<
>
Specifications
Voltage Rating:
2kV
Capacitance:
330pF
Temperature Coefficient:
X7R
Tolerance:
±10%
Mfr. Part #:
1206X7R331K202NT
Model Number:
1206X7R331K202NT
Package:
1206
Key Attributes
Product Description
Product Overview
This product is a Multi-layer Ceramic Capacitor (MLCC) designed for high-voltage applications. It is suitable for coupling, wave filtering, and resonant functions in various power supply and electronic circuits. Key application areas include switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamps. The MLCCs are available in a range of sizes and temperature characteristics, offering reliable performance in demanding electrical environments.
Product Attributes
- Terminal Composition: Au/Ag-Ni-Sn (From the inside out)
- Certifications: ROHS/REACH compliant
Technical Specifications
| Item | Description | Specification/Requirement | Testing Method | |
|---|---|---|---|---|
| Application Field | Coupling, wave filtering, resonant in high voltage circuits, switch power supplier, AC-DC power charger, DC-DC power charger, networking/Communication interface, LCD backlight unit power supplier, amperite of energy saving lamps, etc. (Medium and High voltage MLCC). | |||
| Testing Conditions: Normal: Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa Relative: Temperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa | ||||
| Part Number Description | Example: 1812 X7R 684 M 251 N T Dimension Code: 0201, 0402, 0603, 0805, 1206, 1210, 1808, 1812, 1825, 2211, 2225 Temperature Characteristic: C0G (030 PPM/), X7R (15%), X5R (15%) Nominal Electrostatic Capacity: 8R08.0, 10010, 101100 (pF) Tolerance of Electrostatic Capacity: B:0.1pF, C:0.25pF, D:0.5pF, F:1%, G: 2%, J:5%, K:10%, M:20%, Z:+80%/-20% Rated Voltage (DC): 25025V, 251250V, 2522500V Terminal Composition: Au/Ag-Ni-Sn Packing: T Tape/Reel, P Bag packing (PE) | |||
| Construction | 1. Ceramic dielectric | |||
| 2. Inner electrode | ||||
| 3. Outer electrode | ||||
| 4. Nickle layer | ||||
| 5. Tin layer | ||||
| Dimension (mm) | British system | Metric system | ||
| L W T WB | 0201 | 0603 | 0.600.10 0.300.05 0.300.05 0.100.05 | |
| L W T WB | 0402 | 1005 | 1.000.15 0.500.15 0.500.10 0.200.10 | |
| L W T WB | 0603 | 1608 | 1.600.20 0.800.15 0.800.15 0.300.10 | |
| L W T WB | 0805 | 2012 | 2.000.20 1.250.20 0.800.20 1.000.20 0.500.20 1.250.20 0.800.20 | |
| L W T WB | 1206 | 3216 | 3.200.30 1.600.30 1.000.20 1.250.20 0.600.30 1.600.30 | |
| L W T WB | 1210 | 3225 | 3.200.30 2.500.30 2.70 0.800.30 | |
| L W T WB | 1808 | 4520 | 4.500.40 2.000.20 2.70 0.800.30 | |
| L W T WB | 1812 | 4532 | 4.500.40 3.200.30 3.50 0.800.30 | |
| L W T WB | 1825 | 4563 | 4.500.40 6.300.50 3.50 0.800.30 | |
| L W T WB | 2220 | 5750 | 5.700.50 5.000.50 3.50 1.000.40 | |
| L W T WB | 2225 | 5763 | 5.700.50 6.300.50 6.20 1.000.40 | |
| Temperature Characteristic | Range | -55~+125 | ||
| Static Capacity | NPO Characteristic | 1000pF: 1MHz10%, 1.00.2Vrms >1000pF: 1KHz10%, 1.00.2Vrms | ||
| X7R/X7T/X7P Characteristic | 10uF: 1KHz10%, 1.00.2Vrms >10uF: 120Hz24, 0.50.1Vrms | |||
| Dissipation Factor (DF) | NPO Characteristic | DF0.56, Cr5 pF DF1.5[(150/Cr)+7]10-4 (5pFCr50pF) DF0.15%, (50pFCr) | Cr1000pF, 110%MHz, 1V0.2rms Cr1000pF, 110%KHz, 1V0.2rms | |
| X7R/X7T/X7P Characteristic | See Note 1 | Cr10uF, 110%KHz, 1V0.1rms. Cr10uF, 12024Hz, 0.5V0.1rms. | ||
| Insulation Resistance (IR) | NPO Characteristic | IR50000M, C10nF IR*Cr500S, C10nF | Rated voltage, Time: 605s, Humidity: 75%, Temperature: 255, Current: 50mA | |
| X7R/X7T/X7P Characteristic | IR10000M, C25nF IR*Cr100S, C25nF | Rated voltage, Time: 605s, Humidity: 75%, Temperature: 255, Current: 50mA | ||
| Hi-pot (DC) | No dielectric breakdown or damage | Ur=100V, 2.5 x rated voltage Ur=200V/250V, 2.0 x rated voltage Ur=450/500/630V, 1.5 x rated voltage 1KVUr2KV, 1.2 x rated voltage 2KVUr, 1.1 x rated voltage | Voltage Raising time: 110S, Voltage maintaining time: 2S | |
| Solderability | 90% soldering area | Pre-heating temperature 80-120, time 10-30s, lead free solder, flux. Soldering temperature 2455, Solder time 20.5s. | Visual-No damage | |
| Resistance to the heat of soldering | 90% soldering area, No visual damage | Pre-heating temperature 100-200, time 102 s, soldering temperature: 2655, Soldering time: 51s. Cleaning with solvent. Room temperature, time: 242 hours. | Visual | |
| Electrostatic Capacity Change Rate | NPO Characteristic: C/C0.5% or 0.5pF (larger reading) X7R: C/C15% X7T: -33% C/C22% X7P: C/C10% | Pre-heating 150 1hour, then place 48hours under normal pressure & temperature. | ||
| Flexural Strength | No damage | Base board: Al2O3 /PCB PCB dimension: Thickness: 1.6mm, Length: 100mm, Width: 40mm Flexural depth: 1mm, Bend speed: 0.5mm/sec. | Unit: mm, Test under flexural status. Electro static capacity change rate C/C10% | |
| Terminal Bonding Strength | No visual damage | Applied Force: 5N, Duration: 101S | ||
| Thermal Shock | NPO Characteristic: C/C2.5% or 0.25pF (larger reading) X7R/X7P Characteristic: C/C0.5% X7T Characteristic: C/C10% | Pre-condition (X7R h characteristic): Upper limit temperature 1hour, place 241 hours, start to testing. Run 5 cycles Thermal shock. Test it after place 242 hours normal temp & humidity. | ||
| Temperature Moisture Exposure | NPO characteristic: C/C2% or 1pF (larger reading) X7R/X7T/X7P characteristic: C/C10% DF 2 times initial standard IR NPO characteristic: IR2500M or IR*Cr25S (Lower reading) X7R/X7T/X7P: IR1000M or IR*Cr25S (Lower reading) | Temperature 402, Humidity 90~95%RH, time 50024 hours. Test it after place 242 hours normal temp & humidity. | Visual | |
| High Temperature Exposure | NPO: C/C2% or 1pF (larger reading) X7R/X7T/X7P: C/C20% DF 2 X initial standard IR NPO: IR4000M or IR*Cr40S (Lower reading) X7R/X7T/X7P: IR2000M or IR*Cr50S (Lower reading) | Temperature 1253, Time 100048 hours. Voltage: 100VV250V (2x Rated voltage), 250VV1KV (1.5x rated voltage), 1KVV (1.2x rated voltage). Test it after place 48 hours under normal pressure & temperature. | Visual | |
| PCB Flexural Strength | No crack and other defect | Size (mm) 0805(2012): A=1.2, B=4, C=1.65 1206(3216): A=2.2, B=5, C=2 1210(3225): A=2.2, B=5, C=2.9 1812(4532): A=3.5, B=7, C=3.7 2220(5750): A=4.5, B=8, C=5.6 | IR Soldering the MLCC on the PCB, then pressing direction based on the photo. | |
| Embossed Plastic Taping | 0805: Tape size A=1.550.20, B=2.350.20, C=8.000.20, D=3.500.05, E=1.750.10, F=4.000.10, G=2.000.10, H=4.000.10, J=1.50 -0/+0.10, T=1.50 Max 1206: Tape size A=1.950.20, B=3.600.20, C=8.000.20, D=3.500.05, E=1.750.10, F=4.000.10, G=2.000.10, H=4.000.1, J=1.50 -0/+0.10, T=1.85 Max 1210: Tape size A=2.700.10, B=3.420.10, C=8.000.10, D=3.500.05, E=1.750.10, F=4.000.10, G=2.000.05, H=4.000.10, J=1.55 -0/+0.10, T=3.2 Max 1808: Tape size A=2.200.10, B=4.950.10, C=12.000.10, D=5.500.05, E=1.750.10, F=4.000.10, G=2.000.05, H=4.000.10, J=1.50 -0/+0.10, T=3.0 Max 1812: Tape size A=3.660.10, B=4.950.10, C=12.000.10, D=5.500.05, E=1.750.10, F=8.000.10, G=2.000.05, H=4.000.10, J=1.55 -0/+0.10, T=4.0 Max | |||
| Paper Tape Reel Packing | 1005: Paper size W1=0.240.02, L1=0.450.02, D=8.000.10, C=3.500.05, B=1.750.10, P1=2.000.05, P2=2.000.05, P0=4.000.10, d=1.50 -0/+0.10, t=0.30 Below 0201: Paper size W1=0.370.10, L1=0.670.10, D=8.000.10, C=3.500.05, B=1.750.10, P1=2.000.05, P2=2.000.05, P0=4.000.10, d=1.50 -0/+0.10, t=0.80 Below 0402: Paper size W1=0.650.10, L1=1.150.10, D=8.000.10, C=3.500.05, B=1.750.10, P1=2.000.05, P2=2.000.05, P0=4.000.10, d=1.50 -0/+0.10, t=0.80 Below 0603: Paper size A=1.100.10, B=1.900.10, C=8.000.10, D=3.500.05, E=1.750.10, F=4.000.10, G=2.000.10, H=4.000.10, J=1.50 -0/+0.10, T=1.10 Max 0805: Paper size A=1.450.15, B=2.300.15, C=8.00.15, D=3.500.05, E=1.750.10, F=4.000.10, G=2.000.10, H=4.000.10, J=1.50 -0/+0.10, T=1.10 Max 1206: Paper size A=1.800.20, B=3.400.20, C=8.000.20, D=3.500.05, E=1.750.10, F=4.000.10, G=2.000.10, H=4.000.10, J=1.50 -0/+0.10, T=1.10 Max | |||
| Reel Dimensions | 7REEL: 1782.0, 3.0, 130.5, 210.5, 21 or Bigger, 1010.5, 12max 13REEL: 3302.0, 3.0, 130.5, 210.5, 21 or Bigger, 1010.5, 12max | |||
| Top Tape Peeling Strength | Standard: 0.1N < peeling strength < 0.7N. No paper dirty remains on the scotch when peeling, and sticks to top and bottom tape. | |||
| Packing Quantity | Paper T/R (Pcs): 0603: 4000, 0805: 4000 Plastic T/R (Pcs): 0805: 3000 (T1.35mm), 1206: 3000 (T1.60mm), 1210: 2000 (T1.60mm), 1808: 3000 (T>1.60mm), 1812: 2000, 1812 and above: 1000 (T1.85mm), 800 (T1.85mm), 500 | |||
| Precautions For Use | MLCCs may fail in a short circuit mode when subjected to severe conditions beyond specified ratings. Follow "precautions for safety" and Application Notes. Consider soldering profile, manual soldering risks, optimum solder amount, and recommended soldering methods. Avoid sudden temperature changes during soldering. | |||
| Recommended Soldering Method | Sizes: 1005, 0201, 0402, 0603, 0805, 1206, 1210 Methods: RReflow Soldering, WWave Soldering. Specific methods depend on temperature characteristic, rated voltage, and capacitance. | |||
| Soldering Temperature Profile | Keep the temperature difference between soldering temperature and surface temperature of chips as T150 during preheating. | |||
2509251626_AIDE-CAPACITOR-1206X7R331K202NT_C48579707.pdf
Request A Quote
Please Use Our Online Inquiry Contact Form Below If You Have Any Questions, Our Team Will Get Back To You As Soon As Possible
