Product Overview
These Multi-Layer Ceramic Capacitors (MLCCs) are designed for high-voltage applications, including coupling, wave filtering, and resonant circuits. They are suitable for a wide range of power supply and communication interfaces such as switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamp ballasts. Available in various sizes and dielectric characteristics (C0G, X7R, X5R), these MLCCs offer reliable performance in demanding electrical environments.
Product Attributes
- Dielectric Characteristics: C0G (030 PPM/), X7R (15%), X5R (15%)
- Terminal Composition: Au/Ag-Ni-Sn (From the inside out)
- RoHS/REACH Compliance: Meets standards
- Packing Options: Tape/Reel (T), Bag packing (P)
Technical Specifications
| Item | Description | Specification |
|---|---|---|
| Dimension Code | 0201 (Metric: 0603) | L*W (inch): 0.02*0.01; L*W (mm): 0.50*0.25 |
| 0402 (Metric: 1005) | L*W (inch): 0.04*0.02; L*W (mm): 1.00*0.50 | |
| 0603 (Metric: 1608) | L*W (inch): 0.06*0.03; L*W (mm): 1.60*0.80 | |
| 0805 (Metric: 2012) | L*W (inch): 0.08*0.05; L*W (mm): 2.00*1.25 | |
| 1206 (Metric: 3216) | L*W (inch): 0.12*0.06; L*W (mm): 3.20*1.60 | |
| 1210 (Metric: 3225) | L*W (inch): 0.12*0.10; L*W (mm): 3.20*2.50 | |
| 1808 (Metric: 4520) | L*W (inch): 0.18*0.08; L*W (mm): 4.50*2.00 | |
| 1812 (Metric: 4532) | L*W (inch): 0.18*0.12; L*W (mm): 4.50*3.20 | |
| 1825 (Metric: 4563) | L*W (inch): 0.18*0.25; L*W (mm): 4.50*6.30 | |
| 2225 (Metric: 5763) | L*W (inch): 0.22*0.25; L*W (mm): 5.70*6.30 | |
| Nominal Electrostatic Capacity | Format | Example: 8R0=8.0pF, 100=10pF, 101=100pF |
| Format | Example: 8R08.010010101100(pF) | |
| Tolerance of Electrostatic Capacity | Code | B:0.1pF, C:0.25pF, D:0.5pF, F:1%, G: 2%, J:5%, K:10%, M:20%, Z:+80%/-20% |
| Code | B:0.1pF, C:0.25pF, D:0.5pF, F:1%, G: 2%, J:5%, K:10%, M:20%, Z:+80%/-20% | |
| Rated Voltage (DC) | Code | 250=25V, 251=250V, 252=2500V |
| Code | 250 25251 250252 2500 (V) | |
| Temperature Range | -55~+125 | |
| Insulation Resistance (IR) | NPO Characteristic | IR50000M, C10nF; IR*Cr500S, C10nF |
| X7R/X7T/X7P Characteristic | IR10000M, C25nF; IR*Cr100S, C25nF | |
| Hi-pot (DC) | Test Voltage | Ur=100V: 2.5 x rated voltage; Ur=200V/250V: 2.0 x rated voltage; Ur=450/500/630V: 1.5 x rated voltage; 1KVUr2KV: 1.2 x rated voltage; 2KVUr: 1.1 x rated voltage |
| Solderability | Soldering Area | 90% |
| Resistance to Heat of Soldering | Visual | No damage, soldering area90% |
| Flexural Strength | Electro static capacity change rate | C/C10% |
| Terminal Bonding Strength | Applied Force | 5N |
| Thermal Shock | Capacity Change Rate | NPO: C/C2.5% or 0.25pF; X7R/X7P: C/C0.5%; X7T: C/C10% |
| Temperature Moisture Exposure | Capacity Change Rate | NPO: C/C2% or 1pF; X7R/X7T/X7P: C/C10% |
| High Temperature Exposure | Capacity Change Rate | NPO: C/C2% or 1pF; X7R/X7T/X7P: C/C20% |
| PCB Flexural Strength | Defect | No crack and other defect |
Dimensions (mm)
| Part Number | Dimension (mm) L | Dimension (mm) W | Dimension (mm) T | Dimension (mm) WB |
|---|---|---|---|---|
| 0201 (0603) | 0.600.10 | 0.300.05 | 0.300.05 | 0.100.05 |
| 0402 (1005) | 1.000.15 | 0.500.15 | 0.500.10 | 0.200.10 |
| 0603 (1608) | 1.600.20 | 0.800.15 | 0.800.15 | 0.300.10 |
| 0805 (2012) | 2.000.20 | 1.250.20 | 0.800.20 | 0.500.20 |
| 1206 (3216) | 3.200.30 | 1.600.30 | 1.000.20 | 0.600.30 |
| 1210 (3225) | 3.200.30 | 2.500.30 | 2.70 | 0.800.30 |
| 1808 (4520) | 4.500.40 | 2.000.20 | 2.70 | 0.800.30 |
| 1812 (4532) | 4.500.40 | 3.200.30 | 3.50 | 0.800.30 |
| 1825 (4563) | 4.500.40 | 6.300.50 | 3.50 | 0.800.30 |
| 2220 (5750) | 5.700.50 | 5.000.50 | 3.50 | 1.000.40 |
| 2225 (5763) | 5.700.50 | 6.300.50 | 6.20 | 1.000.40 |
Taping Specifications
| Type | Tape Size (mm) | A | B | C | D | E | F | G | H | J | T |
|---|---|---|---|---|---|---|---|---|---|---|---|
| Embossed Plastic Taping (0805) | T | 1.55 0.20 | 2.35 0.20 | 8.00 0.20 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.10 | 1.50 -0/+0.10 | 1.50 Max |
| Embossed Plastic Taping (1206) | T | 1.95 0.20 | 3.60 0.20 | 8.00 0.20 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.1 | 1.50 -0/+0.10 | 1.85 Max |
| Embossed Plastic Taping (1210) | T | 2.70 0.10 | 3.42 0.10 | 8.00 0.10 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.05 | 4.00 0.10 | 1.55 -0/+0.10 | 3.2 Max |
| Embossed Plastic Taping (1808) | T | 2.20 0.10 | 4.95 0.10 | 12.00 0.10 | 5.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.05 | 4.00 0.10 | 1.50 -0/+0.10 | 3.0 Max |
| Embossed Plastic Taping (1812) | T | 3.66 0.10 | 4.95 0.10 | 12.00 0.10 | 5.50 0.05 | 1.75 0.10 | 8.00 0.10 | 2.00 0.05 | 4.00 0.10 | 1.55 -0/+0.10 | 4.0 Max |
| Paper Tape Reel (1005) | Papersize | 0.24 0.02 | 0.45 0.02 | 8.00 0.10 | 3.50 0.05 | 1.75 0.10 | 2.00 0.05 | 2.00 0.05 | 4.00 0.10 | 1.50 -0/+0.10 | 0.30 Below |
| Paper Tape Reel (0201) | Papersize | 0.37 0.10 | 0.67 0.10 | 8.00 0.10 | 3.50 0.05 | 1.75 0.10 | 2.00 0.05 | 2.00 0.05 | 4.00 0.10 | 1.50 -0/+0.10 | 0.80 Below |
| Paper Tape Reel (0402) | Papersize | 0.65 0.10 | 1.15 0.10 | 8.00 0.10 | 3.50 0.05 | 1.75 0.10 | 2.00 0.05 | 2.00 0.05 | 4.00 0.10 | 1.50 -0/+0.10 | 0.80 Below |
| Paper Tape Reel (0603) | Papersize | 1.10 0.10 | 1.90 0.10 | 8.00 0.10 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.10 | 1.50 -0/+0.10 | 1.10 Max |
| Paper Tape Reel (0805) | Papersize | 1.45 0.15 | 2.30 0.15 | 8.0 0.15 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.10 | 1.50 -0/+0.10 | 1.10 Max |
| Paper Tape Reel (1206) | Papersize | 1.80 0.20 | 3.40 0.20 | 8.00 0.20 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.10 | 1.50 -0/+0.10 | 1.10 Max |
Packing Quantity
| Dimension | Paper T/R (Pcs) | Plastic T/R (Pcs) |
|---|---|---|
| 0603 | 4000 | - |
| 0805 | 4000 | 3000 (T1.35mm) |
| 1206 | - | 3000 (T>1.35mm) |
| 1210 | - | 2000 (T1.60mm) |
| 1808 | - | 3000 (T>1.60mm) |
| 1812 | - | 2000 |
| 1812 | - | 1000 (T1.85mm) |
| 800 (T>1.85mm) | ||
| 500 |
Precautions for Use
MLCCs may fail in short or open circuit modes under severe electrical or mechanical stress exceeding specified ratings. To prevent issues like burnout, flaming, or glowing, adhere to the following precautions and application notes. For handling questions, contact the engineering section or factory.
- Soldering Profile: Follow the recommended temperature profile to avoid cracks due to sudden temperature changes.
- Manual Soldering: Exercise caution to prevent thermal cracks. Ensure proper tip selection and temperature control to avoid direct contact with the ceramic body.
- Optimum Solder Amount: Refer to recommended soldering amounts for reflow soldering.
2509251626_AIDE-CAPACITOR-1206X7R561K102NT_C48579719.pdf
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