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Specifications
Voltage Rating:
100V
Capacitance:
100nF
Temperature Coefficient:
X7R
Tolerance:
±10%
Mfr. Part #:
1206X7R104K101NT
Model Number:
1206X7R104K101NT
Package:
1206
Key Attributes
Product Description
Product Overview
This product is a Multi-Layer Ceramic Capacitor (MLCC) designed for high-voltage applications. It is suitable for coupling, wave filtering, and resonant functions in various power supply and lighting circuits, including switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamps. The MLCCs are available in various sizes and temperature characteristics, with options for different voltage ratings and tolerances, ensuring reliable performance in demanding electrical environments.
Product Attributes
- Temperature Characteristics: C0G (030 PPM/), X7R (15%), X5R (15%)
- Terminal Composition: Au/Ag-Ni-Sn (From the inside out)
- Packing Options: Tape/Reel (T), Bag packing (P)
- Compliance: ROHS/REACH
Technical Specifications
| Item | Description | Specification/Requirement | Testing Method |
|---|---|---|---|
| Application Field | Coupling, wave filtering, resonant in high voltage circuits, switch power supplier, AC-DC power charger, DC-DC power charger, networking/Communication interface, LCD backlight unit power supplier, amperite of energy saving lamps, etc. (Medium and High voltage MLCC). | ||
| Testing Conditions: Normal: Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa Relative: Temperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa | |||
| Part Number Description | 1. Dimension Code | 0201 (0.02*0.01 inch / 0.50*0.25 mm) to 2225 (0.22*0.25 inch / 5.70*6.30 mm) | |
| 2. Temperature Characteristic | C0G (030 PPM/), X7R (15%), X5R (15%) | ||
| 3. Nominal Electrostatic Capacity | 8R08.0, 10010, 101100 (pF) | ||
| 4. Tolerance of Electrostatic Capacity | B:0.1pF, C:0.25pF, D:0.5pF, F:1%, G: 2%, J:5%, K:10%, M:20%, Z:+80%/-20% | ||
| 5. Rated Voltage (DC) | 25025, 251250, 2522500 (V) | ||
| 6. Terminal Composition | Au/Ag-Ni-Sn (From the inside out) | ||
| Construction & Dimension | Construction | 1. Ceramic dielectric, 2. Inner electrode, 3. Outer electrode, 4. Nickle layer, 5. Tin layer | |
| Dimension (mm) | Various sizes from 0.60x0.30x0.30mm (0201) to 5.70x6.30mm (2225) with specific tolerances for L, W, and T (Thickness/WB). | ||
| Temperature Range | -55~+125 | ||
| Static Capacity | NPO: 1000pF: 1MHz10%, 1.00.2Vrms; >1000pF: 1KHz10%, 1.00.2Vrms X7R/X7T/X7P: 10uF: 1KHz10%, 1.00.2Vrms; >10uF: 120Hz24, 0.50.1Vrms | ||
| Dissipation Factor (DF) | NPO: DF0.56, Cr5 pF; DF1.5[(150/Cr)+7]10-4 (5pFCr50pF); DF0.15%, (50pFCr). Testing frequency 110%MHz, Voltage 1V0.2rms (Cr1000pF); 110%KHz, Voltage 1V0.2rms (Cr1000pF). X7R/X7T/X7P: Cr10uF, Test frequency 110%KHz, Voltage 1V0.1rms. Cr10uF, Frequency 12024Hz, Voltage 0.5V0.1rms. (Refer to Note 1 for specific DF exceptions based on voltage and capacitance). | ||
| Insulation Resistance (IR) | NPO: IR50000M, C10nF; IR*Cr500S, C10nF. Testing condition: Rated voltage, Time: 605s, Humidity: 75%, Temperature: 255, Current: 50mA. X7R/X7T/X7P: IR10000M, C25nF; IR*Cr100S, C25nF. | ||
| Hi-pot (DC) | No dielectric breakdown or damage. Test voltage varies based on rated voltage (Ur): 100V: 2.5 x Ur; 200V/250V: 2.0 x Ur; 450/500/630V: 1.5 x Ur; 1KVUr2KV: 1.2 x Ur; 2KVUr: 1.1 x Ur. Voltage Raising time: 110S, Voltage maintaining time: 2S. | ||
| Solderability | Soldering area 90%. Visual-No damage. Pre-heating temperature 80-120, time 10-30s, lead free solder, flux. Soldering temperature 2455, Solder time 20.5s. | ||
| Resistance to the heat of soldering | Visual-No damage, soldering area 90%. Pre-heating temperature 100-200, time 102 s, soldering temperature: 2655, Soldering time: 51s. Cleaning with solvent. Room temperature, time: 242 hours. | ||
| Electrostatic Capacity Change Rate | NPO: C/C0.5% or 0.5pF (larger reading) X7R: C/C15% X7T: -33% C/C22% X7P: C/C10% | ||
| Flexural Strength | No damage. Base board: Al2O3 /PCB. PCB dimension: Thickness: 1.6mm, Length: 100mm, Width: 40mm. Flexural depth: 1mm. Bend speed: 0.5mm/sec. Electro static capacity change rate: C/C10%. Test under flexural status. | ||
| Terminal Bonding Strength | No visual damage. Applied Force: 5N, Duration: 101S. | ||
| Thermal Shock | NPO: C/C2.5% or 0.25pF (larger reading) X7R/X7P: C/C0.5% X7T: C/C10%. Pre-condition (X7R h characteristic): Upper limit temperature 1hour, place 241 hours, start testing. Run 5 cycles Thermal shock. Test after place 242 hours normal temp & humidity. | ||
| Temperature Moisture Exposure | Visual: No visual damage. Test after place 242 hours normal temp & humidity. Temperature: 402, Humidity: 90~95%RH, Time: 50024 hours. Capacitance Change Rate: NPO: C/C2% or 1pF (larger reading); X7R/X7T/X7P: C/C10%. DF: 2 times initial standard. IR: NPO: IR2500M or IR*Cr25S (Lower reading); X7R/X7T/X7P: IR1000M or IR*Cr25S (Lower reading). | ||
| High Temperature Exposure | Visual: No visual damage. Test after place 48 hours under normal pressure & temperature. Temperature: 1253, Time: 100048 hours. Voltage: 100VV250V (2x Rated voltage), 250VV1KV (1.5x rated voltage), 1KVV (1.2x rated voltage). Capacitance Change Rate: NPO: C/C2% or 1pF (larger reading); X7R/X7T/X7P: C/C20%. DF: 2 X initial standard. IR: NPO: IR4000M or IR*Cr40S (Lower reading); X7R/X7T/X7P: IR2000M or IR*Cr50S (Lower reading). | ||
| PCB Flexural Strength | No crack and other defect. IR. Soldering the MLCC on the PCB, then pressing direction based on the photo. Sizes (A, B, C): 0805(2012): 1.2, 4, 1.65; 1206(3216): 2.2, 5, 2; 1210(3225): 2.2, 5, 2.9; 1812(4532): 3.5, 7, 3.7; 2220(5750): 4.5, 8, 5.6. | ||
| Embossed Plastic Taping | Details provided for tape sizes A, B, C, D, E, F, G, H, J, T for types 0805 to 1812. Reel dimensions for 7' and 13' reels. Top tape peeling strength: 0.1N < peeling strength < 0.7N. | ||
| Paper Tape Reel Packing | Details provided for tape sizes W1, L1, D, C, B, P1, P2, P0, d, t for types 1005, 0201, 0402, 0603, 0805, 1206. Reel dimensions for 7' and 13' reels. | ||
| Packing Quantity | Paper T/R: 4000 pcs (0603, 0805), 2000 pcs (1206). Plastic T/R: 3000 pcs (0805, 1206, 1210), 2000 pcs (1808, 1812), 1000 pcs (1812+), 800 pcs, 500 pcs. Specific quantities vary by size and tape type. | ||
| Soldering Method Recommendation | Recommended methods (R-Reflow, W-Wave) based on size, temperature characteristics, rated voltage, and capacitance. For example, 0603 NPO: R/W; X7R/X5R/X7S/X6S: C1uf R, C1uf R/W. | ||
| Soldering Temperature Profile | Preheating temperature difference between soldering temperature and surface temperature of chips should be T150. | ||
2509251626_AIDE-CAPACITOR-1206X7R104K101NT_C48579686.pdf
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