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Specifications
Voltage Rating:
25V
Capacitance:
1uF
Temperature Coefficient:
X7R
Tolerance:
±10%
Mfr. Part #:
1206X7R105K250NT
Model Number:
1206X7R105K250NT
Package:
1206
Key Attributes
Product Description
Product Overview
These Multi-Layer Ceramic Capacitors (MLCCs) are designed for high-voltage applications, including coupling, wave filtering, and resonant functions. They are suitable for use in switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamps. The MLCCs are available in various sizes and temperature characteristics, offering reliable performance in demanding electrical environments.
Product Attributes
- Material: Ceramic dielectric, Inner electrode, Outer electrode, Nickel layer, Tin layer
- Terminal Composition: Au/Ag-Ni-Sn (From the inside out)
- Certifications: ROHS/REACH compliance
Technical Specifications
| Item | Description | Specification/Requirement | Testing Method | ||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|
| Application Field | Coupling, wave filtering, resonant in high voltage circuits, switch power supplier, AC-DC power charger, DC-DC power charger, networking/Communication interface, LCD backlight unit power supplier, amperite of energy saving lamps, etc. (Medium and High voltage MLCC) | ||||||||||
| Testing Conditions: Normal: Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa Relative: Temperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa | |||||||||||
| Part Number Description | Item | Description | Example | ||||||||
| 1. Dimension Code | 0201, 0402, 0603, 0805, 1206, 1210, 1808, 1812, 1825, 2211, 2225 | 1812 | |||||||||
| 2. Temperature Characteristic | C0G (030 PPM/), X7R (15%), X5R (15%) | X7R | |||||||||
| 3. Nominal Electrostatic Capacity | 8R08.0, 10010, 101100 (pF) | 684 (680,000pF or 0.68uF) | |||||||||
| 4. Tolerance of Electrostatic Capacity | B:0.1pF, C:0.25pF, D:0.5pF, F:1%, G: 2%, J:5%, K:10%, M:20%, Z:+80%/-20% | M (20%) | |||||||||
| 5. Rated Voltage (DC) | 25025V, 251250V, 2522500V | 251 (250V) | |||||||||
| 6. Terminal Composition | Au/Ag-Ni-Sn (From the inside out) | N (Not specified in example, standard is Au/Ag-Ni-Sn) | |||||||||
| 7. Packing | T: Tape/Reel, P: Bag packing (PE) | T | |||||||||
| Construction and Dimension | Construction | 1. Ceramic dielectric, 2. Inner electrode, 3. Outer electrode, 4. Nickel layer, 5. Tin layer | |||||||||
| Dimension (mm) | Part Number | L (mm) | W (mm) | T (mm) | WB (mm) | ||||||
| 0201 (0603) | 0.600.10 | 0.300.05 | 0.300.05 | 0.100.05 | |||||||
| 0402 (1005) | 1.000.15 | 0.500.15 | 0.500.10 | 0.200.10 | |||||||
| 0603 (1608) | 1.600.20 | 0.800.15 | 0.800.15 | 0.300.10 | |||||||
| 0805 (2012) | 2.000.20 | 1.250.20 | 0.800.20 | 0.500.20 | |||||||
| 1206 (3216) | 3.200.30 | 1.600.30 | 1.000.20 | 0.600.30 | |||||||
| 1210 (3225) | 3.200.30 | 2.500.30 | 2.70 | 0.800.30 | |||||||
| 1808 (4520) | 4.500.40 | 2.000.20 | 2.70 | 0.800.30 | |||||||
| 1812 (4532) | 4.500.40 | 3.200.30 | 3.50 | 0.800.30 | |||||||
| 1825 (4563) | 4.500.40 | 6.300.50 | 3.50 | 0.800.30 | |||||||
| 2220 (5750) | 5.700.50 | 5.000.50 | 3.50 | 1.000.40 | |||||||
| 2225 (5763) | 5.700.50 | 6.300.50 | 6.20 | 1.000.40 | |||||||
| Specification and Testing Method | Temperature Range | -55~+125 | Naked eye (Visual inspection), Digital caliper | ||||||||
| Visual/Dimension | 1. No Damage, 2. Dimension meet Spec | Naked eye (Visual inspection), Digital caliper | |||||||||
| Static Capacity | Meet standard specification and tolerance (NPO, X7R/X7T/X7P characteristics) | See detailed specification in document | |||||||||
| Dissipation Factor (DF) | NPO Characteristic: DF0.56, Cr5 pF; DF1.5[(150/Cr)+7]10-4 (5pFCr50pF); DF0.15%, (50pFCr). X7R/X7T/X7P characteristic: See Note 1. | See detailed specification in document | |||||||||
| Insulation Resistance (IR) | NPO Characteristic: IR50000M,C10nF; IR*Cr500S,C10nF. X7R/X7T/X7P Characteristic: IR10000M,C25nF; IR*Cr100S,C25nF. Testing condition: Rated voltage, Time: 605s, Humidity: 75%, Temperature: 255, Current: 50mA | See detailed specification in document | |||||||||
| Hi-pot (DC) | No dielectric breakdown or damage. Ur=100V, 2.5 x rated voltage; Ur=200V/250V, 2.0 x rated voltage; Ur=450/500/630V, 1.5 x rated voltage; 1KVUr2KV, 1.2 x rated voltage; 2KVUr, 1.1 x rated voltage. Voltage Raising time: 110S, Voltage maintaining time: 2S | ||||||||||
| Note 1: X7R/X5R/X6S/X7S Y5V Rated vol. DF Exception of D.F. 50V 5% 7% ... (detailed table in document) | |||||||||||
| Solderability | Soldering area90%. Visual-No damage. Pre-heating temperature 80-120, time 10-30s, lead free solder, flux. Soldering temperature 2455. Solder time 20.5s. | ||||||||||
| Resistance to the heat of soldering: Visual-No damage, soldering area90%. Pre-heating temperature 100-200, time 102 s, soldering temperature: 2655, Soldering time: 51s. Cleaning with solvent. Room temperature, time: 242 hours. | |||||||||||
| Electrostatic capacity change rate: NPO Characteristic: C/C0.5% or 0.5pF larger reading; X7R: C/C15%; X7T: -33% C/C22%; X7P: C/C10%. DF Refer to NO#4, IR Refer to NO#5. | |||||||||||
| Flexural Strength | No damage. Base board: Al2O3 /PCB. PCB dimension: Thickness: 1.6mm, Length: 100mm, Width: 40mm. Flexural depth: 1mm. Bend speed: 0.5mm/sec. Test it under the flexural status. Electro static capacity change rate C/C10%. Flexural depth 452. | ||||||||||
| Terminal Bonding Strength: No visual damage. Applied Force: 5N Duration: 101S. | |||||||||||
| Thermal Shock | NPO Characteristic: C/C2.5% or 0.25pF (larger reading); X7R/X7P- characteristic: C/C0.5%; X7T characteristic: C/C10%. Pre-condition(X7R h characteristic): Upper limit temperature 1hour, place 241 hours, start to testing. Run 5 cycles Thermal shock. Test it after place 242 hours normal temp & humidity. | ||||||||||
| Temperature Moisture Exposure: Visual No visual damage. Test it after place 242 hours normal temp & humidity. Temperature 402, Humidity 90~95%RH, time 50024 hours. Electrostatic capacitance change rate: NPO characteristic: C/C2% or 1pF (larger reading); X7R/X7T/X7P characteristic: C/C10%. DF 2 times initial standard. IR: NPO characteristic: IR2500M or IR*Cr25S (Lower reading); X7R/X7T/X7P: IR1000M or IR*Cr25S (Lower reading). | |||||||||||
| High Temperature Exposure: Visual No visual damage. Charging and discharging current 50mA Max. Test it after place 48hours under normal pressure & temperature. Temperature 1253, Time 100048 hours. Voltage: 100VV250V 2x Rated voltage; 250VV1KV 1.5x rated voltage; 1KVV 1.2x rated voltage. Electrostatic capacitance change rate: NPO: C/C2% or 1pF (larger reading); X7R/X7T/X7P: C/C20%. DF 2 X initial standard. IR: NPO: IR4000M or IR*Cr40S (Lower reading); X7R/X7T/X7P: IR2000M or IR*Cr50S (Lower reading). | |||||||||||
| PCB Flexural Strength | No crack and other defect. IR Soldering the MLCC on the PCB (Photo1), Then pressing direction base on the photo 2. SIZE A B C 0805(2012) 1.2 4 1.65, 1206(3216) 2.2 5 2, 1210(3225) 2.2 5 2.9, 1812(4532) 3.5 7 3.7, 2220(5750) 4.5 8 5.6 | ||||||||||
| Embossed Plastic Taping | Embossed tape reel packing for 0805(2012)~1812(4532) type | ||||||||||
| Code | Tape size (mm) | A | B | C | D | E | F | G | H | J | T |
| 0805 | 1.55 0.20 | 2.35 0.20 | 8.00 0.20 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.10 | 1.50 -0/+0.10 | 1.50 Max | |
| Paper Tape Reel Packing | Paper tape reel packing for 10050402~12063216 | ||||||||||
| Code | Paper size (mm) | W1 | L1 | D | C | B | P1 | P2 | P0 | d | t |
| 1005 | 0.24 0.02 | 0.45 0.02 | 8.00 0.10 | 3.50 0.05 | 1.75 0.10 | 2.00 0.05 | 2.00 0.05 | 4.00 0.10 | 1.50 -0/+0.10 | 0.30 Below | |
| Reel Dimensions | Reel Dimensions (unit: mm) | ||||||||||
| Unit:mm | A | B | C | D | E | F | G | ||||
| 7REEL | 1782.0 | 3.0 | 130.5 | 210.5 | 21 or Bigger | 1010.5 | 12max | ||||
| Packing Quantity | Packing quantity | ||||||||||
| Dimension | Paper T/R (Pcs) | Plastic T/R (Pcs) | |||||||||
| 0603 | 4000 | ||||||||||
| 0805 | 4000 | 3000 (T1.35mm) | |||||||||
| 1206 | 3000 (T>1.35mm) | ||||||||||
| 1210 | 2000 (T1.60mm) | ||||||||||
| 1812 | 1000 (T>1.85mm) | ||||||||||
| Precautions For Use | MLCCs may fail in a short circuit mode when subjected to severe conditions. Follow "precautions for safety" and Application Notes. Contact engineering for handling questions. | ||||||||||
| Soldering Profile | To avoid cracks from sudden temperature change, follow the temperature profile graph. | ||||||||||
| Manual Soldering | Risk of thermal cracks. Handle soldering iron carefully, pay attention to tip selection and temperature contact. | ||||||||||
| Recommended Soldering Method | RReflow Soldering, WWave Soldering. See detailed table in document for Size, Temperature Characteristics, Rated Voltage, Capacitance. | ||||||||||
| Soldering Temperature Profile | Preheating: keep temperature difference between soldering temperature and surface temperature of chips as T150. | ||||||||||
2509251626_AIDE-CAPACITOR-1206X7R105K250NT_C48579688.pdf
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