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Specifications
Voltage Rating:
2kV
Capacitance:
100pF
Temperature Coefficient:
X7R
Tolerance:
±10%
Mfr. Part #:
1206X7R101K202NT
Model Number:
1206X7R101K202NT
Package:
1206
Key Attributes
Product Description
Product Overview
High-reliability Multi-Layer Ceramic Capacitors (MLCCs) designed for demanding applications in high-voltage circuits. These capacitors are ideal for coupling, wave filtering, and resonant functions within switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight units, and energy-saving lamps. Available in a range of standard sizes and with various temperature characteristics (C0G, X7R, X5R), these MLCCs offer robust performance and compliance with industry standards.
Product Attributes
- Material: Ceramic dielectric, Inner electrode, Outer electrode (Au/Ag-Ni-Sn terminal composition)
- RoHS/REACH Compliance: Meets standards
Technical Specifications
| Item | Specification/Requirement | Testing Method |
|---|---|---|
| Application Field | Coupling, wave filtering, resonant in high voltage circuits (switch power supplier, AC-DC power charger, DC-DC power charger, networking/Communication interface, LCD backlight unit power supplier, amperite of energy saving lamps, etc.) (Medium and High voltage MLCC) | - |
| Testing Conditions (Normal) | Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa | - |
| Testing Conditions (Relative) | Temperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa | - |
| Temperature Characteristic | C0G (030 PPM/), X7R (15%), X5R (15%) | - |
| Tolerance of Electrostatic Capacity | B: 0.1pF, C: 0.25pF, D: 0.5pF, F: 1%, G: 2%, J: 5%, K: 10%, M: 20%, Z: +80%/-20% | - |
| Rated Voltage (DC) | 250 (25V), 251 (250V), 252 (2500V) | - |
| Terminal Composition | Au/Ag-Ni-Sn (From the inside out) | - |
| Packing | T (Tape/Reel), P (Bag packing) | - |
| Construction | 1. Ceramic dielectric, 2. Inner electrode, 3. Outer electrode, 4. Nickel layer, 5. Tin layer | - |
| Temperature Range | -55~+125 | - |
| Visual/Dimension | 1. No Damage, 2. Dimension meet Spec | Naked eye (Visual inspection), Digital calliper |
| Static Capacity (NPO) | 1000pF: 1MHz10%, 1.00.2Vrms >1000pF: 1KHz10%, 1.00.2Vrms | - |
| Static Capacity (X7R/X7T/X7P) | 10uF: 1KHz10%, 1.00.2Vrms >10uF: 120Hz24, 0.50.1Vrms | - |
| Dissipation Factor (DF) - NPO | DF0.56, Cr5 pF DF1.5[(150/Cr)+7]10-4 (5pFCr50pF) DF0.15%, (50pFCr) Cr1000pF: 1MHz10%, 1V0.2rms Cr1000pF: 1KHz10%, 1V0.2rms | - |
| Dissipation Factor (DF) - X7R/X7T/X7P | Cr10uF: 1KHz10%, 1V0.1rms Cr10uF: 120Hz24Hz, 0.5V0.1Vrms | - |
| Insulation Resistance (IR) - NPO | IR50000M, C10nF IR*Cr500S, C10nF | Rated voltage, Time: 605s, Humidity: 75%, Temperature: 255, Current: 50mA |
| Insulation Resistance (IR) - X7R/X7T/X7P | IR10000M, C25nF IR*Cr100S, C25nF | Rated voltage, Time: 605s, Humidity: 75%, Temperature: 255, Current: 50mA |
| Hi-pot (DC) | Ur=100V: 2.5 x rated voltage Ur=200V/250V: 2.0 x rated voltage Ur=450/500/630V: 1.5 x rated voltage 1KVUr2KV: 1.2 x rated voltage 2KVUr: 1.1 x rated voltage | Voltage Raising time: 110S, Voltage maintaining time: 2S |
| Solderability | Soldering area 90% | Pre-heating temperature 80-120, time 10-30s, lead free solder, flux; Soldering temperature 2455, Solder time 20.5s |
| Resistance to the heat of soldering | No visual damage, soldering area 90% | Pre-heating temperature 100-200, time 102s, soldering temperature: 2655, Soldering time: 51s. Cleaning with solvent. Room temperature, time: 242 hours. |
| Electrostatic Capacity Change Rate (after heat/moisture/high temp exposure) | NPO: 0.5% or 0.5pF X7R: 15% X7T: -33% C/C22% X7P: 10% | - |
| Flexural Strength | No damage, Electro static capacity change rate C/C10% | Base board: Al2O3 /PCB, PCB dimension: Thickness: 1.6mm, Length: 100mm, Width: 40mm, Flexural depth: 1mm, Bend speed: 0.5mm/sec. |
| Terminal Bonding Strength | No visual damage | Applied Force: 5N, Duration: 101S |
| Thermal Shock | NPO: C/C2.5% or 0.25pF X7R/X7P: C/C0.5% X7T: C/C10% | Pre-condition (X7R h characteristic): Upper limit temperature 1 hour, place 241 hours, start testing. Run 5 cycles Thermal shock. Test after place 242 hours normal temp & humidity. |
| Temperature Moisture Exposure | Visual: No visual damage Capacity change rate: NPO: C/C2% or 1pF X7R/X7T/X7P: C/C10% DF: 2 times initial standard IR: NPO: IR2500M or IR*Cr25S X7R/X7T/X7P: IR1000M or IR*Cr25S | Temperature: 402, Humidity: 90~95%RH, Time: 50024 hours. Test after place 242 hours normal temp & humidity. |
| High Temperature Exposure | Visual: No visual damage Capacity change rate: NPO: C/C2% or 1pF X7R/X7T/X7P: C/C20% DF: 2 X initial standard IR: NPO: IR4000M or IR*Cr40S X7R/X7T/X7P: IR2000M or IR*Cr50S | Temperature: 1253, Time: 100048 hours. Voltage: 100VV250V (2x Rated voltage), 250VV1KV (1.5x rated voltage), 1KVV (1.2x rated voltage). Test after place 48 hours under normal pressure & temperature. |
| PCB Flexural Strength | No crack and other defect | IR Soldering the MLCC on the PCB, then pressing direction based on photo. |
| Embossed Plastic Taping Dimensions | Refer to detailed table for 0805 to 1812 types | - |
| Paper Tape Reel Packing Dimensions | Refer to detailed table for 1005, 0201, 0402, 0603, 0805, 1206 types | - |
| Reel Dimensions | 7REEL: 1782.0, 3.0, 130.5, 210.5, 21 or Bigger, 1010.5, 12max 13REEL: 3302.0, 3.0, 130.5, 210.5, 21 or Bigger, 1010.5, 12max | - |
| Top Tape Peeling Strength | 0.1N < peeling strength < 0.7N | Standard: No paper dirty remains on the scotch when peeling, and sticks to top and bottom tape. |
| Packing Quantity | Refer to detailed table for Paper T/R and Plastic T/R quantities by size | - |
Precautions for Use
To avoid short circuit failures, especially under severe electrical or mechanical stress beyond specified ratings, it is crucial to adhere to the following precautions. Failure to do so may result in burnout, flaming, or glowing. For handling precautions or further questions, please contact the engineering section or factory.
- Soldering Profile: Follow the recommended temperature profile to prevent cracks caused by sudden temperature changes.
- Manual Soldering: Exercise caution to avoid thermal cracks. Ensure the soldering iron tip is carefully selected and handled to prevent direct contact with the ceramic body.
- Optimum Solder Amount for Reflow Soldering
- Recommended Soldering amounts
Recommended Soldering Method
| Size | Temperature Characteristics | Rated Voltage | Capacitance | Soldering Method |
|---|---|---|---|---|
| 1005 | NPO | / | / | R |
| X7R/X5R/X7S/X6S | / | / | R | |
| 0201 | NPO | / | / | R |
| X7R/X5R/X7S/X6S | / | / | R | |
| Y5V | / | / | R | |
| 0402 | NPO | / | / | R |
| X7R/X5R/X7S/X6S | / | / | R | |
| Y5V | / | / | R | |
| 0603 | NPO | / | / | R/W |
| X7R/X5R/X7S/X6S | / | C1uf | R | |
| C1uf | R/W | |||
| Y5V | / | C1uf | R | |
| C1uf | R/W | |||
| 0805 | NPO | / | / | R/W |
| X7R/X5R/X7S/X6S | / | C4.7uf | R | |
| C4.7uf | R/W | |||
| Y5V | / | C1uf | R | |
| C1uf | R/W | |||
| 1206 | NPO | / | / | R/W |
| X7R/X5R/X7S/X6S | / | C10uf | R | |
| C10uf | R/W | |||
| Y5V | / | C10uf | R | |
| C10uf | R/W | |||
| 1210 | NPO | / | / | R |
| X7R/X5R/X7S/X6S | / | / | R | |
| Y5V | / | / | R |
Soldering method: RReflow Soldering, WWave Soldering
Soldering Temperature Profile
During preheating, maintain the temperature difference between soldering temperature and chip surface temperature as T150.
2509251626_AIDE-CAPACITOR-1206X7R101K202NT_C48579678.pdf
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