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Specifications
Voltage Rating:
1kV
Capacitance:
1nF
Temperature Coefficient:
X7R
Tolerance:
±10%
Mfr. Part #:
1206X7R102K102NT
Model Number:
1206X7R102K102NT
Package:
1206
Key Attributes
Product Description
Product Overview
This product is a Multi-Layer Ceramic Capacitor (MLCC) designed for high-voltage applications. It is ideal for coupling, wave filtering, and resonant functions in various power supply and lighting circuits, including switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight units, and energy-saving lamps. The MLCCs are available in various standard sizes and offer different temperature characteristics, capacitance tolerances, and voltage ratings, ensuring suitability for a wide range of demanding electronic systems.
Product Attributes
- Material: Ceramic dielectric, Inner electrode, Outer electrode, Nickel layer, Tin layer
- Terminal Composition: Au/Ag-Ni-Sn (From the inside out)
- Certifications: ROHS/REACH compliant
Technical Specifications
| Item | Description | Specification/Requirement | Testing Method |
|---|---|---|---|
| 1. Application Field | Coupling, wave filtering, resonant in high voltage circuits such as switch power supplier, AC-DC power charger, DC-DC power charger, networking/Communication interface, LCD backlight unit power supplier, amperite of energy saving lamps, etc. (Medium and High voltage MLCC). | ||
| Testing Conditions: Normal: Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa Relative: Temperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa | |||
| 3. Part Number Description | Dimension Code: | 0201, 0402, 0603, 0805, 1206, 1210, 1808, 1812, 1825, 2211, 2225 | See Page 1 for L*W (inch/mm) details |
| Temperature Characteristic: | C0G (030 PPM/), X7R (15%), X5R (15%) | N/A | |
| Nominal Electrostatic Capacity: | e.g., 8R0=8.0pF, 100=10pF, 101=100pF | N/A | |
| Tolerance of Electrostatic Capacity: | B:0.1pF, C:0.25pF, D:0.5pF, F:1%, G: 2%, J:5%, K:10%, M:20%, Z:+80%/-20% | N/A | |
| Rated Voltage (DC): | e.g., 250=25V, 251=250V, 252=2500V | N/A | |
| Terminal Composition: | Au/Ag-Ni-Sn | N/A | |
| Packing: | T (Tape/Reel), P (Bag packing) | N/A | |
| 4. Construction and Dimension | Construction: | 1. Ceramic dielectric, 2. Inner electrode, 3. Outer electrode, 4. Nickel layer, 5. Tin layer | N/A |
| Dimension (mm): | See Page 2 for detailed dimensions (L, W, T, WB) for each size code (e.g., 0201, 0402, etc.) | ||
| 5. Specification and Testing Method | Temperature: | -55~+125 | N/A |
| Visual/Dimension: | 1. No Damage, 2. Dimension meet Spec | Naked eye (Visual inspection), Digital calliper | |
| Static Capacity: | Meet standard specification and tolerance (NPO, X7R/X7T/X7P characteristics) | See Page 3 for detailed frequency, voltage, and capacity ranges for testing | |
| Dissipation Factor (DF): | See Page 3 for NPO and X7R/X7T/X7P characteristic specifications | See Page 3 for detailed frequency and voltage ranges for testing | |
| 5. Specification and Testing Method (cont.) | IR Insulation Resistance: | NPO: 50000M or IR*Cr500S (C10nF / C>10nF) X7R/X7T/X7P: 10000M or IR*Cr100S (C25nF / C>25nF) | Testing condition: Rated voltage, Time: 605s, Humidity: 75%, Temperature: 255, Current: 50mA |
| Hi-pot (DC): | See Page 3 for voltage multipliers based on rated voltage (Ur) | Voltage Raising time: 110S, Voltage maintaining time: 2S | |
| 5. Specification and Testing Method (cont.) | Solderability: | Soldering area 90%, No damage | Pre-heating temperature 80-120, time 10-30s, lead free solder, flux. Soldering temperature 2455, Solder time 20.5s. |
| 5. Specification and Testing Method (cont.) | Resistance to the heat of soldering: | No damage, soldering area 90% | Pre-heating temperature 100-200, time 102 s, soldering temperature: 2655, Soldering time: 51s. Cleaning with solvent. Room temperature, time: 242 hours. |
| 5. Specification and Testing Method (cont.) | Electrostatic capacity change rate: | NPO: 0.5% or 0.5pF X7R: 15% X7T: -33% C/C22% X7P: 10% | See Page 5 for testing conditions |
| 5. Specification and Testing Method (cont.) | Flexural strength: | No damage, Electro static capacity change rate 10% | Base board: Al2O3 /PCB, PCB dimension: Thickness: 1.6mm, Length: 100mm, Width: 40mm, Flexural depth: 1mm, Bend speed: 0.5mm/sec. |
| 5. Specification and Testing Method (cont.) | Terminal bonding strength: | No visual damage | Applied Force: 5N, Duration: 101S |
| 5. Specification and Testing Method (cont.) | Thermal shock: | NPO: 2.5% or 0.25pF X7R/X7P: 0.5% X7T: 10% | 5 cycles, tested after 242 hours at normal temp & humidity. See Page 6 for pre-condition details. |
| 5. Specification and Testing Method (cont.) | Temperature moisture exposure: | Visual: No visual damage Capacitance change rate: NPO: 2% or 1pF, X7R/X7T/X7P: 10% DF: 2 times initial standard IR: NPO: 2500M or IR*Cr25S, X7R/X7T/X7P: 1000M or IR*Cr25S | Temperature 402, Humidity 90~95%RH, time 50024 hours. Tested after 242 hours at normal temp & humidity. |
| 5. Specification and Testing Method (cont.) | High temperature exposure: | Visual: No visual damage Capacitance change rate: NPO: 2% or 1pF, X7R/X7T/X7P: 20% DF: 2 X initial standard IR: NPO: 4000M or IR*Cr40S, X7R/X7T/X7P: 2000M or IR*Cr50S | Temperature 1253, Time 100048 hours. Voltage based on rated voltage (See Page 7). Tested after 48 hours at normal pressure & temperature. |
| 5. Specification and Testing Method (cont.) | PCB flexural strength: | No crack and other defect | IR Soldering the MLCC on PCB, then pressing. See Page 8 for dimensions (A, B, C) for various sizes. |
| 6. EMBOSSED PLASTIC TAPING | Embossed tape reel packing: | For 0805(2012)~1812(4532) type | See Page 8 for detailed tape dimensions (A, B, C, D, E, F, G, H, J, T) |
| 6. EMBOSSED PLASTIC TAPING (cont.) | Paper tape reel packing: | For 1005(0402)~1206(3216) and 0201, 0402, 0603 types | See Page 9 for detailed tape dimensions (W1, L1, D, C, B, P1, P2, P0, d, t) and (A, B, C, D, E, F, G, H, J, T) |
| 6. EMBOSSED PLASTIC TAPING (cont.) | Reel Dimensions: | 7REEL (1782.0), 13REEL (3302.0) | See Page 10 for dimensions (A, B, C, D, E, F, G) |
| 6. EMBOSSED PLASTIC TAPING (cont.) | Taping specification: | Top tape peeling strength: 0.1N < peeling strength < 0.7N | See Page 10 for details |
| 6. EMBOSSED PLASTIC TAPING (cont.) | Packing quantity: | See Page 11 for quantities per size and packing type (Paper T/R, Plastic T/R) | N/A |
| 7. ROHS/REACH compliance | RoHS: | Meet the standard | N/A |
| 7. ROHS/REACH compliance (cont.) | REACH: | Meet the standard | N/A |
| 8. Precautions For Use | MLCCs may fail in short or open circuit modes under severe electrical or mechanical stress beyond ratings, potentially causing burn out, flaming, or glowing. Adhere to safety precautions and application notes. Contact engineering for handling questions. | ||
| Soldering Profile: | Follow temperature profile to avoid cracks due to sudden temperature changes. See adjacent graph (enclosure page). | ||
| 8. Precautions For Use (cont.) | Manual Soldering: | Risk of thermal cracks. Handle soldering iron carefully, paying attention to tip selection and temperature contact. | |
| 9. Recommended Soldering Method | See Page 13 for recommended soldering methods (RReflow Soldering, WWave Soldering) for different sizes, temperature characteristics, rated voltages, and capacitances. | ||
| 10. The temperature profile for soldering | While in preheating, keep the temperature difference between soldering temperature and surface temperature of chips as T150. | ||
2509251626_AIDE-CAPACITOR-1206X7R102K102NT_C48579680.pdf
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