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Specifications
Voltage Rating:
2.8kV
Capacitance:
1nF
Temperature Coefficient:
X7R
Tolerance:
±10%
Mfr. Part #:
1206X7R102K282NT
Model Number:
1206X7R102K282NT
Package:
1206
Key Attributes
Product Description
Product Overview
These Multi-Layer Ceramic Capacitors (MLCCs) are designed for high-voltage applications, serving crucial roles in coupling, wave filtering, and resonance within power supplies and electronic circuits. They are ideal for use in switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamps. Available in various sizes and temperature characteristics, these MLCCs offer reliable performance and robust construction for demanding medium and high-voltage applications.
Product Attributes
- Material: Ceramic dielectric with inner and outer electrodes, nickel layer, and tin layer.
- Terminal Composition: Au/Ag-Ni-Sn (from the inside out).
- Certifications: RoHS/REACH compliant.
Technical Specifications
| Item | Description/Specification | Details |
|---|---|---|
| Application Field | Coupling, wave filtering, resonant in high voltage circuits; switch power supplies, AC-DC power chargers, DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, energy-saving lamps. (Medium and High voltage MLCC) | |
| Testing Conditions | Normal Condition | Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa |
| Relative Condition | Temperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa | |
| Part Number Description Example | 1812 X7R 684 M 251 N T | |
| Dimension Codes (L*W) | 0201 (0.02*0.01 inch / 0.50*0.25 mm) 0402 (0.04*0.02 inch / 1.00*0.50 mm) 0603 (0.06*0.03 inch / 1.60*0.80 mm) 0805 (0.08*0.05 inch / 2.00*1.25 mm) 1206 (0.12*0.06 inch / 3.20*1.60 mm) 1210 (0.12*0.10 inch / 3.20*2.50 mm) 1808 (0.18*0.08 inch / 4.50*2.00 mm) 1812 (0.18*0.12 inch / 4.50*3.20 mm) 1825 (0.18*0.25 inch / 4.50*6.30 mm) 2211 (0.22*0.11 inch / 5.70*2.8 mm) 2225 (0.22*0.25 inch / 5.70*6.30 mm) | |
| Temperature Characteristic | C0G (030 PPM/), X7R (15%), X5R (15%) | |
| Nominal Electrostatic Capacity | 8R0 = 8.0pF, 100 = 10pF, 101 = 100pF | |
| Tolerance of Electrostatic Capacity | B: 0.1pF, C: 0.25pF, D: 0.5pF, F: 1%, G: 2%, J: 5%, K: 10%, M: 20%, Z: +80%/-20% | |
| Rated Voltage (DC) | 250 = 25V, 251 = 250V, 252 = 2500V | |
| Packing | T = Tape/Reel, P = Bag packing (PE) | |
| Construction | 1. Ceramic dielectric, 2. Inner electrode, 3. Outer electrode, 4. Nickel layer, 5. Tin layer | |
| Dimensions (mm) | 0201 (0603): L 0.600.10, W 0.300.05, T 0.300.05, WB 0.100.05 0402 (1005): L 1.000.15, W 0.500.15, T 0.500.10, WB 0.200.10 0603 (1608): L 1.600.20, W 0.800.15, T 0.800.15, WB 0.300.10, (T 0.600.10) 0805 (2012): L 2.000.20, W 1.250.20, T 0.800.20, WB 0.500.20, (T 1.000.20, WB 0.800.20) 1206 (3216): L 3.200.30, W 1.600.30, T 1.000.20, WB 0.600.30, (T 1.250.20, WB 1.600.30) 1210 (3225): L 3.200.30, W 2.500.30 (2.70), T 0.800.30 1808 (4520): L 4.500.40, W 2.000.20 (2.70), T 0.800.30 1812 (4532): L 4.500.40, W 3.200.30 (3.50), T 0.800.30 1825 (4563): L 4.500.40, W 6.300.50 (3.50), T 0.800.30 2220 (5750): L 5.700.50, W 5.000.50 (3.50), T 1.000.40 2225 (5763): L 5.700.50, W 6.300.50 (6.20), T 1.000.40 | |
| Temperature Range | -55~+125 | |
| Visual/Dimension Inspection | No Damage, Dimension meet Spec | |
| Static Capacity | Meets standard specification and tolerance. NPO: 1MHz10%, 1.00.2Vrms (1000pF); 1KHz10%, 1.00.2Vrms (>1000pF) X7R/X7T/X7P: 1KHz10%, 1.00.2Vrms (10uF); 120Hz24, 0.50.1Vrms (>10uF) | |
| Dissipation Factor (DF) | NPO: DF0.56 (Cr5pF); DF1.5[(150/Cr)+7]10-4 (5pFCr50pF); DF0.15% (50pFCr). Testing frequency 110%MHz, voltage 1V0.2rms (Cr1000pF); 110%KHz, voltage 1V0.2rms (Cr>1000pF). X7R/X7T/X7P: Cr10uF, 1KHz10%, 1V0.1rms; Cr10uF, 12024Hz, 0.5V0.1rms. See Note 1 for exceptions. | |
| Insulation Resistance (IR) | NPO: IR50000M (C10nF); IR*Cr500S (C>10nF). Testing condition: Rated voltage, 605s, Humidity:75%, Temp:255, Current:50mA. X7R/X7T/X7P: IR10000M (C25nF); IR*Cr100S (C>25nF). | |
| Hi-pot (DC) | No dielectric breakdown or damage. Ur=100V: 2.5 x rated voltage; Ur=200V/250V: 2.0 x rated voltage; Ur=450/500/630V: 1.5 x rated voltage; 1KVUr2KV: 1.2 x rated voltage; 2KVUr: 1.1 x rated voltage. Voltage Raising time: 110S, maintaining time2S. | |
| Solderability | Soldering area90%. Visual-No damage. Pre-heating: 80-120, 10-30s. Lead free solder, flux. Soldering temp: 2455, time: 20.5s. | |
| Resistance to the heat of soldering | Visual-No damage, soldering area90%. Pre-heating: 100-200, 102s. Soldering temp: 2655, time: 51s. Cleaning with solvent. Room temp, 242 hours. | |
| Electrostatic Capacity Change Rate | NPO: C/C0.5% or 0.5pF (larger reading). X7R: C/C15%. X7T: -33% C/C22%. X7P: C/C10%. | |
| Flexural Strength | No damage. Base board: Al2O3 /PCB. PCB dimension: Thickness: 1.6mm, Length: 100mm, Width: 40mm. Flexural depth: 1mm. Bend speed: 0.5mm/sec. Electro static capacity change rate: C/C10%. | |
| Terminal Bonding Strength | No visual damage. Applied Force: 5N, Duration: 101S. | |
| Thermal Shock | NPO: C/C2.5% or 0.25pF (larger reading). X7R/X7P: C/C0.5%. X7T: C/C10%. 5 cycles. Test after 242 hours at normal temp & humidity. | |
| Temperature Moisture Exposure | Visual: No visual damage. Temp: 402, Humidity: 90~95%RH, Time: 50024 hours. Capacity change rate: NPO: C/C2% or 1pF (larger reading); X7R/X7T/X7P: C/C10%. DF: 2 times initial standard. IR: NPO: IR2500M or IR*Cr25S (lower reading); X7R/X7T/X7P: IR1000M or IR*Cr25S (lower reading). Test after 242 hours at normal temp & humidity. | |
| High Temperature Exposure | Visual: No visual damage. Temp: 1253, Time: 100048 hours. Voltage: 100VV250V (2x Rated voltage), 250VV1KV (1.5x rated voltage), 1KVV (1.2x rated voltage). Capacity change rate: NPO: C/C2% or 1pF (larger reading); X7R/X7T/X7P: C/C20%. DF: 2 X initial standard. IR: NPO: IR4000M or IR*Cr40S (lower reading); X7R/X7T/X7P: IR2000M or IR*Cr50S (lower reading). Test after 48 hours under normal pressure & temperature. | |
| PCB Flexural Strength | No crack and other defect. IR measurement after soldering. Sizes: 0805(2012): A 1.2, B 4, C 1.65; 1206(3216): A 2.2, B 5, C 2; 1210(3225): A 2.2, B 5, C 2.9; 1812(4532): A 3.5, B 7, C 3.7; 2220(5750): A 4.5, B 8, C 5.6. | |
| Embossed Plastic Taping | 0805: Tape size 1.550.20, A 2.350.20, B 8.000.20, C 3.500.05, D 1.750.10, E 4.000.10, F 2.000.10, G 4.000.10, H 1.50 -0/+0.10, J 1.50 Max. 1206: Tape size 1.950.20, A 3.600.20, B 8.000.20, C 3.500.05, D 1.750.10, E 4.000.10, F 2.000.10, G 4.000.1, H 1.50 -0/+0.10, J 1.85 Max. 1210: Tape size 2.700.10, A 3.420.10, B 8.000.10, C 3.500.05, D 1.750.10, E 4.000.10, F 2.000.05, G 4.000.10, H 1.55 -0/+0.10, J 3.2 Max. 1808: Tape size 2.200.10, A 4.950.10, B 12.000.10, C 5.500.05, D 1.750.10, E 4.000.10, F 2.000.05, G 4.000.10, H 1.50 -0/+0.10, J 3.0 Max. 1812: Tape size 3.660.10, A 4.950.10, B 12.000.10, C 5.500.05, D 1.750.10, E 8.000.10, F 2.000.05, G 4.000.10, H 1.55 -0/+0.10, J 4.0 Max. | |
| Paper Tape Reel Packing | 1005: Papersize W1 0.240.02, L1 0.450.02, D 8.000.10, C 3.500.05, B 1.750.10, P1 2.000.05, P2 2.000.05, P0 4.000.10, d 1.50 -0/+0.10, t Below 0.30. 0201: Papersize W1 0.370.10, L1 0.670.10, D 8.000.10, C 3.500.05, B 1.750.10, P1 2.000.05, P2 2.000.05, P0 4.000.10, d 1.50 -0/+0.10, t Below 0.80. 0402: Papersize W1 0.650.10, L1 1.150.10, D 8.000.10, C 3.500.05, B 1.750.10, P1 2.000.05, P2 2.000.05, P0 4.000.10, d 1.50 -0/+0.10, t Below 0.80. 0603: Papersize A 1.100.10, B 1.900.10, C 8.000.10, D 3.500.05, E 1.750.10, F 4.000.10, G 2.000.10, H 4.000.10, J 1.50 -0/+0.10, T 1.10 Max. 0805: Papersize A 1.450.15, B 2.300.15, C 8.00.15, D 3.500.05, E 1.750.10, F 4.000.10, G 2.000.10, H 4.000.10, J 1.50 -0/+0.10, T 1.10 Max. 1206: Papersize A 1.800.20, B 3.400.20, C 8.000.20, D 3.500.05, E 1.750.10, F 4.000.10, G 2.000.10, H 4.000.10, J 1.50 -0/+0.10, T 1.10 Max. | |
| Reel Dimensions | 7' REEL: 1782.0, A 3.0, B 130.5, C 210.5, D 21 or Bigger, E 1010.5, F 12max. 13' REEL: 3302.0, A 3.0, B 130.5, C 210.5, D 21 or Bigger, E 1010.5, F 12max. | |
| Top Tape Peeling Strength | 0.1N < peeling strength < 0.7N. No paper dirty remains on the scotch when peeling. | |
| Packing Quantity | 0603 Paper T/R: 4000 pcs 0805 Paper T/R: 4000 pcs 0805 Plastic T/R: 3000 pcs (T1.35mm) 1206 Plastic T/R: 3000 pcs (T1.60mm), 2000 pcs (T1.60mm) 1210 Plastic T/R: 3000 pcs (T1.85mm), 1000 pcs (T1.85mm) 1808 Plastic T/R: 2000 pcs 1812 Plastic T/R: 1000 pcs (T1.85mm), 800 pcs (T1.85mm) 1812 Plastic T/R: 500 pcs | |
| Soldering Method Recommendation | RReflow Soldering, WWave Soldering. See Page 13 for specific recommendations by size, characteristics, voltage, and capacitance. | |
| Soldering Temperature Profile | Keep temperature difference between soldering temperature and surface temperature of chips as T150. | |
Precautions For Use
Multi-layer Ceramic Capacitors (MLCCs) may fail in a short circuit or open circuit mode when subjected to severe electrical or mechanical stress beyond specified ratings. This can result in burn out, flaming, or glowing. Adhere to the following precautions for safety and application notes. Contact the engineering section or factory for handling questions.
- Soldering Profile: Follow the recommended temperature profile to avoid cracks due to sudden temperature changes.
- Manual Soldering: Exercise caution to prevent thermal cracks. Ensure the soldering iron tip is appropriate and contact is managed carefully.
- Optimum Solder Amount for Reflow Soldering
- Recommended Soldering amounts
2509251626_AIDE-CAPACITOR-1206X7R102K282NT_C48579683.pdf
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