Product Overview
This product is a Multi-Layer Ceramic Capacitor (MLCC) designed for high-voltage applications. It is suitable for coupling, wave filtering, and resonant functions in various power supply circuits, including switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamps. These MLCCs are available in medium and high voltage ratings.
Product Attributes
- Construction: Ceramic dielectric, Inner electrode, Outer electrode, Nickel layer, Tin layer.
- Terminal Composition: Au/Ag-Ni-Sn (From the inside out).
- Compliance: RoHS/REACH compliant.
Technical Specifications
Part Number Description Example: 1812 X7R 684 M 251 N T
Dimension Codes (L*W):
- Inch: 0.02*0.01 (0201), 0.04*0.02 (0402), 0.06*0.03 (0603), 0.08*0.05 (0805), 0.12*0.06 (1206), 0.12*0.10 (1210), 0.18*0.08 (1808), 0.18*0.12 (1812), 0.18*0.25 (1825), 0.22*0.11 (2211), 0.22*0.25 (2225)
- Metric (mm): 0.50*0.25 (0201), 1.00*0.50 (0402), 1.60*0.80 (0603), 2.00*1.25 (0805), 3.20*1.60 (1206), 3.20*2.50 (1210), 4.50*2.00 (1808), 4.50*3.20 (1812), 4.50*6.30 (1825), 5.70*2.8 (2211), 5.70*6.30 (2225)
| Item | Specification/Requirement | Testing Method |
|---|---|---|
| Temperature Range | -55~+125 | - |
| Visual/Dimension | 1. No Damage 2. Dimension meet Spec | Naked eye (Visual inspection), Digital caliper |
| Static Capacity | Meet standard specification and tolerance | See detailed specification for NPO and X7R/X7T/X7P characteristics. |
| Dissipation Factor (DF) | See detailed specification for NPO and X7R/X7T/X7P characteristics. | See detailed specification for testing frequencies and voltages. |
| IR Insulation Resistance | NPO: IR50000M, C10nF; IR*Cr500S, C10nF X7R/X7T/X7P: IR10000M, C25nF; IR*Cr100S, C25nF | Testing condition: Rated voltage, Time: 605s, Humidity: 75%, Temperature: 255, Current: 50mA |
| Hi-pot (DC) | No dielectric breakdown or damage. Voltage multiplier based on rated voltage (Ur). | Voltage Raising time: 110S, Voltage maintaining time: 2S |
| Solderability | Soldering area 90% | Pre-heating temperature 80-120, time 10-30s, lead free solder, flux. Soldering temperature 2455, Solder time 20.5s. |
| Resistance to the heat of soldering | No visual damage, soldering area 90% | Pre-heating temperature 100-200, time 102 s, soldering temperature: 2655, Soldering time: 51s. Cleaning with solvent. Room temperature, time: 242 hours. |
| Electrostatic Capacity Change Rate | NPO: C/C0.5% or 0.5pF X7R: C/C15% X7T: -33% C/C22% X7P: C/C10% | Testing after pre-heating (150 1hour) and 48 hours under normal conditions. |
| Flexural Strength | No damage. Electro static capacity change rate C/C10%. | Base board: Al2O3 /PCB. PCB dimension: Thickness: 1.6mm, Length: 100mm, Width: 40mm. Flexural depth: 1mm. Bend speed: 0.5mm/sec. |
| Terminal Bonding Strength | No visual damage. | Applied Force: 5N, Duration: 101S |
| Thermal Shock | NPO: C/C2.5% or 0.25pF X7R/X7P: C/C0.5% X7T: C/C10% | Pre-condition (X7R h characteristic): Upper limit temperature 1 hour, place 241 hours, start testing. Run 5 cycles. Test after 242 hours normal temp & humidity. |
| Temperature Moisture Exposure | Visual: No visual damage. Capacitance Change Rate: NPO: C/C2% or 1pF; X7R/X7T/X7P: C/C10%. DF: 2 times initial standard. IR: NPO: IR2500M or IR*Cr25S; X7R/X7T/X7P: IR1000M or IR*Cr25S. | Temperature 402, Humidity 90~95%RH, time 50024 hours. Test after 242 hours normal temp & humidity. |
| High Temperature Exposure | Visual: No visual damage. Capacitance Change Rate: NPO: C/C2% or 1pF; X7R/X7T/X7P: C/C20%. DF: 2 X initial standard. IR: NPO: IR4000M or IR*Cr40S; X7R/X7T/X7P: IR2000M or IR*Cr50S. | Temperature 1253, Time 100048 hours. Voltage: 100VV250V (2x Rated voltage), 250VV1KV (1.5x rated voltage), 1KVV (1.2x rated voltage). Test after 48 hours under normal pressure & temperature. |
| PCB Flexural Strength | No crack and other defect. | Soldering the MLCC on the PCB, then pressing direction based on provided diagrams. |
Packing Specifications
Embossed Plastic Taping: Available for 0805(2012) to 1812(4532) types. Detailed tape dimensions (A, B, C, D, E, F, G, H, J, T) are provided for various sizes.
Paper Tape Reel Packing: Available for 1005(0402) to 1206(3216) types. Detailed tape dimensions (W1, L1, D, C, B, P1, P2, P0, d, t) are provided for 1005, 0201, 0402 sizes. Separate dimensions are provided for 0603, 0805, 1206 sizes (A, B, C, D, E, F, G, H, J, T).
Reel Dimensions: 7' REEL (1782.0) and 13' REEL (3302.0) are available.
Taping Specification: Top tape peeling strength: 0.1N < peeling strength < 0.7N.
Packing Quantity: Quantities vary by size and tape type (Paper T/R, Plastic T/R). For example:
- 0603 Paper T/R: 4000 Pcs
- 0805 Plastic T/R: 3000 Pcs
- 1812 Plastic T/R (T1.85mm): 800 Pcs
Recommended Soldering Methods
Soldering methods include Reflow Soldering (R) and Wave Soldering (W), with specific recommendations based on size, temperature characteristics, rated voltage, and capacitance.
Soldering Profile: Specific temperature profiles are recommended to avoid cracks, with a maximum temperature difference (T) of 150 between soldering temperature and surface temperature of chips during preheating.
Precautions For Use
MLCCs may fail in short or open circuit modes under severe electrical or mechanical stress beyond specified ratings. Precautions for safety and application notes should be considered. Manual soldering requires careful handling to prevent thermal cracks. Adherence to recommended soldering profiles and amounts is advised.
2509251626_AIDE-CAPACITOR-1206X7R101K102NT_C48579677.pdf
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