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Specifications
Voltage Rating:
250V
Capacitance:
330pF
Temperature Coefficient:
X7R
Tolerance:
±10%
Mfr. Part #:
1206X7R331K251NT
Model Number:
1206X7R331K251NT
Package:
1206
Key Attributes
Product Description
Product Overview
This product is a Multi-Layer Ceramic Capacitor (MLCC) designed for high-voltage applications. It is suitable for coupling, wave filtering, and resonant functions in various power supply and energy-saving lamp circuits, including switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamps. The MLCCs are available in various sizes and temperature characteristics, offering reliable performance under specified testing conditions.
Product Attributes
- Material: Ceramic dielectric, Inner electrode, Outer electrode (Au/Ag-Ni-Sn terminal composition)
- Certifications: RoHS compliant, REACH compliant
Technical Specifications
| Item | Description/Specification | Testing Method/Condition |
|---|---|---|
| Application Field | Coupling, wave filtering, resonant in high voltage circuits, switch power supplier, AC-DC power charger, DC-DC power charger, networking/Communication interface, LCD backlight unit power supplier, amperite of energy saving lamps. (Medium and High voltage MLCC) | |
| Testing Conditions | Normal Condition: Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa Relative Condition: Temperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa | N/A |
| Part Number Description | Example: 1812 X7R 684 M 251 N T | |
| Dimension Codes (L*W) | Inch: 0201, 0402, 0603, 0805, 1206, 1210, 1808, 1812, 1825, 2211, 2225 mm: 0.50*0.25, 1.00*0.50, 1.60*0.80, 2.00*1.25, 3.20*1.60, 3.20*2.50, 4.50*2.00, 4.50*3.20, 4.50*6.30, 5.70*2.8, 5.70*6.30 | N/A |
| Temperature Characteristic | C0G (030 PPM/), X7R (15%), X5R (15%) | N/A |
| Nominal Electrostatic Capacity | 8R0=8.0pF, 100=10pF, 101=100pF | N/A |
| Tolerance of Electrostatic Capacity | B:0.1pF, C:0.25pF, D:0.5pF, F:1%, G: 2%, J:5%, K:10%, M:20%, Z:+80%/-20% | N/A |
| Rated Voltage (DC) | 250=25V, 251=250V, 252=2500V | N/A |
| Terminal Composition | Au/Ag-Ni-Sn (From the inside out) | N/A |
| Packing | T: Tape/Reel, P: Bag packing (PE) | N/A |
| Construction | 1. Ceramic dielectric, 2. Inner electrode, 3. Outer electrode, 4. Nickel layer, 5. Tin layer | N/A |
| Dimensions (mm) | Size (British/Metric): 0201(0603), 0402(1005), 0603(1608), 0805(2012), 1206(3216), 1210(3225), 1808(4520), 1812(4532), 1825(4563), 2220(5750), 2225(5763) Dimensions (L*W*T): See detailed table in source document. | Digital caliper |
| Temperature Range | -55~+125 | N/A |
| Static Capacity | NPO: 1000pF (1MHz10%, 1.00.2Vrms); >1000pF (1KHz10%, 1.00.2Vrms) X7R/X7T/X7P: 10uF (1KHz10%, 1.00.2Vrms); >10uF (120Hz24, 0.50.1Vrms) | N/A |
| Dissipation Factor (DF) | NPO: DF0.56 (Cr5pF); DF1.5[(150/Cr)+7]10-4 (5pFCr50pF); DF0.15% (50pFCr). Frequency/Voltage dependent. X7R/X7T/X7P: See Note 1. Frequency/Voltage dependent. | N/A |
| Insulation Resistance (IR) | NPO: IR50000M (C10nF) or IR*Cr500S (C>10nF) X7R/X7T/X7P: IR10000M (C25nF) or IR*Cr100S (C>25nF) | Rated voltage, Time: 605s, Humidity: 75%, Temperature: 255, Current: 50mA |
| Hi-pot (DC) | Test voltage is a multiple of rated voltage (e.g., 2.5 x rated voltage for Ur=100V, 2.0 x for Ur=200V/250V, etc.) | Voltage Raising time: 110S, Voltage maintaining time: 2S |
| Solderability | Soldering area 90%, No Damage | Pre-heating: 80-120 (10-30s), Solder: Lead free, Flux, Temperature: 2455, Time: 20.5s |
| Resistance to Heat of Soldering | No visual damage, soldering area 90% | Pre-heating: 100-200 (102s), Soldering Temp: 2655 (51s), Cleaning, Room temp (242h) |
| Electrostatic Capacity Change Rate | NPO: C/C0.5% or 0.5pF X7R: C/C15% X7T: -33% C/C22% X7P: C/C10% | Pre-heating: 150 (1hr), then 48 hours under normal conditions. |
| Flexural Strength | No damage, Electrostatic capacity change rate C/C10% | Base board: Al2O3 /PCB (1.6mm thickness), Flexural depth: 1mm, Bend speed: 0.5mm/sec |
| Terminal Bonding Strength | No visual damage | Applied Force: 5N, Duration: 101S |
| Thermal Shock | NPO: C/C2.5% or 0.25pF X7R/X7P: C/C0.5% X7T: C/C10% | 5 cycles of thermal shock. Test after 242 hours at normal temp & humidity. |
| Temperature Moisture Exposure | NPO: C/C2% or 1pF X7R/X7T/X7P: C/C10% DF 2 times initial standard IR: See specifications for NPO and X7R/X7T/X7P | Temperature: 402, Humidity: 90~95%RH, Time: 50024 hours. Test after 242 hours at normal temp & humidity. |
| High Temperature Exposure | NPO: C/C2% or 1pF X7R/X7T/X7P: C/C20% DF 2 X initial standard IR: See specifications for NPO and X7R/X7T/X7P | Temperature: 1253, Time: 100048 hours. Voltage dependent on rated voltage. Test after 48 hours under normal pressure & temperature. |
| PCB Flexural Strength | No crack and other defect | MLCC soldered on PCB, pressing direction based on diagrams. |
| Embossed Plastic Taping Dimensions | Tape Sizes: 0805, 1206, 1210, 1808, 1812 | Detailed dimensions (A, B, C, D, E, F, G, H, J, T) provided for each tape size. |
| Paper Tape Reel Packing Dimensions | Tape Sizes: 1005, 0201, 0402, 0603, 0805, 1206 | Detailed dimensions (W1, L1, D, C, B, P1, P2, P0, d, t) provided for each tape size. |
| Reel Dimensions | 7' REEL: 1782.0 mm 13' REEL: 3302.0 mm | N/A |
| Top Tape Peeling Strength | 0.1N < peeling strength < 0.7N | Standard for Embossed Taping. |
| Packing Quantity | Paper T/R: 4000 pcs (0805, 0402), 2000 pcs (0603, 0805, 1206) etc. Plastic T/R: 3000 pcs (0805, 1206, 1210), 2000 pcs (1812) etc. | See detailed table in source document. |
| Soldering Method Recommendations | RReflow Soldering, WWave Soldering. Recommendations vary by size, temperature characteristic, rated voltage, and capacitance. See detailed table in source document. | |
| Soldering Temperature Profile | Keep temperature difference between soldering temperature and surface temperature of chips 150 during preheating. | |
Precautions for Use
MLCCs may fail short or open circuit under severe electrical or mechanical stress beyond specified ratings. To prevent failure modes like burn out, flaming, or glowing, adhere to the following precautions:
- Soldering Profile: Follow recommended temperature profiles to avoid cracks due to sudden temperature changes.
- Manual Soldering: Exercise caution to prevent thermal cracks. Ensure proper soldering iron tip selection and temperature control.
- Optimum Solder Amount: Use the recommended solder amount for reflow soldering.
2509251626_AIDE-CAPACITOR-1206X7R331K251NT_C48579708.pdf
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