Product Overview
This product is a Multi-Layer Ceramic Capacitor (MLCC) designed for high-voltage applications. It is suitable for coupling, wave filtering, and resonant functions in various power supply and electronic circuits, including switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamps. The MLCCs are available in various sizes and temperature characteristics (C0G, X7R, X5R) with precise capacity tolerances and rated voltages.
Product Attributes
- Temperature Characteristics: C0G (0 30 PPM/), X7R ( 15%), X5R ( 15%)
- Terminal Composition: Au/Ag-Ni-Sn (from inside out)
- Packing Options: Tape/Reel (T), Bag packing (P)
- Compliance: RoHS/REACH compliant
Technical Specifications
| Item | Description/Specification | Testing Method/Condition |
|---|---|---|
| Application Field | ||
| Coupling, wave filtering, resonant in high voltage circuits, switch power supplier, AC-DC power charger, DC-DC power charger, networking/Communication interface, LCD backlight unit power supplier, amperite of energy saving lamps, etc. (Medium and High voltage MLCC). | ||
| Testing Conditions | ||
| Normal Condition | Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa | |
| Relative Condition | Temperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa | |
| Part Number Description Example: 1812 X7R 684 M 251 N T | ||
| 1. Dimension Code | 0201 (0.02*0.01 inch / 0.50*0.25 mm), 0402 (0.04*0.02 inch / 1.00*0.50 mm), 0603 (0.06*0.03 inch / 1.60*0.80 mm), 0805 (0.08*0.05 inch / 2.00*1.25 mm), 1206 (0.12*0.06 inch / 3.20*1.60 mm), 1210 (0.12*0.10 inch / 3.20*2.50 mm), 1808 (0.18*0.08 inch / 4.50*2.00 mm), 1812 (0.18*0.12 inch / 4.50*3.20 mm), 1825 (0.18*0.25 inch / 4.50*6.30 mm), 2211 (0.22*0.11 inch / 5.70*2.8 mm), 2225 (0.22*0.25 inch / 5.70*6.30 mm) | |
| 2. Temperature Characteristic | C0G (030 PPM/), X7R (15%), X5R (15%) | |
| 3. Nominal Electrostatic Capacity | 8R0=8.0pF, 100=10pF, 101=100pF | |
| 4. Tolerance of Electrostatic Capacity | B:0.1pF, C:0.25pF, D:0.5pF, F:1%, G: 2%, J:5%, K:10%, M:20%, Z:+80%/-20% | |
| 5. Rated Voltage (DC) | 250=25V, 251=250V, 252=2500V | |
| 6. Terminal Composition | Au/Ag-Ni-Sn | |
| 7. Packing | T (Tape/Reel), P (Bag packing) | |
| Construction and Dimension | ||
| Construction | 1. Ceramic dielectric, 2. Inner electrode, 3. Outer electrode, 4. Nickle layer, 5. Tin layer | |
| Dimension (mm) | Part Number | L | W | T | WB 0201 (0603) | 0.600.10 | 0.300.05 | 0.300.05 | 0.100.05 0402 (1005) | 1.000.15 | 0.500.15 | 0.500.10 | 0.200.10 0603 (1608) | 1.600.20 | 0.800.15 | 0.800.15 | 0.300.10 0805 (2012) | 2.000.20 | 1.250.20 | 0.800.20 | 0.500.20 1206 (3216) | 3.200.30 | 1.600.30 | 1.000.20 | 0.600.30 1210 (3225) | 3.200.30 | 2.500.30 (2.70) | 0.800.30 | 0.800.20 1808 (4520) | 4.500.40 | 2.000.20 (2.70) | 0.800.30 | 0.500.20 1812 (4532) | 4.500.40 | 3.200.30 (3.50) | 0.800.30 | 1.250.20 1825 (4563) | 4.500.40 | 6.300.50 (3.50) | 0.800.30 | 1.600.30 2220 (5750) | 5.700.50 | 5.000.50 (3.50) | 1.000.40 | 0.800.20 2225 (5763) | 5.700.50 | 6.300.50 (6.20) | 1.000.40 | 1.250.20 | Digital Caliper |
| Specification and Testing Method | ||
| Temperature | -55~+125 | |
| Visual/Dimension | 1. No Damage, 2. Dimension meet Spec | Naked eye (Visual inspection), Digital calliper |
| Static Capacity | NPO: 1000pF @ 1MHz10%, 1.00.2Vrms; >1000pF @ 1KHz10%, 1.00.2Vrms X7R/X7T/X7P: 10uF @ 1KHz10%, 1.00.2Vrms; >10uF @ 120Hz24, 0.50.1Vrms | |
| Dissipation Factor (DF) | NPO: DF0.56 (Cr5pF), DF1.5[(150/Cr)+7]10-4 (5pFCr50pF), DF0.15% (50pFCr) X7R/X7T/X7P: See Note 1 | NPO: Cr1000pF, 110%MHz, 1V0.2rms; Cr1000pF, 110%KHz, 1V0.2rms X7R/X7T/X7P: Cr10uF, 110%KHz, 1V0.1rms; Cr10uF, 12024Hz, 0.5V0.1rms |
| IR Insulation Resistance | NPO: IR50000M (C10nF), IR*Cr500S (C10nF) X7R/X7T/X7P: IR10000M (C25nF), IR*Cr100S (C25nF) | Rated voltage, Time: 605s, Humidity: 75%, Temperature: 255, Current: 50mA |
| Hi-pot (DC) | Ur=100V: 2.5 x rated voltage; Ur=200V/250V: 2.0 x rated voltage; Ur=450/500/630V: 1.5 x rated voltage; 1KVUr2KV: 1.2 x rated voltage; 2KVUr: 1.1 x rated voltage | Voltage Raising time: 110S, Voltage maintaining time: 2S |
| Solderability | Soldering area 90% | Pre-heating temperature 80-120, time 10-30s, lead free solder, flux. Soldering temperature 2455, Solder time 20.5s |
| Resistance to the heat of soldering | No visual damage, soldering area 90% | Pre-heating temperature 100-200, time 102 s, soldering temperature: 2655, Soldering time: 51s. Cleaning with solvent. Room temperature, time: 242 hours. |
| Electrostatic Capacity Change Rate | NPO: |C/C| 0.5% or 0.5pF (larger reading); X7R: |C/C| 15%; X7T: -33% C/C22%; X7P: |C/C| 10% | Initial capacitance testing: Pre-heating 150 for 1 hour, then place 48 hours under normal pressure & temperature. |
| Flexural Strength | No damage. Electro static capacity change rate |C/C| 10% | Base board: Al2O3 /PCB. PCB dimension: Thickness: 1.6mm, Length: 100mm, Width: 40mm. Flexural depth: 1mm. Bend speed: 0.5mm/sec. |
| Terminal Bonding Strength | No visual damage | Applied Force: 5N, Duration: 101S |
| Thermal Shock | NPO: |C/C| 2.5% or 0.25pF (larger reading); X7R/X7P: |C/C| 0.5%; X7T: |C/C| 10% | Pre-condition (X7R h characteristic): Upper limit temperature 1 hour, place 241 hours, start testing. Run 5 cycles Thermal shock. Test after placing 242 hours at normal temp & humidity. |
| Temperature Moisture Exposure | Visual: No visual damage. Capacity change rate: NPO: |C/C| 2% or 1pF (larger reading); X7R/X7T/X7P: |C/C| 10%. DF 2 times initial standard. IR: NPO: IR2500M or IR*Cr25S (Lower reading); X7R/X7T/X7P: IR1000M or IR*Cr25S (Lower reading) | Temperature 402, Humidity 90~95%RH, time 50024 hours. Test after placing 242 hours at normal temp & humidity. |
| High Temperature Exposure | Visual: No visual damage. Capacity change rate: NPO: |C/C| 2% or 1pF (larger reading); X7R/X7T/X7P: |C/C| 20%. DF 2 X initial standard. IR: NPO: IR4000M or IR*Cr40S (Lower reading); X7R/X7T/X7P: IR2000M or IR*Cr50S (Lower reading) | Temperature 1253, Time 100048 hours. Voltage: 100VV250V (2x Rated voltage), 250VV1KV (1.5x rated voltage), 1KVV (1.2x rated voltage). Test after placing 48 hours under normal pressure & temperature. |
| PCB Flexural Strength | No crack and other defect. IR | Soldering the MLCC on the PCB, then pressing direction based on diagrams. |
| Embossed Plastic Taping | ||
| Taping Specification | Details of tape size (A, B, C, D, E, F, G, H, J) for sizes 0805 to 1812. | |
| Reel Dimensions | 7REEL (1782.0), 13REEL (3302.0) | |
| Top tape peeling strength | 0.1N < peeling strength < 0.7N | Standard: No paper dirty remains on the scotch when peeling, and sticks to top and bottom tape. |
| Packing Quantity | ||
| Paper T/R (Pcs) | 0603: 4000, 0805: 4000, 1206: Not specified | |
| Plastic T/R (Pcs) | 0805: 3000, 1206: 3000 (T1.35mm) / 2000 (T>1.35mm), 1210: 3000 (T1.60mm) / 2000 (T>1.60mm), 1808: 1000, 1812: 1000 (T1.85mm) / 800 (T>1.85mm) | |
| Precautions For Use | ||
| Soldering Profile | Follow the temperature profile in the adjacent graph (refer to the graph in the enclosure page). | |
| Manual Soldering | Handle carefully, pay attention to soldering iron tip selection and temperature contact. | |
| Recommended Soldering Method | RReflow Soldering, WWave Soldering | Refer to table for specific size/characteristic recommendations. |
| Soldering Temperature Profile | Keep temperature difference between soldering temperature and surface temperature of chips as T150. | |
2509251626_AIDE-CAPACITOR-1206X7R121M282NT_C48579679.pdf
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