Product Overview
These Multi-Layer Ceramic Capacitors (MLCCs) are designed for high-voltage applications, including coupling, wave filtering, and resonant functions. They are suitable for use in switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamp ballasts. The MLCCs offer a range of temperature characteristics, tolerances, and voltage ratings, with various packaging options available.
Product Attributes
- Material: Ceramic dielectric, inner electrode, outer electrode (Au/Ag-Ni-Sn terminal composition).
- Certifications: ROHS/REACH compliant.
- Packaging Options: Tape/Reel (T), Bag packing (P).
Technical Specifications
| Item | Description | Details | |||
|---|---|---|---|---|---|
| Application Field | High voltage circuits, including switch power supplies, AC-DC power chargers, DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, energy-saving lamp ballasts. | ||||
| Medium and High voltage MLCC | |||||
| Testing Conditions | Normal | Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa | |||
| Relative | Temperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa | ||||
| Part Number Description | 1. Dimension Code | 0201, 0402, 0603, 0805, 1206, 1210, 1808, 1812, 1825, 2211, 2225 | |||
| 2. Temperature Characteristic | C0G (030 PPM/), X7R (15%), X5R (15%) | ||||
| 3. Nominal Electrostatic Capacity | 8R08.0, 10010, 101100 (pF) | ||||
| 4. Tolerance of Electrostatic Capacity | B:0.1pF, C:0.25pF, D:0.5pF, F:1%, G: 2%, J:5%, K:10%, M:20%, Z:+80%/-20% | ||||
| 5. Rated Voltage (DC) | 250 25V, 251 250V, 252 2500V | ||||
| 6. Terminal Composition | Au/Ag-Ni-Sn (From the inside out) | ||||
| 7. Packing | T Tape/Reel, P Bag packing(PE) | ||||
| Construction | Ceramic dielectric | - | |||
| Inner electrode | - | ||||
| Outer electrode | - | ||||
| Nickle layer | - | ||||
| Tin layer | - | ||||
| Dimensions (mm) | Part number | L | W | T | WB |
| 0201 (0603) | 0.600.10 | 0.300.05 | 0.300.05 | 0.100.05 | |
| 0402 (1005) | 1.000.15 | 0.500.15 | 0.500.10 | 0.200.10 | |
| 0603 (1608) | 1.600.20 | 0.800.15 | 0.800.15 | 0.300.10 | |
| 0805 (2012) | 2.000.20 | 1.250.20 | 0.800.20 | 0.500.20 | |
| 1206 (3216) | 3.200.30 | 1.600.30 | 1.000.20 | 0.600.30 | |
| 1210 (3225) | 3.200.30 | 2.500.30 | 2.70 | 0.800.30 | |
| 1808 (4520) | 4.500.40 | 2.000.20 | 2.70 | 0.800.30 | |
| 1812 (4532) | 4.500.40 | 3.200.30 | 3.50 | 0.800.30 | |
| 1825 (4563) | 4.500.40 | 6.300.50 | 3.50 | 0.800.30 | |
| 2220 (5750) | 5.700.50 | 5.000.50 | 3.50 | 1.000.40 | |
| 2225 (5763) | 5.700.50 | 6.300.50 | 6.20 | 1.000.40 | |
| Temperature Range | -55~+125 | ||||
| Static Capacity Tolerance | NPO: 1MHz10% @ 1.00.2Vrms (1000pF), 1KHz10% @ 1.00.2Vrms (>1000pF) X7R/X7T/X7P: 1KHz10% @ 1.00.2Vrms (10uF), 120Hz24 @ 0.50.1Vrms (>10uF) | ||||
| Dissipation Factor (DF) | NPO: DF0.56, Cr5 pF; DF1.5[(150/Cr)+7]10-4 (5pFCr50pF); DF0.15%, (50pFCr) X7R/X7T/X7P: See Note 1 | ||||
| Insulation Resistance (IR) | NPO: IR50000M, C10nF; IR*Cr500S, C10nF X7R/X7T/X7P: IR10000M, C25nF; IR*Cr100S, C25nF | ||||
| Hi-pot (DC) | 1.2 to 2.5 x rated voltage (depending on rated voltage) | ||||
| Solderability | Soldering area 90% | ||||
| Resistance to the heat of soldering | No damage, soldering area 90% | ||||
| Flexural Strength | Electrostatic capacity change rate C/C10% | ||||
| Terminal Bonding Strength | No visual damage, Applied Force: 5N | ||||
| Thermal Shock | Capacity change rate within specified limits for NPO, X7R/X7P, X7T characteristics. | ||||
| Temperature Moisture Exposure | Visual: No damage. Capacity change rate within specified limits for NPO, X7R/X7T/X7P characteristics. DF & IR within specified limits. | ||||
| High Temperature Exposure | Visual: No damage. Capacity change rate within specified limits for NPO, X7R/X7T/X7P characteristics. DF & IR within specified limits. | ||||
| PCB Flexural Strength | No crack and other defect. | ||||
| Embossed Plastic Taping Dimensions | Detailed dimensions for tape size, reel dimensions, and peeling strength provided for various MLCC sizes (0805 to 1812). | ||||
| Paper Tape Reel Packing Dimensions | Detailed dimensions for paper tape reel packing for 1005 (0402), 0201, 0402, 0603, 0805, and 1206 types. | ||||
| Packing Quantity | Quantities per reel for Paper T/R and Plastic T/R are specified by MLCC size. | ||||
Precautions For Use
MLCCs may fail in short or open circuit modes when subjected to conditions beyond specified ratings. To prevent potential issues like burn out, flaming, or glowing, adhere to the following precautions:
- Soldering Profile: Follow recommended temperature profiles to avoid cracks due to sudden temperature changes.
- Manual Soldering: Handle soldering irons carefully to avoid direct contact with the ceramic body and prevent thermal cracks.
- Optimum Solder Amount for Reflow Soldering: Use recommended solder amounts.
- Recommended Soldering Method: Refer to the table for recommended soldering methods (R-Reflow, W-Wave) based on size, temperature characteristics, rated voltage, and capacitance.
- Soldering Temperature Profile: Maintain specific temperature differences during preheating.
2509251626_AIDE-CAPACITOR-1206X7R153K101NT_C48579693.pdf
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