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quality Multi Layer Ceramic Capacitor AIDE CAPACITOR 1206X7R121M282NT for High Voltage Power Supply Circuits factory
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quality Multi Layer Ceramic Capacitor AIDE CAPACITOR 1206X7R121M282NT for High Voltage Power Supply Circuits factory
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Specifications
Voltage Rating:
2.8kV
Capacitance:
120pF
Temperature Coefficient:
X7R
Tolerance:
±20%
Mfr. Part #:
1206X7R121M282NT
Model Number:
1206X7R121M282NT
Package:
1206
Key Attributes
Product Description

Product Overview

This product is a Multi-Layer Ceramic Capacitor (MLCC) designed for high-voltage applications. It is suitable for coupling, wave filtering, and resonant functions in various power supply and electronic circuits, including switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamps. The MLCCs are available in various sizes and temperature characteristics (C0G, X7R, X5R) with precise capacity tolerances and rated voltages.

Product Attributes

  • Temperature Characteristics: C0G (0 30 PPM/), X7R ( 15%), X5R ( 15%)
  • Terminal Composition: Au/Ag-Ni-Sn (from inside out)
  • Packing Options: Tape/Reel (T), Bag packing (P)
  • Compliance: RoHS/REACH compliant

Technical Specifications

Item Description/Specification Testing Method/Condition
Application Field
Coupling, wave filtering, resonant in high voltage circuits, switch power supplier, AC-DC power charger, DC-DC power charger, networking/Communication interface, LCD backlight unit power supplier, amperite of energy saving lamps, etc. (Medium and High voltage MLCC).
Testing Conditions
Normal Condition Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa
Relative Condition Temperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa
Part Number Description Example: 1812 X7R 684 M 251 N T
1. Dimension Code 0201 (0.02*0.01 inch / 0.50*0.25 mm), 0402 (0.04*0.02 inch / 1.00*0.50 mm), 0603 (0.06*0.03 inch / 1.60*0.80 mm), 0805 (0.08*0.05 inch / 2.00*1.25 mm), 1206 (0.12*0.06 inch / 3.20*1.60 mm), 1210 (0.12*0.10 inch / 3.20*2.50 mm), 1808 (0.18*0.08 inch / 4.50*2.00 mm), 1812 (0.18*0.12 inch / 4.50*3.20 mm), 1825 (0.18*0.25 inch / 4.50*6.30 mm), 2211 (0.22*0.11 inch / 5.70*2.8 mm), 2225 (0.22*0.25 inch / 5.70*6.30 mm)
2. Temperature Characteristic C0G (030 PPM/), X7R (15%), X5R (15%)
3. Nominal Electrostatic Capacity 8R0=8.0pF, 100=10pF, 101=100pF
4. Tolerance of Electrostatic Capacity B:0.1pF, C:0.25pF, D:0.5pF, F:1%, G: 2%, J:5%, K:10%, M:20%, Z:+80%/-20%
5. Rated Voltage (DC) 250=25V, 251=250V, 252=2500V
6. Terminal Composition Au/Ag-Ni-Sn
7. Packing T (Tape/Reel), P (Bag packing)
Construction and Dimension
Construction 1. Ceramic dielectric, 2. Inner electrode, 3. Outer electrode, 4. Nickle layer, 5. Tin layer
Dimension (mm) Part Number | L | W | T | WB
0201 (0603) | 0.600.10 | 0.300.05 | 0.300.05 | 0.100.05
0402 (1005) | 1.000.15 | 0.500.15 | 0.500.10 | 0.200.10
0603 (1608) | 1.600.20 | 0.800.15 | 0.800.15 | 0.300.10
0805 (2012) | 2.000.20 | 1.250.20 | 0.800.20 | 0.500.20
1206 (3216) | 3.200.30 | 1.600.30 | 1.000.20 | 0.600.30
1210 (3225) | 3.200.30 | 2.500.30 (2.70) | 0.800.30 | 0.800.20
1808 (4520) | 4.500.40 | 2.000.20 (2.70) | 0.800.30 | 0.500.20
1812 (4532) | 4.500.40 | 3.200.30 (3.50) | 0.800.30 | 1.250.20
1825 (4563) | 4.500.40 | 6.300.50 (3.50) | 0.800.30 | 1.600.30
2220 (5750) | 5.700.50 | 5.000.50 (3.50) | 1.000.40 | 0.800.20
2225 (5763) | 5.700.50 | 6.300.50 (6.20) | 1.000.40 | 1.250.20
Digital Caliper
Specification and Testing Method
Temperature -55~+125
Visual/Dimension 1. No Damage, 2. Dimension meet Spec Naked eye (Visual inspection), Digital calliper
Static Capacity NPO: 1000pF @ 1MHz10%, 1.00.2Vrms; >1000pF @ 1KHz10%, 1.00.2Vrms
X7R/X7T/X7P: 10uF @ 1KHz10%, 1.00.2Vrms; >10uF @ 120Hz24, 0.50.1Vrms
Dissipation Factor (DF) NPO: DF0.56 (Cr5pF), DF1.5[(150/Cr)+7]10-4 (5pFCr50pF), DF0.15% (50pFCr)
X7R/X7T/X7P: See Note 1
NPO: Cr1000pF, 110%MHz, 1V0.2rms; Cr1000pF, 110%KHz, 1V0.2rms
X7R/X7T/X7P: Cr10uF, 110%KHz, 1V0.1rms; Cr10uF, 12024Hz, 0.5V0.1rms
IR Insulation Resistance NPO: IR50000M (C10nF), IR*Cr500S (C10nF)
X7R/X7T/X7P: IR10000M (C25nF), IR*Cr100S (C25nF)
Rated voltage, Time: 605s, Humidity: 75%, Temperature: 255, Current: 50mA
Hi-pot (DC) Ur=100V: 2.5 x rated voltage; Ur=200V/250V: 2.0 x rated voltage; Ur=450/500/630V: 1.5 x rated voltage; 1KVUr2KV: 1.2 x rated voltage; 2KVUr: 1.1 x rated voltage Voltage Raising time: 110S, Voltage maintaining time: 2S
Solderability Soldering area 90% Pre-heating temperature 80-120, time 10-30s, lead free solder, flux. Soldering temperature 2455, Solder time 20.5s
Resistance to the heat of soldering No visual damage, soldering area 90% Pre-heating temperature 100-200, time 102 s, soldering temperature: 2655, Soldering time: 51s. Cleaning with solvent. Room temperature, time: 242 hours.
Electrostatic Capacity Change Rate NPO: |C/C| 0.5% or 0.5pF (larger reading); X7R: |C/C| 15%; X7T: -33% C/C22%; X7P: |C/C| 10% Initial capacitance testing: Pre-heating 150 for 1 hour, then place 48 hours under normal pressure & temperature.
Flexural Strength No damage. Electro static capacity change rate |C/C| 10% Base board: Al2O3 /PCB. PCB dimension: Thickness: 1.6mm, Length: 100mm, Width: 40mm. Flexural depth: 1mm. Bend speed: 0.5mm/sec.
Terminal Bonding Strength No visual damage Applied Force: 5N, Duration: 101S
Thermal Shock NPO: |C/C| 2.5% or 0.25pF (larger reading); X7R/X7P: |C/C| 0.5%; X7T: |C/C| 10% Pre-condition (X7R h characteristic): Upper limit temperature 1 hour, place 241 hours, start testing. Run 5 cycles Thermal shock. Test after placing 242 hours at normal temp & humidity.
Temperature Moisture Exposure Visual: No visual damage. Capacity change rate: NPO: |C/C| 2% or 1pF (larger reading); X7R/X7T/X7P: |C/C| 10%. DF 2 times initial standard. IR: NPO: IR2500M or IR*Cr25S (Lower reading); X7R/X7T/X7P: IR1000M or IR*Cr25S (Lower reading) Temperature 402, Humidity 90~95%RH, time 50024 hours. Test after placing 242 hours at normal temp & humidity.
High Temperature Exposure Visual: No visual damage. Capacity change rate: NPO: |C/C| 2% or 1pF (larger reading); X7R/X7T/X7P: |C/C| 20%. DF 2 X initial standard. IR: NPO: IR4000M or IR*Cr40S (Lower reading); X7R/X7T/X7P: IR2000M or IR*Cr50S (Lower reading) Temperature 1253, Time 100048 hours. Voltage: 100VV250V (2x Rated voltage), 250VV1KV (1.5x rated voltage), 1KVV (1.2x rated voltage). Test after placing 48 hours under normal pressure & temperature.
PCB Flexural Strength No crack and other defect. IR Soldering the MLCC on the PCB, then pressing direction based on diagrams.
Embossed Plastic Taping
Taping Specification Details of tape size (A, B, C, D, E, F, G, H, J) for sizes 0805 to 1812.
Reel Dimensions 7REEL (1782.0), 13REEL (3302.0)
Top tape peeling strength 0.1N < peeling strength < 0.7N Standard: No paper dirty remains on the scotch when peeling, and sticks to top and bottom tape.
Packing Quantity
Paper T/R (Pcs) 0603: 4000, 0805: 4000, 1206: Not specified
Plastic T/R (Pcs) 0805: 3000, 1206: 3000 (T1.35mm) / 2000 (T>1.35mm), 1210: 3000 (T1.60mm) / 2000 (T>1.60mm), 1808: 1000, 1812: 1000 (T1.85mm) / 800 (T>1.85mm)
Precautions For Use
Soldering Profile Follow the temperature profile in the adjacent graph (refer to the graph in the enclosure page).
Manual Soldering Handle carefully, pay attention to soldering iron tip selection and temperature contact.
Recommended Soldering Method RReflow Soldering, WWave Soldering Refer to table for specific size/characteristic recommendations.
Soldering Temperature Profile Keep temperature difference between soldering temperature and surface temperature of chips as T150.

2509251626_AIDE-CAPACITOR-1206X7R121M282NT_C48579679.pdf

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