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Specifications
Voltage Rating:
630V
Capacitance:
10nF
Temperature Coefficient:
X7R
Tolerance:
±10%
Mfr. Part #:
1206X7R103K631NT
Model Number:
1206X7R103K631NT
Package:
1206
Key Attributes
Product Description
Product Overview
This product is a Multi-layer Ceramic Capacitor (MLCC) designed for high-voltage applications. It is suitable for coupling, wave filtering, and resonant functions in various power supply and electronic circuits, including switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamps. These MLCCs are available in medium and high voltage ratings.
Product Attributes
- Terminal Composition: Au/Ag-Ni-Sn (from the inside out)
- RoHS/REACH Compliance: Meets RoHS and REACH standards.
Technical Specifications
| Item | Description/Specification | Testing Method/Conditions | ||
|---|---|---|---|---|
| Application Field | ||||
| Coupling, wave filtering, resonant in high voltage circuits | Switch power supplier, AC-DC power charger, DC-DC power charger, networking/Communication interface, LCD backlight unit power supplier, amperite of energy saving lamps, etc. (Medium and High voltage MLCC). | |||
| Testing Conditions | ||||
| Normal Condition | Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa | (No special requirements) | ||
| Relative Condition | Temperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa | For data not matching testing specification | ||
| Part Number Description Example: 1812 X7R 684 M 251 N T | ||||
| 1. Dimension Code | 0201, 0402, 0603, 0805, 1206, 1210, 1808, 1812, 1825, 2211, 2225 | Refer to table for L*W (inch/mm) | ||
| 2. Temperature Characteristic | C0G (030 PPM/), X7R (15%), X5R (15%) | |||
| 3. Nominal Electrostatic Capacity | 8R0=8.0pF, 100=10pF, 101=100pF | |||
| 4. Tolerance of Electrostatic Capacity | B:0.1pF, C:0.25pF, D:0.5pF, F:1%, G: 2%, J:5%, K:10%, M:20%, Z:+80%/-20% | |||
| 5. Rated Voltage (DC) | 250=25V, 251=250V, 252=2500V | |||
| 6. Terminal Composition | Au/Ag-Ni-Sn (From the inside out) | |||
| 7. Packing | T: Tape/Reel, P: Bag packing (PE) | |||
| Construction | ||||
| 1. Ceramic Dielectric | ||||
| 2. Inner Electrode | ||||
| 3. Outer Electrode | ||||
| 4. Nickel Layer | ||||
| 5. Tin Layer | ||||
| Dimension (mm) | ||||
| Part Number | L | W | T | WB |
| 0201 (0603) | 0.600.10 | 0.300.05 | 0.300.05 | 0.100.05 |
| 0402 (1005) | 1.000.15 | 0.500.15 | 0.500.10 | 0.200.10 |
| 0603 (1608) | 1.600.20 | 0.800.15 | 0.800.15 | 0.300.10 |
| 0805 (2012) | 2.000.20 | 1.250.20 | 0.800.20 | 0.500.20 |
| 1206 (3216) | 3.200.30 | 1.600.30 | 1.000.20 | 0.600.30 |
| 1210 (3225) | 3.200.30 | 2.500.30 | 2.70 | 0.800.30 |
| 1808 (4520) | 4.500.40 | 2.000.20 | 2.70 | 0.800.30 |
| 1812 (4532) | 4.500.40 | 3.200.30 | 3.50 | 0.800.30 |
| 1825 (4563) | 4.500.40 | 6.300.50 | 3.50 | 0.800.30 |
| 2220 (5750) | 5.700.50 | 5.000.50 | 3.50 | 1.000.40 |
| 2225 (5763) | 5.700.50 | 6.300.50 | 6.20 | 1.000.40 |
| Specifications and Testing Methods | ||||
| Temperature | -55~+125 | |||
| Visual/Dimension | 1. No Damage, 2. Dimension meet Spec | Naked eye (Visual inspection), Digital caliper | ||
| Static Capacity | Meet standard specification and tolerance | NPO: 1MHz10%, 1.00.2Vrms (1000pF); 1KHz10%, 1.00.2Vrms (>1000pF). X7R/X7T/X7P: 1KHz10%, 1.00.2Vrms (10uF); 120Hz24, 0.50.1Vrms (>10uF). | ||
| Dissipation Factor (DF) | NPO: DF0.56, Cr5 pF; DF1.5[(150/Cr)+7]10-4 (5pFCr50pF); DF0.15%, (50pFCr). Cr1000pF, 110%MHz, 1V0.2rms. Cr1000pF, 110%KHz, 1V0.2rms. X7R/X7T/X7P: Cr10uF, 110%KHz, 1V0.1rms. Cr10uF, 12024Hz, 0.5V0.1rms. | Refer to Note 1 for X7R/X7T/X7P details. | ||
| IR Insulation Resistance | NPO: IR50000M, C10nF; IR*Cr500S, C10nF. X7R/X7T/X7P: IR10000M, C25nF; IR*Cr100S, C25nF. | Rated voltage, Time: 605s, Humidity: 75%, Temperature: 255, Current: 50mA. | ||
| Hi-pot (DC) | No dielectric breakdown or damage | Ur=100V, 2.5 x rated voltage; Ur=200V/250V, 2.0 x rated voltage; Ur=450/500/630V, 1.5 x rated voltage; 1KVUr2KV, 1.2 x rated voltage; 2KVUr, 1.1 x rated voltage. Voltage Raising time: 110S, Voltage maintaining time: 2S. | ||
| Solderability | Soldering area90% | Pre-heating temperature 80-120, time 10-30s, lead free solder, flux. Soldering temperature 2455, Solder time 20.5s. | ||
| Resistance to the heat of soldering | No visual damage, soldering area90% | Pre-heating temperature 100-200, time 102 s, soldering temperature: 2655, Soldering time: 51s. Cleaning with solvent. Room temperature, time: 242 hours. | ||
| Electrostatic Capacity Change Rate | NPO: C/C0.5% or 0.5pF (larger reading). X7R: C/C15%. X7T: -33% C/C22%. X7P: C/C10%. | Initial capacitance testing: Pre-heating 150 for 1 hour, then place 48 hours under normal pressure & temperature. | ||
| Flexural Strength | No damage | Base board: Al2O3 /PCB. PCB dimension: Thickness: 1.6mm, Length: 100mm, Width: 40mm. Flexural depth: 1mm. Bend speed: 0.5mm/sec. Test under flexural status. Electro static capacity change rate C/C10%. Flexural depth 452. | ||
| Terminal Bonding Strength | No visual damage | Applied Force: 5N, Duration: 101S. | ||
| Thermal Shock | NPO: C/C2.5% or 0.25pF (larger reading). X7R/X7P: C/C0.5%. X7T: C/C10%. | Pre-condition (X7R h characteristic): Upper limit temperature 1 hour, place 241 hours, start testing. Run 5 cycles Thermal shock. Test after placing 242 hours at normal temp & humidity. | ||
| Temperature Moisture Exposure | Visual: No visual damage. Capacity change rate: NPO: C/C2% or 1pF (larger reading). X7R/X7T/X7P: C/C10%. DF 2 times initial standard. IR: NPO: IR2500M or IR*Cr25S (Lower reading). X7R/X7T/X7P: IR1000M or IR*Cr25S (Lower reading). | Temperature 402, Humidity 90~95%RH, time 50024 hours. Test after placing 242 hours at normal temp & humidity. | ||
| High Temperature Exposure | Visual: No visual damage. Capacity change rate: NPO: C/C2% or 1pF (larger reading). X7R/X7T/X7P: C/C20%. DF 2 X initial standard. IR: NPO: IR4000M or IR*Cr40S (Lower reading). X7R/X7T/X7P: IR2000M or IR*Cr50S (Lower reading). | Temperature 1253, Time 100048 hours. Voltage: 100VV250V (2x Rated voltage), 250VV1KV (1.5x rated voltage), 1KVV (1.2x rated voltage). Charging and discharging current 50mA Max. Test after placing 48 hours under normal pressure & temperature. | ||
| PCB Flexural Strength | No crack and other defect. IR. | Soldering the MLCC on the PCB, then pressing direction based on the photo. | ||
| Packing Quantity | Refer to table for Paper T/R (Pcs) and Plastic T/R (Pcs) by size. | |||
| Soldering Method | RReflow Soldering, WWave Soldering | Refer to table for recommended methods by size, temperature characteristics, rated voltage, and capacitance. | ||
| Soldering Temperature Profile | Preheating temperature difference between soldering temperature and surface temperature of chips: T150. | |||
2509251626_AIDE-CAPACITOR-1206X7R103K631NT_C48579685.pdf
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