Product Overview
These Multi-Layer Ceramic Capacitors (MLCCs) are designed for high-voltage applications, including coupling, wave filtering, and resonant functions. They are suitable for use in switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamp ballasts. Available in various sizes and temperature characteristics, these MLCCs offer reliable performance in demanding electrical environments.
Product Attributes
- RoHS Compliance: Meets standard
- REACH Compliance: Meets standard
- Terminal Composition: Au/Ag-Ni-Sn (from inside out)
- Construction: Ceramic dielectric, Inner electrode, Outer electrode, Nickel layer, Tin layer
Technical Specifications
| Item | Description/Specification | Testing Method | |||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|
| Application Field | |||||||||||
| Coupling, wave filtering, resonant in high voltage circuits, switch power supplier, AC-DC power charger, DC-DC power charger, networking/Communication interface, LCD backlight unit power supplier, amperite of energy saving lamps, etc. (Medium and High voltage MLCC). | |||||||||||
| Testing Conditions | |||||||||||
| Normal Condition | Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa | N/A | |||||||||
| Relative Condition | Temperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa | N/A | |||||||||
| Part Number Description Example: 1812 X7R 684 M 251 N T | |||||||||||
| 1. Dimension Code | 0201, 0402, 0603, 0805, 1206, 1210, 1808, 1812, 1825, 2211, 2225 | See details in table below | |||||||||
| 2. Temperature Characteristic | C0G (030 PPM/), X7R (15%), X5R (15%) | N/A | |||||||||
| 3. Nominal Electrostatic Capacity | 8R08.0, 10010, 101100 (pF) | N/A | |||||||||
| 4. Tolerance of Electrostatic Capacity | B:0.1pF, C:0.25pF, D:0.5pF, F:1%, G: 2%, J:5%, K:10%, M:20%, Z:+80%/-20% | N/A | |||||||||
| 5. Rated Voltage (DC) | 25025, 251250, 2522500 (V) | N/A | |||||||||
| 6. Terminal Composition | Au/Ag-Ni-Sn (From the inside out) | N/A | |||||||||
| 7. Packing | T Tape/Reel, P Bag packing (PE) | N/A | |||||||||
| Construction and Dimension | |||||||||||
| Dimension (mm) | British system | Metric system | |||||||||
| L W T WB | 0201 | 0.600.10 0.300.05 0.300.05 0.100.05 | |||||||||
| L W T WB | 0402 | 1.000.15 0.500.15 0.500.10 0.200.10 | |||||||||
| L W T WB | 0603 | 1.600.20 0.800.15 0.800.15 0.300.10 | |||||||||
| L W T WB | 0805 | 2.000.20 1.250.20 0.800.20 1.000.20 | |||||||||
| L W T WB | 1206 | 3.200.30 1.600.30 1.000.20 1.250.20 | |||||||||
| L W T WB | 1210 | 3.200.30 2.500.30 2.70 0.800.30 | |||||||||
| L W T WB | 1808 | 4.500.40 2.000.20 2.70 0.800.30 | |||||||||
| L W T WB | 1812 | 4.500.40 3.200.30 3.50 0.800.30 | |||||||||
| L W T WB | 1825 | 4.500.40 6.300.50 3.50 0.800.30 | |||||||||
| L W T WB | 2220 | 5.700.50 5.000.50 3.50 1.000.40 | |||||||||
| L W T WB | 2225 | 5.700.50 6.300.50 6.20 1.000.40 | |||||||||
| Specification and Testing Method | |||||||||||
| Temperature | -55~+125 | Naked eye (Visual inspection), Digital calliper | |||||||||
| Visual/Dimension | 1. No Damage 2. Dimension meet Spec | Naked eye (Visual inspection), Digital calliper | |||||||||
| Static Capacity | Meet standard specification and tolerance | See details in table below | |||||||||
| Dissipation Factor (DF) | See details in text | See details in text | |||||||||
| IR Insulation Resistance | NPO Characteristic: IR50000M, C10nF; IR*Cr500S, C>10nF. X7R/X7T/X7P Characteristic: IR10000M, C25nF; IR*Cr100S, C>25nF. Testing condition: Rated voltage, Time: 605s, Humidity: 75%, Temperature: 255, Current: 50mA | N/A | |||||||||
| Hi-pot (DC) | No dielectric breakdown or damage. Ur=100V, 2.5 x rated voltage; Ur=200V/250V, 2.0 x rated voltage; Ur=450/500/630V, 1.5 x rated voltage; 1KVUr2KV, 1.2 x rated voltage; 2KVUr, 1.1 x rated voltage. Voltage Raising time: 110S, Voltage maintaining time: 2S | N/A | |||||||||
| Solderability | Soldering area 90%. Visual-No damage. | Pre-heating temperature 80-120, time 10-30s, lead free solder, flux. Soldering temperature 2455. Solder time 20.5s. | |||||||||
| Resistance to the heat of soldering | Visual-No damage, soldering area 90%. | Pre-heating temperature 100-200, time 102 s, soldering temperature: 2655, Soldering time: 51s. Cleaning with solvent. Room temperature, time: 242 hours. | |||||||||
| Electrostatic capacity change rate | NPO Characteristic: |C/C| 0.5% or 0.5pF (larger reading). X7R: |C/C| 15%. X7T: -33% C/C22%. X7P: |C/C| 10%. | N/A | |||||||||
| Flexural strength | No damage. Electro static capacity change rate |C/C| 10%. | Base board: Al2O3 /PCB. PCB dimension: Thickness: 1.6mm, Length: 100mm, Width: 40mm. Flexural depth: 1mm. Bend speed: 0.5mm/sec. Test under flexural status. | |||||||||
| Terminal bonding strength | No visual damage. | Applied Force: 5N. Duration: 101S. | |||||||||
| Thermal shock | NPO Characteristic: |C/C| 2.5% or 0.25pF (larger reading). X7R/X7P characteristic: |C/C| 0.5%. X7T characteristic: |C/C| 10%. | Pre-condition (X7R h characteristic): Upper limit temperature 1hour, place 241 hours, start testing. Run 5 cycles Thermal shock. Test after place 242 hours normal temp & humidity. | |||||||||
| Temperature moisture exposure | Visual: No visual damage. Electrostatic capacitance change rate: NPO characteristic: |C/C| 2% or 1pF (larger reading). X7R/X7T/X7P characteristic: |C/C| 10%. DF 2 times initial standard. IR: NPO characteristic: IR2500M or IR*Cr25S (Lower reading). X7R/X7T/X7P: IR1000M or IR*Cr25S (Lower reading). | Temperature 402, Humidity 90~95%RH, time 50024 hours. Test after place 242 hours normal temp & humidity. | |||||||||
| High temperature exposure | Visual: No visual damage. Electrostatic capacitance change rate: NPO: |C/C| 2% or 1pF (larger reading). X7R/X7T/X7P: |C/C| 20%. DF 2 X initial standard. IR: NPO: IR4000M or IR*Cr40S (Lower reading). X7R/X7T/X7P: IR2000M or IR*Cr50S (Lower reading). | Temperature 1253, Time 100048 hours. Voltage: 100VV250V 2x Rated voltage, 250VV1KV 1.5x rated voltage, 1KVV 1.2x rated voltage. Test after place 48 hours under normal pressure & temperature. | |||||||||
| PCB flexural strength | No crack and other defect. | Soldering the MLCC on the PCB, then pressing direction based on the photo. | |||||||||
| Embossed Plastic Taping Dimensions (unit: mm) | |||||||||||
| Code | Tape size | A | B | C | D | E | F | G | H | J | T |
| 0805 | T | 1.55 0.20 | 2.35 0.20 | 8.00 0.20 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.10 | 1.50 -0/+0.10 | 1.50 Max |
| 1206 | T | 1.95 0.20 | 3.60 0.20 | 8.00 0.20 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.1 | 1.50 -0/+0.10 | 1.85 Max |
| 1210 | T | 2.70 0.10 | 3.42 0.10 | 8.00 0.10 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.05 | 4.00 0.10 | 1.55 -0/+0.10 | 3.2 Max |
| 1808 | T | 2.20 0.10 | 4.95 0.10 | 12.00 0.10 | 5.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.05 | 4.00 0.10 | 1.50 -0/+0.10 | 3.0 Max |
| 1812 | T | 3.66 0.10 | 4.95 0.10 | 12.00 0.10 | 5.50 0.05 | 1.75 0.10 | 8.00 0.10 | 2.00 0.05 | 4.00 0.10 | 1.55 -0/+0.10 | 4.0 Max |
| Paper Tape Reel Packing Dimensions (unit: mm) | |||||||||||
| Code | Paper size | W1 | L1 | D | C | B | P1 | P2 | P0 | d | t |
| 1005 | 0.24 0.02 | 0.45 0.02 | 8.00 0.10 | 3.50 0.05 | 1.75 0.10 | 2.00 0.05 | 2.00 0.05 | 4.00 0.10 | 1.50 -0/+0.10 | 0.30 Below | |
| 0201 | 0.37 0.10 | 0.67 0.10 | 8.00 0.10 | 3.50 0.05 | 1.75 0.10 | 2.00 0.05 | 2.00 0.05 | 4.00 0.10 | 1.50 -0/+0.10 | 0.80 Below | |
| 0402 | 0.65 0.10 | 1.15 0.10 | 8.00 0.10 | 3.50 0.05 | 1.75 0.10 | 2.00 0.05 | 2.00 0.05 | 4.00 0.10 | 1.50 -0/+0.10 | 0.80 Below | |
| Code | Paper size | A | B | C | D | E | F | G | H | J | T |
| 0603 | 1.10 0.10 | 1.90 0.10 | 8.00 0.10 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.10 | 1.50 -0/+0.10 | 1.10 Max | |
| 0805 | 1.45 0.15 | 2.30 0.15 | 8.0 0.15 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.10 | 1.50 -0/+0.10 | 1.10 Max | |
| 1206 | 1.80 0.20 | 3.40 0.20 | 8.00 0.20 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.10 | 1.50 -0/+0.10 | 1.10 Max | |
| Reel Dimensions (unit: mm) | |||||||||||
| Type | A | B | C | D | E | F | G | ||||
| 7REEL | 1782.0 | 3.0 | 130.5 | 210.5 | 21 or Bigger | 1010.5 | 12max | ||||
| 13REEL | 3302.0 | 3.0 | 130.5 | 210.5 | 21 or Bigger | 1010.5 | 12max | ||||
| Taping Specification | |||||||||||
| Top tape peeling strength | (a) Paper Taping Reel type: 0.1N < peeling strength < 0.7N. No paper dirty remains on the scotch when peeling, and sticks to top and bottom tape. (b) Embossed Taping Standard: 0.1N < peeling strength < 0.7N. No paper dirty remains on the scotch when peeling, and sticks to top and bottom tape. | ||||||||||
| Packing Quantity | |||||||||||
| Size | Paper T/R (Pcs) | Plastic T/R (Pcs) | |||||||||
| 0603 | 4000 | - | |||||||||
| 0805 | 4000 | 3000 (T1.35mm) | |||||||||
| 1206 | - | 3000 (T1.60mm), 2000 (T>1.60mm) | |||||||||
| 1210 | - | 3000 (T1.85mm), 1000 (T>1.85mm) | |||||||||
| 1808 | - | 800 | |||||||||
| 1812 | - | 500 | |||||||||
| Precautions For Use | |||||||||||
| MLCCs may fail in a short circuit mode when subjected to severe conditions beyond specified ratings. Follow "precautions for safety" and Application Notes. If you have questions, contact engineering or the factory. | |||||||||||
| 1. Soldering Profile | Follow the temperature profile in the adjacent graph to avoid cracks due to sudden temperature change. | ||||||||||
| 2. Manual Soldering | Risk of thermal cracks. Handle soldering iron carefully, pay attention to tip selection and temperature contact. | ||||||||||
| 3. Optimum Solder Amount for Reflow Soldering | Recommended | ||||||||||
| 4. Recommended Soldering Method | See details in table below | ||||||||||
| 5. The temperature profile for soldering | While preheating, keep temperature difference between soldering temperature and surface temperature of chips as: T150. | ||||||||||
2509251626_AIDE-CAPACITOR-1206X7R681K202NT_C48579722.pdf
Please Use Our Online Inquiry Contact Form Below If You Have Any Questions, Our Team Will Get Back To You As Soon As Possible