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Specifications
Voltage Rating:
50V
Capacitance:
22nF
Temperature Coefficient:
X7R
Tolerance:
±10%
Mfr. Part #:
1206X7R223K500NT
Model Number:
1206X7R223K500NT
Package:
1206
Key Attributes
Product Description
Product Overview
This product is a Multi-Layer Ceramic Capacitor (MLCC) designed for high-voltage applications. It is suitable for coupling, wave filtering, and resonant functions in various power supply and electronic circuits. Key applications include switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamps. The MLCCs are available in various sizes and temperature characteristics, offering reliable performance in demanding environments.
Product Attributes
- Material: Ceramic dielectric, Inner electrode, Outer electrode, Nickle layer, Tin layer
- Terminal Composition: Au/Ag-Ni-Sn
- Certifications: RoHS compliant, REACH compliant
Technical Specifications
| Item | Description/Specification | Testing Method | |
|---|---|---|---|
| Application Field | |||
| Coupling, wave filtering, resonant in high voltage circuits, switch power supplier, AC-DC power charger, DC-DC power charger, networking/Communication interface, LCD backlight unit power supplier, amperite of energy saving lamps, etc. (Medium and High voltage MLCC) | |||
| Testing Conditions | |||
| Normal Condition | Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa | ||
| Relative Condition | Temperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa | ||
| Part Number Description | |||
| 1. Dimension Code | 0201 (0.02*0.01 inch / 0.50*0.25 mm), 0402 (0.04*0.02 inch / 1.00*0.50 mm), 0603 (0.06*0.03 inch / 1.60*0.80 mm), 0805 (0.08*0.05 inch / 2.00*1.25 mm), 1206 (0.12*0.06 inch / 3.20*1.60 mm), 1210 (0.12*0.10 inch / 3.20*2.50 mm), 1808 (0.18*0.08 inch / 4.50*2.00 mm), 1812 (0.18*0.12 inch / 4.50*3.20 mm), 1825 (0.18*0.25 inch / 4.50*6.30 mm), 2211 (0.22*0.11 inch / 5.70*2.8 mm), 2225 (0.22*0.25 inch / 5.70*6.30 mm) | ||
| 2. Temperature Characteristic | C0G (030 PPM/), X7R (15%), X5R (15%) | ||
| 3. Nominal Electrostatic Capacity | 8R0 (8.0 pF), 100 (10 pF), 101 (100 pF) | ||
| 4. Tolerance of Electrostatic Capacity | B (0.1pF), C (0.25pF), D (0.5pF), F (1%), G (2%), J (5%), K (10%), M (20%), Z (+80%/-20%) | ||
| 5. Rated Voltage (DC) | 250 (25V), 251 (250V), 252 (2500V) | ||
| 6. Terminal Composition | Au/Ag-Ni-Sn (From the inside out) | ||
| 7. Packing | T (Tape/Reel), P (Bag packing) | ||
| Construction and Dimension | |||
| Dimension (mm) | British System | Metric System | |
| L W T WB | 0201 | 0603 | 0.600.10 0.300.05 0.300.05 0.100.05 |
| L W T WB | 0402 | 1005 | 1.000.15 0.500.15 0.500.10 0.200.10 |
| L W T WB | 0603 | 1608 | 1.600.20 0.800.15 0.800.15 0.300.10 |
| L W T WB | 0805 | 2012 | 2.000.20 1.250.20 0.800.20 1.000.20 |
| L W T WB | 1206 | 3216 | 3.200.30 1.600.30 1.000.20 1.250.20 |
| L W T WB | 1210 | 3225 | 3.200.30 2.500.30 2.70 0.800.30 |
| L W T WB | 1808 | 4520 | 4.500.40 2.000.20 2.70 0.800.30 |
| L W T WB | 1812 | 4532 | 4.500.40 3.200.30 3.50 0.800.30 |
| L W T WB | 1825 | 4563 | 4.500.40 6.300.50 3.50 0.800.30 |
| L W T WB | 2220 | 5750 | 5.700.50 5.000.50 3.50 1.000.40 |
| L W T WB | 2225 | 5763 | 5.700.50 6.300.50 6.20 1.000.40 |
| Specification and Testing Method | |||
| Temperature | -55~+125 | Naked eye (Visual inspection), Digital calliper | |
| Visual/Dimension | 1. No Damage 2. Dimension meet Spec | Naked eye (Visual inspection), Digital calliper | |
| Static Capacity | Meet standard specification and tolerance |
| |
| Dissipation Factor (DF) |
|
| |
| IR Insulation Resistance |
| Testing condition: Rated voltage, Time: 605s, Humidity: 75%, Temperature: 255, Current: 50mA | |
| Hi-pot (DC) | No dielectric breakdown or damage | Ur=100V, 2.5 x rated voltage; Ur=200V/250V, 2.0 x rated voltage; Ur=450/500/630V, 1.5 x rated voltage; 1KVUr2KV, 1.2 x rated voltage; 2KVUr, 1.1 x rated voltage. Voltage Raising time: 110S, Voltage maintaining time: 2S | |
| Solderability | soldering area90% | Pre-heating temperature 80-120, time 10-30s, lead free solder, flux. Soldering temperature 2455, Solder time 20.5s | |
| Resistance to the heat of soldering | No damage, soldering area90% | Pre-heating temperature 100-200, time 102 s, soldering temperature: 2655, Soldering time: 51s. Cleaning with solvent. Room temperature, time: 242 hours. | |
| Electrostatic capacity change rate | NPO Characteristic: C/C0.5% or 0.5pF larger reading; X7R: C/C15%; X7T: -33% C/C22%; X7P: C/C10% | Pre-heating 150 1hour, then place 48 hours under normal pressure & temperature. | |
| Flexural strength | No damage | Base board: Al2O3 /PCB. PCB dimension: Thickness: 1.6mm, Length: 100mm, Width: 40mm. Flexural depth: 1mm. Bend speed: 0.5mm/sec. Test it under the flexural status. Electro static capacity change rate C/C10% | |
| Terminal bonding strength | No visual damage | Applied Force: 5N, Duration: 101S | |
| Thermal shock |
| Pre-condition(X7R h characteristic): Upper limit temperature 1hour, place 241 hours, start to testing. Run 5 cycles Thermal shock. Test it after place 242 hours normal temp & humidity | |
| Temperature moisture exposure |
| Temperature 402, Humidity 90~95%RH, time 500+24 hours. Test it after place 242 hours normal temp & humidity. | |
| High temperature exposure |
| Temperature 1253, Time 100048 hours. Voltage 100VV250V 2x Rated voltage; 250VV1KV 1.5x rated voltage; 1KVV 1.2x rated voltage. Test it after place 48 hours under normal pressure & temperature. | |
| PCB flexural strength | No crack and other defect | Soldering the MLCC on the PCB, Then pressing direction base on the photo. SIZE A B C: 0805(2012) 1.2 4 1.65; 1206(3216) 2.2 5 2; 1210(3225) 2.2 5 2.9; 1812(4532) 3.5 7 3.7; 2220(5750) 4.5 8 5.6 | |
| Embossed Plastic Taping Dimensions (unit: mm) | |||
| Code | Tape size A B C D E F G H J T | Max | |
| 0805 | 1.55 0.20 2.35 0.20 8.00 0.20 3.50 0.05 1.75 0.10 4.00 0.10 2.00 0.10 4.00 0.10 1.50 -0/+0.10 | 1.50 | |
| 1206 | 1.95 0.20 3.60 0.20 8.00 0.20 3.50 0.05 1.75 0.10 4.00 0.10 2.00 0.10 4.00 0.10 1.50 -0/+0.10 | 1.85 | |
| 1210 | 2.70 0.10 3.42 0.10 8.00 0.10 3.50 0.05 1.75 0.10 4.00 0.10 2.00 0.05 4.00 0.10 1.55 -0/+0.10 | 3.2 | |
| 1808 | 2.20 0.10 4.95 0.10 12.00 0.10 5.50 0.05 1.75 0.10 4.00 0.10 2.00 0.05 4.00 0.10 1.50 -0/+0.10 | 3.0 | |
| 1812 | 3.66 0.10 4.95 0.10 12.00 0.10 5.50 0.05 1.75 0.10 8.00 0.10 2.00 0.05 4.00 0.10 1.55 -0/+0.10 | 4.0 | |
| Paper Tape Reel Packing Dimensions (unit: mm) | |||
| Code | Paper size W1 L1 D C B P1 P2 P0 d t | Below | |
| 1005 | 0.240.02 0.450.02 8.000.10 3.500.05 1.750.10 2.000.05 2.000.05 4.000.10 1.50 -0/+0.10 | 0.30 | |
| 0201 | 0.370.10 0.670.10 8.000.10 3.500.05 1.750.10 2.000.05 2.000.05 4.000.10 1.50 -0/+0.10 | 0.80 | |
| 0402 | 0.650.10 1.150.10 8.000.10 3.500.05 1.750.10 2.000.05 2.000.05 4.000.10 1.50 -0/+0.10 | 0.80 | |
| Code | Paper size A B C D E F G H J T | Max | |
| 0603 | 1.10 0.10 1.90 0.10 8.00 0.10 3.50 0.05 1.75 0.10 4.00 0.10 2.00 0.10 4.00 0.10 1.50 -0/+0.10 | 1.10 | |
| 0805 | 1.45 0.15 2.30 0.15 8.0 0.15 3.50 0.05 1.75 0.10 4.00 0.10 2.00 0.10 4.00 0.10 1.50 -0/+0.10 | 1.10 | |
| 1206 | 1.80 0.20 3.40 0.20 8.00 0.20 3.50 0.05 1.75 0.10 4.00 0.10 2.00 0.10 4.00 0.10 1.50 -0/+0.10 | 1.10 | |
| Reel Dimensions (unit: mm) | |||
| Type | A B C D E F G | Max | |
| 7REEL | 1782.0 3.0 130.5 210.5 21 or Bigger 1010.5 | 12 | |
| 13REEL | 3302.0 3.0 130.5 210.5 21 or Bigger 1010.5 | 12 | |
| Taping Specification | |||
| Top tape peeling strength | (a) Paper Taping Reel type: 0.1N < peeling strength < 0.7N. No paper dirty remains on the scotch when peeling, and sticks to top and bottom tape. (b) Embossed Taping Standard: 0.1N < peeling strength < 0.7N. No paper dirty remains on the scotch when peeling, and sticks to top and bottom tape. | ||
| Packing Quantity | |||
| Dimension | Paper T/R (Pcs) | Plastic T/R (Pcs) | |
| 0603 | 4000 | ||
| 0805 | 4000 | 3000 (T1.35mm) | |
| 1206 | 3000 (T1.35mm) | ||
| 1210 | 2000 (T1.60mm) | ||
| 1808 | 3000 (T1.60mm) | ||
| 1812 | 2000 | ||
| 1812 | 1000 (T1.85mm) | ||
| 1000 (T1.85mm) | |||
| 800 | |||
| 500 | |||
| ROHS/REACH Compliance | |||
| RoHS | Meet the standard | ||
| REACH | Meet the standard | ||
| Precautions For Use | |||
| Soldering Profile | To avoid the crack problem by sudden temperature change, follow the temperature profile in the adjacent graph (refer to the graph in the enclosure page). | ||
| Manual Soldering | Manual soldering can pose a great risk of creating thermal cracks in capacitors. The hot soldering iron tip comes into direct contact with the end terminations, and operators careless may cause the tip of the soldering iron to come into direct contact with the ceramic body of the capacitor. Therefore the soldering iron must be handled carefully, and pay much attention to the selection of the soldering iron tip and temperature contact of the tip. | ||
| Optimum Solder Amount for Reflow Soldering | |||
| Recommended Soldering Method | Size, Temperature Characteristics, Rated Voltage, Capacitance, Soldering Method | RReflow Soldering, WWave Soldering | |
| Soldering Temperature Profile | While in preheating, please keep the temperature difference between soldering temperature and surface temperature of chips as: T150. | ||
2509251626_AIDE-CAPACITOR-1206X7R223K500NT_C48579700.pdf
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