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Specifications
Voltage Rating:
50V
Capacitance:
4.7uF
Temperature Coefficient:
X7R
Tolerance:
±10%
Mfr. Part #:
1206X7R475K500NT
Model Number:
1206X7R475K500NT
Package:
1206
Key Attributes
Product Description
Product Overview
This product is a Multi-layer Ceramic Capacitor (MLCC) designed for high-voltage applications, including coupling, wave filtering, and resonant functions. It is suitable for use in switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamps. The MLCCs are available in various sizes and temperature characteristics, offering reliable performance in demanding electrical environments.
Product Attributes
- Material: Ceramic dielectric, Inner electrode, Outer electrode, Nickel layer, Tin layer
- Terminal Composition: Au/Ag-Ni-Sn
- Certifications: RoHS compliant, REACH compliant
Technical Specifications
| Item | Description/Specification | Testing Method |
|---|---|---|
| Application Field | Coupling, wave filtering, resonant in high voltage circuits, switch power supplies, AC-DC power chargers, DC-DC power chargers, networking/Communication interfaces, LCD backlight unit power supplies, energy-saving lamps (Medium and High voltage MLCC). | |
| Testing Conditions | Normal: Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa Relative: Temperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa | N/A |
| Part Number Description | Example: 1812 X7R 684 M 251 N T Components: Dimension Code, Temperature Characteristic, Nominal Electrostatic Capacity, Tolerance of Electrostatic Capacity, Rated Voltage (DC), Terminal Composition, Packing. | |
| Dimension Codes & Sizes | Code | L*W (inch) | L*W (mm) 0201 | 0.02*0.01 | 0.50*0.25 0402 | 0.04*0.02 | 1.00*0.50 0603 | 0.06*0.03 | 1.60*0.80 0805 | 0.08*0.05 | 2.00*1.25 1206 | 0.12*0.06 | 3.20*1.60 1210 | 0.12*0.10 | 3.20*2.50 1808 | 0.18*0.08 | 4.50*2.00 1812 | 0.18*0.12 | 4.50*3.20 1825 | 0.18*0.25 | 4.50*6.30 2211 | 0.22*0.11 | 5.70*2.8 2225 | 0.22*0.25 | 5.70*6.30 | N/A |
| Temperature Characteristic | C0G (030 PPM/), X7R (15%), X5R (15%) | N/A |
| Nominal Electrostatic Capacity | 8R08.0, 10010, 101100 (pF) | N/A |
| Tolerance of Electrostatic Capacity | B:0.1pF, C:0.25pF, D:0.5pF, F:1%, G: 2%, J:5%, K:10%, M:20%, Z:+80%/-20% | N/A |
| Rated Voltage (DC) | 25025, 251250, 2522500 (V) | N/A |
| Packing | T Tape/Reel, P Bag packing (PE) | N/A |
| Construction | 1. Ceramic dielectric 2. Inner electrode 3. Outer electrode 4. Nickel layer 5. Tin layer | N/A |
| Dimension (mm) | Part number | L | W | T | WB 0603 (0201) | 0.600.10 | 0.300.05 | 0.300.05 | 0.100.05 1005 (0402) | 1.000.15 | 0.500.15 | 0.500.10 | 0.200.10 1608 (0603) | 1.600.20 | 0.800.15 | 0.800.15 | 0.300.10 2012 (0805) | 2.000.20 | 1.250.20 | 0.800.20 | 0.500.20 3216 (1206) | 3.200.30 | 1.600.30 | 1.000.20 | 0.600.30 3225 (1210) | 3.200.30 | 2.500.30 (2.70) | 0.800.30 | 0.800.20 4520 (1808) | 4.500.40 | 2.000.20 (2.70) | 0.800.30 | 0.800.20 4532 (1812) | 4.500.40 | 3.200.30 (3.50) | 0.800.30 | 0.800.30 4563 (1825) | 4.500.40 | 6.300.50 (3.50) | 0.800.30 | 0.800.30 5750 (2220) | 5.700.50 | 5.000.50 (3.50) | 1.000.40 | 1.000.40 5763 (2225) | 5.700.50 | 6.300.50 (6.20) | 1.000.40 | 1.000.40 | Digital calliper |
| Temperature Range | -55~+125 | N/A |
| Static Capacity Testing | NPO: 1MHz10%, 1.00.2Vrms (1000pF); 1KHz10%, 1.00.2Vrms (>1000 pF) X7R/X7T/X7P: 1KHz10%, 1.00.2Vrms (10uF); 120Hz24, 0.50.1Vrms (>10uF) | N/A |
| Dissipation Factor (DF) | NPO: DF0.56, Cr5 pF; DF1.5[(150/Cr)+7]10-4 (5pFCr50pF); DF0.15%, (50pFCr). Testing frequency 110%MHz, Voltage 1V0.2rms (Cr1000pF); Testing frequency 110%KHz, Voltage 1V0.2rms (Cr1000pF). X7R/X7T/X7P: Cr10uF, Test frequency 110%KHz, Voltage 1V0.1rms; Cr10uF, Frequency 12024Hz, Voltage 0.5V0.1rms. (See Note 1 for exceptions) | N/A |
| Insulation Resistance (IR) | NPO: IR50000M, C10nF; IR*Cr500S, C10nF. Testing condition: Rated voltage, Time: 605s, Humidity: 75%, Temperature: 255, Current: 50mA. X7R/X7T/X7P: IR10000M, C25nF; IR*Cr100S, C25nF. | N/A |
| Hi-pot (DC) | Ur=100V: 2.5 x rated voltage Ur=200V/250V: 2.0 x rated voltage Ur=450/500/630V: 1.5 x rated voltage 1KVUr2KV: 1.2 x rated voltage 2KVUr: 1.1 x rated voltage Voltage Raising time: 110S, Voltage maintaining time: 2S | N/A |
| Solderability | Soldering area 90%. No damage. Pre-heating temperature 80-120, time 10-30s, lead free solder, flux. Soldering temperature 2455, Solder time 20.5s. | Visual |
| Resistance to the heat of soldering | No damage, soldering area 90%. Pre-heating temperature 100-200, time 102s, soldering temperature: 2655, Soldering time: 51s. Cleaning with solvent. Room temperature, time: 242 hours. | Visual |
| Electrostatic Capacity Change Rate | NPO: C/C0.5% or 0.5pF (larger reading) X7R: C/C15% X7T: -33% C/C22% X7P: C/C10% | N/A |
| Flexural Strength | No damage. Base board: Al2O3 /PCB. PCB dimension: Thickness: 1.6mm, Length: 100mm, Width: 40mm. Flexural depth: 1mm. Bend speed: 0.5mm/sec. Electro static capacity change rate C/C10%. | Visual |
| Terminal Bonding Strength | No visual damage. Applied Force: 5N, Duration: 101S. | N/A |
| Thermal Shock | NPO: C/C2.5% or 0.25pF (larger reading) X7R/X7P: C/C0.5% X7T: C/C10% Run 5 cycles. Test after 242 hours normal temp & humidity. | N/A |
| Temperature Moisture Exposure | Capacity Change Rate: NPO: C/C2% or 1pF (larger reading) X7R/X7T/X7P: C/C10% DF: 2 times initial standard IR: NPO: IR2500M or IR*Cr25S (Lower reading) X7R/X7T/X7P: IR1000M or IR*Cr25S (Lower reading) | Visual |
| High Temperature Exposure | Capacity Change Rate: NPO: C/C2% or 1pF (larger reading) X7R/X7T/X7P: C/C20% DF: 2 X initial standard IR: NPO: IR4000M or IR*Cr40S (Lower reading) X7R/X7T/X7P: IR2000M or IR*Cr50S (Lower reading) | Visual |
| PCB Flexural Strength | No crack and other defect. IR Soldering the MLCC on the PCB. Pressing direction based on diagram. Sizes A, B, C provided for 0805 to 2220. 0805(2012): A=1.2, B=4, C=1.65 1206(3216): A=2.2, B=5, C=2 1210(3225): A=2.2, B=5, C=2.9 1812(4532): A=3.5, B=7, C=3.7 2220(5750): A=4.5, B=8, C=5.6 | N/A |
| Embossed Plastic Taping Dimensions | Details for 0805 to 1812 types including Tape size, A, B, C, D, E, F, G, H, J, T. (e.g., 0805: Tapesize 1.550.20, A 2.350.20, B 8.000.20, etc.) | |
| Paper Tape Reel Packing Dimensions | Details for 1005, 0201, 0402, 0603, 0805, 1206 types including Paper size, W1, L1, D, C, B, P1, P2, P0, d, t. (e.g., 1005: Papersize 0.240.02, W1 0.450.02, D 8.000.10, etc.) | |
| Reel Dimensions | Details for 7' REEL (1782.0) and 13' REEL (3302.0) including dimensions A, B, C, D, E, F, G. | |
| Top Tape Peeling Strength | Paper Taping: 0.1N < peeling strength < 0.7N. No paper dirty remains on the scotch when peeling. Embossed Taping: Standard: 0.1N < peeling strength < 0.7N. No paper dirty remains on the scotch when peeling, and sticks to top and bottom tape. | N/A |
| Packing Quantity | Size | Paper T/R (Pcs) | Plastic T/R (Pcs) 0603 | 4000 | 0805 | 4000 | 3000 (T1.35mm) 1206 | | 3000 (T1.60mm) / 2000 (T>1.60mm) 1210 | | 3000 1808 | | 2000 1812 | | 1000 (T1.85mm) / 800 (T>1.85mm) 1812 | | 500 | N/A |
| Soldering Profile | Refer to adjacent graph (enclosure page). To avoid crack problems by sudden temperature change. | |
| Recommended Soldering Method | RReflow Soldering, WWave Soldering. Specific recommendations based on Size, Temperature Characteristics, Rated Voltage, and Capacitance. | |
| Soldering Temperature Profile | While preheating, keep the temperature difference between soldering temperature and surface temperature of chips as: T150. | |
2509251626_AIDE-CAPACITOR-1206X7R475K500NT_C48579718.pdf
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