quality Multi Layer Ceramic Capacitor AIDE CAPACITOR 1206X7R332K102NT for High Voltage Power Supply Circuits factory

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Specifications

Voltage Rating:

1kV

Capacitance:

3.3nF

Temperature Coefficient:

X7R

Tolerance:

±10%

Mfr. Part #:

1206X7R332K102NT

Model Number:

1206X7R332K102NT

Package:

1206

Key Attributes

Product Description

Product Overview

This product is a Multi-Layer Ceramic Capacitor (MLCC) designed for high-voltage applications. It is suitable for coupling, wave filtering, and resonant functions in various power supply and lighting circuits, including switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamps. The MLCCs are available in a range of sizes and temperature characteristics, offering reliable performance under specified testing conditions.

Product Attributes

Material: Ceramic dielectric, Inner electrode, Outer electrode (Au/Ag-Ni-Sn terminal composition)
Certifications: RoHS/REACH compliant

Technical Specifications

Item

Description

Specification/Requirement

Testing Method

1. Application Field

Coupling, wave filtering, resonant in high voltage circuits, switch power supplier, AC-DC power charger, DC-DC power charger, networking/Communication interface, LCD backlight unit power supplier, amperite of energy saving lamps, etc. (Medium and High voltage MLCC).

Testing Conditions:
Normal Condition: Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa
Relative Condition: Temperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa

2. Part Number Description

Example: 1812 X7R 684 M 251 N T
Dimension Code
Temperature Characteristic (C0G, X7R, X5R)
Nominal Electrostatic Capacity (pF)
Tolerance of Electrostatic Capacity (B, C, D, F, G, J, K, M, Z)
Rated Voltage (DC)
Terminal Composition (Au/Ag-Ni-Sn)
Packing (T: Tape/Reel, P: Bag packing)

3. Construction and Dimension

Construction:

1. Ceramic dielectric
2. Inner electrode
3. Outer electrode
4. Nickle layer
5. Tin layer

Dimension (mm):

Part Number	Dimension (mm) L	Dimension (mm) W	Dimension (mm) T	WB
0201 (0603)	0.600.10	0.300.05	0.300.05	0.100.05
0402 (1005)	1.000.15	0.500.15	0.500.10	0.200.10
0603 (1608)	1.600.20	0.800.15	0.800.15	0.300.10
0805 (2012)	2.000.20	1.250.20	0.800.20	0.500.20
1206 (3216)	3.200.30	1.600.30	1.000.20	0.600.30
1210 (3225)	3.200.30	2.500.30	2.70	0.800.30
1808 (4520)	4.500.40	2.000.20	2.70	0.800.30
1812 (4532)	4.500.40	3.200.30	3.50	0.800.30
1825 (4563)	4.500.40	6.300.50	3.50	0.800.30
2220 (5750)	5.700.50	5.000.50	3.50	1.000.40
2225 (5763)	5.700.50	6.300.50	6.20	1.000.40

4. Specification and Testing Method

Temperature

-55~+125

Naked eye (Visual inspection) / Digital calliper

Visual/Dimension

1. No Damage
2. Dimension meet Spec

Naked eye (Visual inspection) / Digital calliper

Static Capacity

Meet standard specification and tolerance

1. NPO characteristic: 1000pF 1MHz10%, 1.00.2Vrms; >1000pF 1KHz10%, 1.00.2Vrms
2. X7R/X7T/X7P characteristic: 10uF 1KHz10%, 1.00.2Vrms; >10uF 120Hz24, 0.50.1Vrms

Dissipation Factor (DF)

NPO: DF0.56 (Cr5 pF); DF1.5[(150/Cr)+7]10-4 (5pFCr50pF); DF0.15% (50pFCr)
X7R/X7T/X7P: See Note 1

NPO: Cr1000pF, 1MHz10%, 1V0.2rms; Cr1000pF, 1KHz10%, 1V0.2rms
X7R/X7T/X7P: Cr10uF, 1KHz10%, 1V0.1rms; Cr10uF, 120Hz24, 0.5V0.1rms

IR Insulation Resistance

NPO: IR50000M (C10nF); IR*Cr500S (C10nF)
X7R/X7T/X7P: IR10000M (C25nF); IR*Cr100S (C25nF)

Testing condition: Rated voltage, Time: 605s, Humidity: 75%, Temperature: 255, Current: 50mA

Hi-pot (DC)

Ur=100V, 2.5 x rated voltage; Ur=200V/250V, 2.0 x rated voltage; Ur=450/500/630V, 1.5 x rated voltage; 1KVUr2KV, 1.2 x rated voltage; 2KVUr, 1.1 x rated voltage

Voltage Raising time: 1~10S, Voltage maintaining time: 2S

5. Solderability

Soldering area 90%

Visual-No damage

Pre-heating temperature 80-120, time 10-30s, lead free solder, flux. Soldering temperature 2455, Solder time 20.5s.

6. Resistance to the heat of soldering

Visual-No damage, soldering area 90%

Visual

Pre-heating temperature 100-200, time 102 s, soldering temperature: 2655, Soldering time: 51s. Cleaning with solvent. Room temperature, time: 242 hours.

7. Electrostatic Capacity Change Rate

NPO: C/C0.5% or 0.5pF (larger reading)
X7R: C/C15%
X7T: -33% C/C22%
X7P: C/C10%

DF, IR (Refer to NO#4, NO#5)

Pre-heating 150 1 hour, then place 48 hours under normal pressure & temperature.

8. Flexural Strength

C/C10%

Visual

Base board: Al2O3 /PCB. PCB dimension: Thickness: 1.6mm, Length: 100mm, Width: 40mm. Flexural depth: 1mm. Bend speed: 0.5mm/sec. Test under flexural status.

9. Terminal Bonding Strength

No visual damage

Applied Force: 5N, Duration: 101S

10. Thermal Shock

NPO: C/C2.5% or 0.25pF (larger reading)
X7R/X7P: C/C0.5%
X7T: C/C10%

Pre-condition (X7R h characteristic): Upper limit temperature 1 hour, place 241 hours, start testing. Run 5 cycles Thermal shock. Test after place 242 hours normal temp & humidity.

11. Temperature Moisture Exposure

Visual: No visual damage
Capacitance Change Rate: NPO: C/C2% or 1pF (larger reading); X7R/X7T/X7P: C/C10%
DF: 2 times initial standard
IR: NPO: IR2500M or IR*Cr25S (Lower reading); X7R/X7T/X7P: IR1000M or IR*Cr25S (Lower reading)

Test after place 242 hours normal temp & humidity

Temperature: 402, Humidity: 90~95%RH, Time: 50024 hours.

12. High Temperature Exposure

Visual: No visual damage
Capacitance Change Rate: NPO: C/C2% or 1pF (larger reading); X7R/X7T/X7P: C/C20%
DF: 2 X initial standard
IR: NPO: IR4000M or IR*Cr40S (Lower reading); X7R/X7T/X7P: IR2000M or IR*Cr50S (Lower reading)

Test after place 48 hours under normal pressure & temperature.

Temperature: 1253, Time: 100048 hours. Voltage: 100VV250V (2x Rated voltage); 250VV1KV (1.5x rated voltage); 1KVV (1.2x rated voltage). Charging and discharging current 50mA Max.

13. PCB Flexural Strength

No crack and other defect

IR

Soldering the MLCC on the PCB, then pressing direction based on the photo. SIZE A B C: 0805(2012) 1.2 4 1.65; 1206(3216) 2.2 5 2; 1210(3225) 2.2 5 2.9; 1812(4532) 3.5 7 3.7; 2220(5750) 4.5 8 5.6.

14. Embossed Plastic Taping

Embossed tape reel packing for 0805(2012)~1812(4532) type:

Code	Tape size A	B	C	D	E	F	G	H	J
0805	1.55 0.20	2.35 0.20	8.00 0.20	3.50 0.05	1.75 0.10	4.00 0.10	2.00 0.10	4.00 0.10	1.50 -0/+0.10
1206	1.95 0.20	3.60 0.20	8.00 0.20	3.50 0.05	1.75 0.10	4.00 0.10	2.00 0.10	4.00 0.1	1.50 -0/+0.10
1210	2.70 0.10	3.42 0.10	8.00 0.10	3.50 0.05	1.75 0.10	4.00 0.10	2.00 0.05	4.00 0.10	1.55 -0/+0.10
1808	2.20 0.10	4.95 0.10	12.00 0.10	5.50 0.05	1.75 0.10	4.00 0.10	2.00 0.05	4.00 0.10	1.50 -0/+0.10
1812	3.66 0.10	4.95 0.10	12.00 0.10	5.50 0.05	1.75 0.10	8.00 0.10	2.00 0.05	4.00 0.10	1.55 -0/+0.10

Paper tape reel packing for 10050402~12063216:
(1) Paper tape reel packing for 1005, 0201, 0402 type:

Code	Paper size W1	L1	D	C	B	P1	P2	P0	d	t
1005	0.240.02	0.450.02	8.000.10	3.500.05	1.750.10	2.000.05	2.000.05	4.000.10	1.50 -0/+0.10	0.30 Below
0201	0.370.10	0.670.10	8.000.10	3.500.05	1.750.10	2.000.05	2.000.05	4.000.10	1.50 -0/+0.10	0.80 Below
0402	0.650.10	1.150.10	8.000.10	3.500.05	1.750.10	2.000.05	2.000.05	4.000.10	1.50 -0/+0.10	0.80 Below

(2) Paper tape reel packing for 0603, 0805, 1206 types:

Code	Paper size A	B	C	D	E	F	G	H	J	T
0603	1.10 0.10	1.90 0.10	8.00 0.10	3.50 0.05	1.75 0.10	4.00 0.10	2.00 0.10	4.00 0.10	1.50 -0/+0.10	1.10 Max
0805	1.45 0.15	2.30 0.15	8.0 0.15	3.50 0.05	1.75 0.10	4.00 0.10	2.00 0.10	4.00 0.10	1.50 -0/+0.10	1.10 Max
1206	1.80 0.20	3.40 0.20	8.00 0.20	3.50 0.05	1.75 0.10	4.00 0.10	2.00 0.10	4.00 0.10	1.50 -0/+0.10	1.10 Max

Reel Dimensions (unit: mm):

Unit:mm	A	B	C	D	E	F	G
7REEL	1782.0	3.0	130.5	210.5	21 or Bigger	1010.5	12max
13REEL	3302.0	3.0	130.5	210.5	21 or Bigger	1010.5	12max

Taping specification:
Top tape peeling strength: 0.1N < peeling strength < 0.7N. No paper dirty remains on the scotch when peeling, and sticks to top and bottom tape.

15. Packing Quantity

Dimension	Paper T/R (Pcs)	Plastic T/R (Pcs)
0603	4000
0805	4000	3000 (T1.35mm)
1206		3000 (T>1.35mm)
1210		2000 (T1.60mm)
1808		3000 (T>1.60mm)
1812		2000
1812		1000 (T1.85mm)
		800 (T>1.85mm)
		500

16. ROHS/REACH compliance

7.1 RoHS: meet the standard
7.2 REACH: meet the standard

17. Precautions For Use

MLCCs may fail in short circuit mode under severe conditions. Follow safety and application notes.
1. Soldering Profile: Avoid sudden temperature changes. Refer to adjacent graph.
2. Manual Soldering: Handle carefully to avoid thermal cracks. Pay attention to soldering iron tip selection and temperature.
3. Optimum Solder Amount for Reflow Soldering.
4. Recommended Soldering amounts.
5. Recommended Soldering Method: RReflow Soldering, WWave Soldering.
6. Temperature profile for soldering: Keep temperature difference between soldering temperature and surface temperature of chips T150.

2509251626_AIDE-CAPACITOR-1206X7R332K102NT_C48579709.pdf

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