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quality Durable Ceramic Capacitors Suitable for Switch Power Supplies AIDE CAPACITOR 1206X7R471K202NT Series factory
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quality Durable Ceramic Capacitors Suitable for Switch Power Supplies AIDE CAPACITOR 1206X7R471K202NT Series factory
>
Specifications
Voltage Rating:
2kV
Capacitance:
470pF
Temperature Coefficient:
X7R
Tolerance:
±10%
Mfr. Part #:
1206X7R471K202NT
Model Number:
1206X7R471K202NT
Package:
1206
Key Attributes
Product Description

Product Overview

These Multi-Layer Ceramic Capacitors (MLCCs) are designed for high-voltage applications, including coupling, wave filtering, and resonant functions. They are suitable for use in switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamps. Available in various sizes and temperature characteristics, these MLCCs offer reliable performance in demanding electrical environments.

Product Attributes

  • Material: Ceramic dielectric, Inner electrode, Outer electrode, Nickel layer, Tin layer
  • Terminal Composition: Au/Ag-Ni-Sn
  • RoHS/REACH Compliance: Meets standards

Technical Specifications

Item Description/Specification Testing Method
Application Field Coupling, wave filtering, resonant in high voltage circuits, switch power supplies, AC-DC power chargers, DC-DC power chargers, networking/Communication interfaces, LCD backlight unit power supplies, energy-saving lamps. N/A
Testing Conditions (Normal) Temperature: 15~35
Humidity: 45~75% RH
Atmosphere: 86~106 kPa
N/A
Testing Conditions (Relative) Temperature: 252
Humidity: 60~70% RH
Atmosphere: 86~106 kPa
N/A
Part Number Description Dimension Code: 0201, 0402, 0603, 0805, 1206, 1210, 1808, 1812, 1825, 2211, 2225 N/A
Temperature Characteristic: C0G (030 PPM/), X7R (15%), X5R (15%) N/A
Nominal Electrostatic Capacity: 8R08.0, 10010, 101100 (pF) N/A
Tolerance of Electrostatic Capacity: B:0.1pF, C:0.25pF, D:0.5pF, F:1%, G: 2%, J:5%, K:10%, M:20%, Z:+80%/-20% N/A
Rated Voltage (DC): 25025V, 251250V, 2522500V N/A
Terminal Composition: Au/Ag-Ni-Sn (From the inside out) N/A
Packing: T Tape/Reel, P Bag packing(PE) N/A
Construction 1. Ceramic dielectric
2. Inner electrode
3. Outer electrode
4. Nickel layer
5. Tin layer
N/A
Dimensions (mm)
Part NumberDimension (mm) LDimension (mm) WDimension (mm) TWB
0201 (0603)0.600.100.300.050.300.050.100.05
0402 (1005)1.000.150.500.150.500.100.200.10
0603 (1608)1.600.200.800.150.800.150.300.10
0805 (2012)2.000.201.250.200.800.200.500.20
1206 (3216)3.200.301.600.301.000.200.600.30
1210 (3225)3.200.302.500.302.700.800.30
1808 (4520)4.500.402.000.202.700.800.30
1812 (4532)4.500.403.200.303.500.800.30
1825 (4563)4.500.406.300.503.500.800.30
2220 (5750)5.700.505.000.503.501.000.40
2225 (5763)5.700.506.300.506.201.000.40
Digital caliper
Temperature Characteristic -55~+125 N/A
Static Capacity NPO: 1MHz10%, 1.00.2Vrms (1000pF); 1KHz10%, 1.00.2Vrms (>1000pF)
X7R/X7T/X7P: 1KHz10%, 1.00.2Vrms (10uF); 120Hz24, 0.50.1Vrms (>10uF)
Frequency Sweep
Dissipation Factor (DF) NPO: DF0.56 (Cr5pF); DF1.5[(150/Cr)+7]10-4 (5pFCr50pF); DF0.15% (50pFCr)
X7R/X7T/X7P: See Note 1
Frequency Sweep
Insulation Resistance (IR) NPO: IR50000M (C10nF); IR*Cr500S (C>10nF)
X7R/X7T/X7P: IR10000M (C25nF); IR*Cr100S (C>25nF)
DC Voltage, 605s, Humidity75%, Temperature: 255, Current: 50mA
Hi-pot (DC) Ur=100V: 2.5 x rated voltage
Ur=200V/250V: 2.0 x rated voltage
Ur=450/500/630V: 1.5 x rated voltage
1KVUr2KV: 1.2 x rated voltage
2KVUr: 1.1 x rated voltage
Voltage Raising time: 110S, Voltage maintaining time: 2S
Solderability Soldering area90% Pre-heating 80-120 (10-30s), Lead-free solder, Flux. Soldering temp 2455 (20.5s)
Resistance to the heat of soldering No damage, soldering area90% Pre-heating 100-200 (102s), Soldering temp 2655 (51s). Cleaning with solvent. Room temp, 242 hours.
Electrostatic Capacity Change Rate NPO: C/C0.5% or 0.5pF
X7R: C/C15%
X7T: -33% C/C22%
X7P: C/C10%
Refer to testing conditions for each characteristic.
Flexural Strength No damage. Electrostatic capacity change rate: C/C10% Base board: Al2O3 /PCB (1.6mm thickness). Flexural depth: 1mm. Bend speed: 0.5mm/sec.
Terminal Bonding Strength No visual damage Applied Force: 5N, Duration: 101S
Thermal Shock NPO: C/C2.5% or 0.25pF
X7R/X7P: C/C0.5%
X7T: C/C10%
5 cycles of thermal shock. Test after 242 hours at normal temp & humidity.
Temperature Moisture Exposure Visual: No damage.
Capacity Change Rate: NPO: C/C2% or 1pF; X7R/X7T/X7P: C/C10%.
DF: 2 times initial standard.
IR: NPO: IR2500M or IR*Cr25S; X7R/X7T/X7P: IR1000M or IR*Cr25S.
Temperature 402, Humidity 90~95%RH, Time 50024 hours. Test after 242 hours at normal temp & humidity.
High Temperature Exposure Visual: No damage.
Capacity Change Rate: NPO: C/C2% or 1pF; X7R/X7T/X7P: C/C20%.
DF: 2 X initial standard.
IR: NPO: IR4000M or IR*Cr40S; X7R/X7T/X7P: IR2000M or IR*Cr50S.
Temperature 1253, Time 100048 hours. Voltage: 2x Rated voltage (100VV250V), 1.5x rated voltage (250VV1KV), 1.2x rated voltage (1KVV). Test after 48 hours at normal pressure & temperature.
PCB Flexural Strength No crack and other defect. MLCC soldered on PCB, pressing direction as per diagram.
Embossed Plastic Taping Dimensions (mm)
CodeTape size ABCDEFGHJT
08051.55 0.202.35 0.208.00 0.203.50 0.051.75 0.104.00 0.102.00 0.104.00 0.101.50 -0/+0.101.50 Max
12061.95 0.203.60 0.208.00 0.203.50 0.051.75 0.104.00 0.102.00 0.104.00 0.11.50 -0/+0.101.85 Max
12102.70 0.103.42 0.108.00 0.103.50 0.051.75 0.104.00 0.102.00 0.054.00 0.101.55 -0/+0.103.2 Max
18082.20 0.104.95 0.1012.00 0.105.50 0.051.75 0.104.00 0.102.00 0.054.00 0.101.50 -0/+0.103.0 Max
18123.66 0.104.95 0.1012.00 0.105.50 0.051.75 0.108.00 0.102.00 0.054.00 0.101.55 -0/+0.104.0 Max
N/A
Paper Tape Reel Packing Dimensions (mm)
CodePaper size W1L1DCBP1P2P0dt
10050.240.020.450.028.000.103.500.051.750.102.000.052.000.054.000.101.50 -0/+0.100.30 Below
02010.370.100.670.108.000.103.500.051.750.102.000.052.000.054.000.101.50 -0/+0.100.80 Below
04020.650.101.150.108.000.103.500.051.750.102.000.052.000.054.000.101.50 -0/+0.100.80 Below
06031.10 0.101.90 0.108.00 0.103.50 0.051.75 0.104.00 0.102.00 0.104.00 0.101.50 -0/+0.101.10 Max
08051.45 0.152.30 0.158.0 0.153.50 0.051.75 0.104.00 0.102.00 0.104.00 0.101.50 -0/+0.101.10 Max
12061.80 0.203.40 0.208.00 0.203.50 0.051.75 0.104.00 0.102.00 0.104.00 0.101.50 -0/+0.101.10 Max
N/A
Reel Dimensions (mm) 7REEL: 1782.0, 3.0, 130.5, 210.5, 21 or Bigger, 1010.5, 12max
13REEL: 3302.0, 3.0, 130.5, 210.5, 21 or Bigger, 1010.5, 12max
N/A
Top Tape Peeling Strength 0.1N < peeling strength < 0.7N Standard test method.
Packing Quantity
DimensionPaper T/R (Pcs)Plastic T/R (Pcs)
06034000-
080540003000 (T1.35mm)
1206-3000 (T1.60mm), 2000 (T1.60mm)
1210-1000 (T1.85mm), 1000 (T1.85mm)
1808-800
1812-500
N/A
Soldering Profile Refer to adjacent graph (enclosure page). N/A
Recommended Soldering Method RReflow Soldering, WWave Soldering N/A
Soldering Temperature Profile Keep temperature difference between soldering temperature and surface temperature of chips T150 during preheating. N/A

2509251626_AIDE-CAPACITOR-1206X7R471K202NT_C48579713.pdf

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