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Specifications
Voltage Rating:
1kV
Capacitance:
1.2nF
Temperature Coefficient:
X7R
Tolerance:
±10%
Mfr. Part #:
1206X7R122K102NT
Model Number:
1206X7R122K102NT
Package:
1206
Key Attributes
Product Description
Product Overview
This product is a Multi-Layer Ceramic Capacitor (MLCC) designed for high-voltage applications. It is suitable for coupling, wave filtering, and resonant functions in various power supply and electronic circuits, including switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight units, and energy-saving lamps. The MLCCs are available in various sizes and temperature characteristics, offering reliable performance under specified testing conditions.
Product Attributes
- Construction: Ceramic dielectric, Inner electrode, Outer electrode, Nickle layer, Tin layer.
- Terminal Composition: Au/Ag-Ni-Sn (From the inside out).
- Certifications: RoHS compliant, REACH compliant.
Technical Specifications
| Item | Description | Specification | |||
|---|---|---|---|---|---|
| Application Field | Coupling, wave filtering, resonant in high voltage circuits | ||||
| Switch power supplier | |||||
| AC-DC power charger | |||||
| DC-DC power charger | |||||
| Networking/Communication interface, LCD backlight unit power supplier, amperite of energy saving lamps | |||||
| Testing Condition (Normal) | Temperature | 15~35 | |||
| Humidity | 45~75%RH | ||||
| Atmosphere | 86~106kPa | ||||
| Testing Condition (Relative) | Temperature | 252 | |||
| Humidity | 60~70%RH | ||||
| Atmosphere | 86~106kPa | ||||
| Part Number Description | Dimension Code | 0201, 0402, 0603, 0805, 1206, 1210, 1808, 1812, 1825, 2211, 2225 | |||
| Temperature Characteristic | C0G (030 PPM/), X7R (15%), X5R (15%) | ||||
| Nominal Electrostatic Capacity | 8R08.0, 10010, 101100 (pF) | ||||
| Tolerance of Electrostatic Capacity | B:0.1pF, C:0.25pF, D:0.5pF, F:1%, G: 2%, J:5%, K:10%, M:20%, Z:+80%/-20% | ||||
| Rated Voltage (DC) | 25025V, 251250V, 2522500V | ||||
| Terminal Composition | Au/Ag-Ni-Sn | ||||
| Packing | T (Tape/Reel), P (Bag packing) | ||||
| Dimensions (mm) | Code | L | W | T | WB |
| 0201 (0603) | 0.600.10 | 0.300.05 | 0.300.05 | 0.100.05 | |
| 0402 (1005) | 1.000.15 | 0.500.15 | 0.500.10 | 0.200.10 | |
| 0603 (1608) | 1.600.20 | 0.800.15 | 0.800.15 | 0.300.10 | |
| 0805 (2012) | 2.000.20 | 1.250.20 | 0.800.20 | 0.500.20 | |
| 1206 (3216) | 3.200.30 | 1.600.30 | 1.000.20 | 0.600.30 | |
| 1210 (3225) | 3.200.30 | 2.500.30 | 2.70 | 0.800.30 | |
| 1808 (4520) | 4.500.40 | 2.000.20 | 2.70 | 0.800.30 | |
| 1812 (4532) | 4.500.40 | 3.200.30 | 3.50 | 0.800.30 | |
| 1825 (4563) | 4.500.40 | 6.300.50 | 3.50 | 0.800.30 | |
| 2220 (5750) | 5.700.50 | 5.000.50 | 3.50 | 1.000.40 | |
| 2225 (5763) | 5.700.50 | 6.300.50 | 6.20 | 1.000.40 | |
| Specification and Testing Method | Temperature Range | -55~+125 | |||
| Visual/Dimension | 1. No Damage 2. Dimension meet Spec. Tested by naked eye and digital caliper. | ||||
| Static Capacity | Meet standard specification and tolerance. Testing conditions vary based on NPO or X7R/X7T/X7P characteristics and capacitance value. | ||||
| Dissipation Factor (DF) | Specifications vary based on NPO or X7R/X7T/X7P characteristics and capacitance value. | ||||
| Insulation Resistance (IR) | NPO Characteristic: IR50000M, C10nF; IR*Cr500S, C10nF. X7R/X7T/X7P Characteristic: IR10000M, C25nF; IR*Cr100S, C25nF. Testing condition: Rated voltage, 605s, Humidity:75%, Temperature:255, Current:50mA. | ||||
| Hi-pot (DC) | No dielectric breakdown or damage. Test voltage is a multiple of rated voltage (Ur) depending on the Ur value (e.g., 2.5 x rated voltage for Ur=100V). Voltage raising time: 110S, Voltage maintaining time: 2S. | ||||
| Solderability | Soldering area 90%. Visual-No damage. Pre-heating temperature 80-120, time 10-30s, lead free solder, flux. Soldering temperature 2455, Solder time 20.5s. | ||||
| Resistance to the heat of soldering | Visual-No damage, soldering area90%. Pre-heating temperature 100-200, time 102 s, soldering temperature: 2655, Soldering time: 51s. Cleaning with solvent. Room temperature, time: 242 hours. | ||||
| Electrostatic Capacity Change Rate | NPO Characteristic: C/C0.5% or 0.5pF. X7R: C/C15%. X7T: -33% C/C22%. X7P: C/C10%. | ||||
| Flexural Strength | No damage. Base board: Al2O3 /PCB. PCB dimension: Thickness: 1.6mm, Length: 100mm, Width: 40mm. Flexural depth: 1mm. Bend speed: 0.5mm/sec. Electro static capacity change rate: C/C10%. | ||||
| Terminal Bonding Strength | No visual damage. Applied Force: 5N, Duration: 101S. | ||||
| Thermal Shock | NPO Characteristic: C/C2.5% or 0.25pF. X7R/X7P: C/C0.5%. X7T: C/C10%. Test after 5 cycles of thermal shock. | ||||
| Temperature Moisture Exposure | Visual: No visual damage. Capacitance change rate: NPO: C/C2% or 1pF. X7R/X7T/X7P: C/C10%. DF: 2 times initial standard. IR: NPO: IR2500M or IR*Cr25S. X7R/X7T/X7P: IR1000M or IR*Cr25S. Test at 402, 90~95%RH for 50024 hours. | ||||
| High Temperature Exposure | Visual: No visual damage. Capacitance change rate: NPO: C/C2% or 1pF. X7R/X7T/X7P: C/C20%. DF: 2 X initial standard. IR: NPO: IR4000M or IR*Cr40S. X7R/X7T/X7P: IR2000M or IR*Cr50S. Test at 1253 for 100048 hours with specified voltage. | ||||
| PCB Flexural Strength | No crack and other defect. IR test performed after soldering MLCC on PCB. | ||||
| Embossed Plastic Taping Dimensions (mm) | See Page 8 for detailed dimensions (A, B, C, D, E, F, G, H, J, T) for sizes 0805 to 1812. | ||||
| Paper Tape Reel Packing Dimensions (mm) | See Page 9 for detailed dimensions (W1, L1, D, C, B, P1, P2, P0, d, t) for sizes 1005, 0201, 0402, 0603, 0805, 1206. | ||||
| Reel Dimensions (mm) | 7REEL: 1782.0, 3.0, 130.5, 210.5, 21 or Bigger, 1010.5, 12max. 13REEL: 3302.0, 3.0, 130.5, 210.5, 21 or Bigger, 1010.5, 12max. | ||||
| Top Tape Peeling Strength | Standard: 0.1N < peeling strength < 0.7N. No paper dirty remains on the scotch when peeling. | ||||
| Packing Quantity (Pcs) | Paper T/R: 4000 (0805, 0805), 1005 (0402), 0201, 0402. Plastic T/R: 3000 (0805, 1210 T1.35mm), 2000 (1210 T>1.35mm, 1812 T1.60mm), 1000 (1812 T>1.60mm, 1812). | ||||
| Soldering Method Recommendation | RReflow Soldering, WWave Soldering. Recommendations vary by size, temperature characteristic, rated voltage, and capacitance. (See Page 13 for details). | ||||
| Soldering Temperature Profile | Keep temperature difference between soldering temperature and surface temperature of chips as T150. (See Page 14 for details). | ||||
2509251626_AIDE-CAPACITOR-1206X7R122K102NT_C48579689.pdf
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