x2.50 mm), 1808 (0.18x0.08 inch / 4.50x2.00 mm), 1812 (0.18x0.12 inch / 4.50x3.20 mm), 1825 (0.18x0.25 inch / 4.50x6.30 mm), 2211 (0.22x0.11 inch / 5.70x2.8 mm), 2225 (0.22x0.25 inch / 5.70x6.30 mm) | |
| 2. Temperature Characteristic | C0G (030 PPM/), X7R (15%), X5R (15%) | ||
| 3. Nominal Electrostatic Capacity | 8R0=8.0pF, 100=10pF, 101=100pF | ||
| 4. Tolerance of Electrostatic Capacity | B:0.1pF, C:0.25pF, D:0.5pF, F:1%, G: 2%, J:5%, K:10%, M:20%, Z:+80%/-20% | ||
| 5. Rated Voltage (DC) | 250=25V, 251=250V, 252=2500V | ||
| 6. Terminal Composition | Au/Ag-Ni-Sn (From the inside out) | ||
| 7. Packing | T: Tape/Reel, P: Bag packing (PE) | ||
| Construction and Dimension | Construction | 1. Ceramic dielectric, 2. Inner electrode, 3. Outer electrode, 4. Nickel layer, 5. Tin layer | |
| Dimension (mm) | Part Number | L | W | T | WB 0201 (0603) | 0.600.10 | 0.300.05 | 0.300.05 | 0.100.05 0402 (1005) | 1.000.15 | 0.500.15 | 0.500.10 | 0.200.10 0603 (1608) | 1.600.20 | 0.800.15 | 0.800.15 | 0.300.10 0805 (2012) | 2.000.20 | 1.250.20 | 0.800.20 | 0.500.20 1206 (3216) | 3.200.30 | 1.600.30 | 1.000.20 | 0.600.30 1210 (3225) | 3.200.30 | 2.500.30 | 2.70 | 0.800.30 1808 (4520) | 4.500.40 | 2.000.20 | 2.70 | 0.800.30 1812 (4532) | 4.500.40 | 3.200.30 | 3.50 | 0.800.30 1825 (4563) | 4.500.40 | 6.300.50 | 3.50 | 0.800.30 2220 (5750) | 5.700.50 | 5.000.50 | 3.50 | 1.000.40 2225 (5763) | 5.700.50 | 6.300.50 | 6.20 | 1.000.40 | ||
| Specification and Testing Method | Temperature Range | -55~+125 | |
| Visual/Dimension | 1. No Damage, 2. Dimension meet Spec. (Visual inspection, Digital caliper) | ||
| Static Capacity | NPO: 1000pF @ 1MHz10%, 1.00.2Vrms; >1000pF @ 1KHz10%, 1.00.2Vrms. X7R/X7T/X7P: 10uF @ 1KHz10%, 1.00.2Vrms; >10uF @ 120Hz24, 0.50.1Vrms. | ||
| Dissipation Factor (DF) | NPO: DF0.56% (Cr5pF), DF1.5[(150/Cr)+7]10-4 (5pFCr50pF), DF0.15% (50pFCr). Testing frequency 110%MHz, Voltage 1V0.2rms (Cr1000pF); Testing frequency 110%KHz, Voltage 1V0.2rms (Cr1000pF). X7R/X7T/X7P: See Note 1. Cr10uF, Test frequency 110%KHz, Voltage 1V0.1rms. Cr10uF, Frequency 12024Hz, Voltage 0.5V0.1rms. | ||
| IR Insulation Resistance | NPO: IR50000M (C10nF), IR*Cr500S (C10nF). Testing condition: Rated voltage, Time: 605s, Humidity: 75%, Temperature: 255, Current: 50mA. X7R/X7T/X7P: IR10000M (C25nF), IR*Cr100S (C25nF). | ||
| Hi-pot (DC) | No dielectric breakdown or damage. Ur=100V, 2.5x rated voltage; Ur=200V/250V, 2.0x rated voltage; Ur=450/500/630V, 1.5x rated voltage; 1KVUr2KV, 1.2x rated voltage; 2KVUr, 1.1x rated voltage. Voltage Raising time: 110S, Voltage maintaining time: 2S. | ||
| Solderability | Soldering area90%. Visual-No damage. Pre-heating temperature 80-120, time 10-30s, lead free solder, flux. Soldering temperature 2455, Solder time 20.5s. | ||
| Resistance to the heat of soldering | Visual-No damage, soldering area90%. Pre-heating temperature 100-200, time 102 s, soldering temperature: 2655, Soldering time: 51s. Cleaning with solvent. Room temperature, time: 242 hours. | ||
| Electrostatic Capacity Change Rate | NPO Characteristic | C/C0.5% or 0.5pF (larger reading) | |
| X7R | C/C15% | ||
| X7T | -33% C/C22% | ||
| Flexural Strength | No damage. Base board: Al2O3 /PCB. PCB dimension: Thickness: 1.6mm, Length: 100mm, Width: 40mm. Flexural depth: 1mm. Bend speed: 0.5mm/sec. Electro static capacity change rate C/C10%. Test it under the flexural status. | ||
| Terminal Bonding Strength | No visual damage. Applied Force: 5N, Duration: 101S. | ||
| Thermal Shock | NPO Characteristic | C/C2.5% or 0.25pF (larger reading) | |
| X7R/X7P characteristic | C/C0.5% | ||
| X7T characteristic | C/C10% | ||
| Temperature Moisture Exposure | Visual | No visual damage. Test it after place 242 hours normal temp & humidity. | |
| Electrostatic Capacitance Change Rate | NPO: C/C2% or 1pF (larger reading). X7R/X7T/X7P: C/C10%. | ||
| IR | NPO: IR2500M or IR*Cr25S (Lower reading). X7R/X7T/X7P: IR1000M or IR*Cr25S (Lower reading). | ||
| High Temperature Exposure | Visual | No visual damage. Test it after place 48hours under normal pressure & temperature. | |
| Electrostatic Capacitance Change Rate | NPO: C/C2% or 1pF (larger reading). X7R/X7T/X7P: C/C20%. | ||
| IR | NPO: IR4000M or IR*Cr40S (Lower reading). X7R/X7T/X7P: IR2000M or IR*Cr50S (Lower reading). | ||
| PCB Flexural Strength | No crack and other defect. IR. Soldering the MLCC on the PCB, then pressing direction base on the photo. SIZE | A | B | C 0805(2012) | 1.2 | 4 | 1.65 1206(3216) | 2.2 | 5 | 2 1210(3225) | 2.2 | 5 | 2.9 1812(4532) | 3.5 | 7 | 3.7 2220(5750) | 4.5 | 8 | 5.6 | ||
| Embossed Plastic Taping | Embossed tape reel packing for 0805(2012)~1812(4532) type Code | Tapesize | A | B | C | D | E | F | G | H | J | T 0805 | 1.550.20 | 2.350.20 | 8.000.20 | 3.500.05 | 1.750.10 | 4.000.10 | 2.000.10 | 4.000.10 | 1.50 -0/+0.10 | 1.50 Max 1206 | 1.950.20 | 3.600.20 | 8.000.20 | 3.500.05 | 1.750.10 | 4.000.10 | 2.000.10 | 4.000.1 | 1.50 -0/+0.10 | 1.85 Max 1210 | 2.700.10 | 3.420.10 | 8.000.10 | 3.500.05 | 1.750.10 | 4.000.10 | 2.000.05 | 4.000.10 | 1.55 -0/+0.10 | 3.2 Max 1808 | 2.200.10 | 4.950.10 | 12.000.10 | 5.500.05 | 1.750.10 | 4.000.10 | 2.000.05 | 4.000.10 | 1.50 -0/+0.10 | 3.0 Max 1812 | 3.660.10 | 4.950.10 | 12.000.10 | 5.500.05 | 1.750.10 | 8.000.10 | 2.000.05 | 4.000.10 | 1.55 -0/+0.10 | 4.0 Max | ||
| Paper Tape Reel Packing | 1005, 0201, 0402 type Code | Papersize | W1 | L1 | D | C | B | P1 | P2 | P0 | d | t 1005 | 0.240.02 | 0.450.02 | 8.000.10 | 3.500.05 | 1.750.10 | 2.000.05 | 2.000.05 | 4.000.10 | 1.50 -0/+0.10 | 0.30 Below 0201 | 0.370.10 | 0.670.10 | 8.000.10 | 3.500.05 | 1.750.10 | 2.000.05 | 2.000.05 | 4.000.10 | 1.50 -0/+0.10 | 0.80 Below 0402 | 0.650.10 | 1.150.10 | 8.000.10 | 3.500.05 | 1.750.10 | 2.000.05 | 2.000.05 | 4.000.10 | 1.50 -0/+0.10 | 0.80 Below 0603, 0805, 1206 types Code | Papersize | A | B | C | D | E | F | G | H | J | T 0603 | 1.100.10 | 1.900.10 | 8.000.10 | 3.500.05 | 1.750.10 | 4.000.10 | 2.000.10 | 4.000.10 | 1.50 -0/+0.10 | 1.10 Max 0805 | 1.450.15 | 2.300.15 | 8.00.15 | 3.500.05 | 1.750.10 | 4.000.10 | 2.000.10 | 4.000.10 | 1.50 -0/+0.10 | 1.10 Max 1206 | 1.800.20 | 3.400.20 | 8.000.20 | 3.500.05 | 1.750.10 | 4.000.10 | 2.000.10 | 4.000.10 | 1.50 -0/+0.10 | 1.10 Max | ||
| Reel Dimensions | Unit: mm Type | A | B | C | D | E | F | G 7REEL | 1782.0 | 3.0 | 130.5 | 210.5 | 21 or Bigger | 1010.5 | 12max 13REEL | 3302.0 | 3.0 | 130.5 | 210.5 | 21 or Bigger | 1010.5 | 12max | ||
| Taping Specification | Top tape peeling strength: 0.1N < peeling strength < 0.7N. No paper dirty remains on the scotch when peeling, and sticks to top and bottom tape. | ||
| Packing Quantity | Paper T/R (Pcs): 0603: 4000, 0805: 4000, 1206: 4000. Plastic T/R (Pcs): 0805: 3000, 1206: 3000 (T1.60mm), 2000 (T1.60mm), 1812: 1000 (T1.85mm), 800 (T1.85mm), 1812: 500. | ||
| Soldering Method | RReflow Soldering, WWave Soldering. Refer to page 13 for detailed recommendations by size, temperature characteristic, rated voltage, and capacitance. | ||
| Soldering Profile | To avoid crack problems by sudden temperature change, follow the temperature profile in the adjacent graph (refer to the graph in the enclosure page). Preheating: keep temperature difference between soldering temperature and surface temperature of chips as T150. | ||
| Precautions for Use | MLCCs may fail in a short circuit mode when subjected to severe conditions beyond specified ratings. Follow safety precautions and application notes. Manual soldering requires careful handling to avoid thermal cracks. Ensure optimum solder amount for reflow soldering. | ||
2509251626_AIDE-CAPACITOR-1206C0G560J102NT_C48579672.pdf
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