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quality Multi Layer Ceramic Capacitor AIDE CAPACITOR 1206X7R681K202NT for High Voltage Switch Power Supplies factory
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quality Multi Layer Ceramic Capacitor AIDE CAPACITOR 1206X7R681K202NT for High Voltage Switch Power Supplies factory
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Specifications
Voltage Rating:
2kV
Capacitance:
680pF
Temperature Coefficient:
X7R
Tolerance:
±10%
Mfr. Part #:
1206X7R681K202NT
Model Number:
1206X7R681K202NT
Package:
1206
Key Attributes
Product Description

Product Overview

These Multi-Layer Ceramic Capacitors (MLCCs) are designed for high-voltage applications, including coupling, wave filtering, and resonant functions. They are suitable for use in switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamp ballasts. Available in various sizes and temperature characteristics, these MLCCs offer reliable performance in demanding electrical environments.

Product Attributes

  • RoHS Compliance: Meets standard
  • REACH Compliance: Meets standard
  • Terminal Composition: Au/Ag-Ni-Sn (from inside out)
  • Construction: Ceramic dielectric, Inner electrode, Outer electrode, Nickel layer, Tin layer

Technical Specifications

Item Description/Specification Testing Method
Application Field
Coupling, wave filtering, resonant in high voltage circuits, switch power supplier, AC-DC power charger, DC-DC power charger, networking/Communication interface, LCD backlight unit power supplier, amperite of energy saving lamps, etc. (Medium and High voltage MLCC).
Testing Conditions
Normal Condition Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa N/A
Relative Condition Temperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa N/A
Part Number Description Example: 1812 X7R 684 M 251 N T
1. Dimension Code 0201, 0402, 0603, 0805, 1206, 1210, 1808, 1812, 1825, 2211, 2225 See details in table below
2. Temperature Characteristic C0G (030 PPM/), X7R (15%), X5R (15%) N/A
3. Nominal Electrostatic Capacity 8R08.0, 10010, 101100 (pF) N/A
4. Tolerance of Electrostatic Capacity B:0.1pF, C:0.25pF, D:0.5pF, F:1%, G: 2%, J:5%, K:10%, M:20%, Z:+80%/-20% N/A
5. Rated Voltage (DC) 25025, 251250, 2522500 (V) N/A
6. Terminal Composition Au/Ag-Ni-Sn (From the inside out) N/A
7. Packing T Tape/Reel, P Bag packing (PE) N/A
Construction and Dimension
Dimension (mm) British system Metric system
L W T WB 0201 0.600.10 0.300.05 0.300.05 0.100.05
L W T WB 0402 1.000.15 0.500.15 0.500.10 0.200.10
L W T WB 0603 1.600.20 0.800.15 0.800.15 0.300.10
L W T WB 0805 2.000.20 1.250.20 0.800.20 1.000.20
L W T WB 1206 3.200.30 1.600.30 1.000.20 1.250.20
L W T WB 1210 3.200.30 2.500.30 2.70 0.800.30
L W T WB 1808 4.500.40 2.000.20 2.70 0.800.30
L W T WB 1812 4.500.40 3.200.30 3.50 0.800.30
L W T WB 1825 4.500.40 6.300.50 3.50 0.800.30
L W T WB 2220 5.700.50 5.000.50 3.50 1.000.40
L W T WB 2225 5.700.50 6.300.50 6.20 1.000.40
Specification and Testing Method
Temperature -55~+125 Naked eye (Visual inspection), Digital calliper
Visual/Dimension 1. No Damage 2. Dimension meet Spec Naked eye (Visual inspection), Digital calliper
Static Capacity Meet standard specification and tolerance See details in table below
Dissipation Factor (DF) See details in text See details in text
IR Insulation Resistance NPO Characteristic: IR50000M, C10nF; IR*Cr500S, C>10nF. X7R/X7T/X7P Characteristic: IR10000M, C25nF; IR*Cr100S, C>25nF. Testing condition: Rated voltage, Time: 605s, Humidity: 75%, Temperature: 255, Current: 50mA N/A
Hi-pot (DC) No dielectric breakdown or damage. Ur=100V, 2.5 x rated voltage; Ur=200V/250V, 2.0 x rated voltage; Ur=450/500/630V, 1.5 x rated voltage; 1KVUr2KV, 1.2 x rated voltage; 2KVUr, 1.1 x rated voltage. Voltage Raising time: 110S, Voltage maintaining time: 2S N/A
Solderability Soldering area 90%. Visual-No damage. Pre-heating temperature 80-120, time 10-30s, lead free solder, flux. Soldering temperature 2455. Solder time 20.5s.
Resistance to the heat of soldering Visual-No damage, soldering area 90%. Pre-heating temperature 100-200, time 102 s, soldering temperature: 2655, Soldering time: 51s. Cleaning with solvent. Room temperature, time: 242 hours.
Electrostatic capacity change rate NPO Characteristic: |C/C| 0.5% or 0.5pF (larger reading). X7R: |C/C| 15%. X7T: -33% C/C22%. X7P: |C/C| 10%. N/A
Flexural strength No damage. Electro static capacity change rate |C/C| 10%. Base board: Al2O3 /PCB. PCB dimension: Thickness: 1.6mm, Length: 100mm, Width: 40mm. Flexural depth: 1mm. Bend speed: 0.5mm/sec. Test under flexural status.
Terminal bonding strength No visual damage. Applied Force: 5N. Duration: 101S.
Thermal shock NPO Characteristic: |C/C| 2.5% or 0.25pF (larger reading). X7R/X7P characteristic: |C/C| 0.5%. X7T characteristic: |C/C| 10%. Pre-condition (X7R h characteristic): Upper limit temperature 1hour, place 241 hours, start testing. Run 5 cycles Thermal shock. Test after place 242 hours normal temp & humidity.
Temperature moisture exposure Visual: No visual damage. Electrostatic capacitance change rate: NPO characteristic: |C/C| 2% or 1pF (larger reading). X7R/X7T/X7P characteristic: |C/C| 10%. DF 2 times initial standard. IR: NPO characteristic: IR2500M or IR*Cr25S (Lower reading). X7R/X7T/X7P: IR1000M or IR*Cr25S (Lower reading). Temperature 402, Humidity 90~95%RH, time 50024 hours. Test after place 242 hours normal temp & humidity.
High temperature exposure Visual: No visual damage. Electrostatic capacitance change rate: NPO: |C/C| 2% or 1pF (larger reading). X7R/X7T/X7P: |C/C| 20%. DF 2 X initial standard. IR: NPO: IR4000M or IR*Cr40S (Lower reading). X7R/X7T/X7P: IR2000M or IR*Cr50S (Lower reading). Temperature 1253, Time 100048 hours. Voltage: 100VV250V 2x Rated voltage, 250VV1KV 1.5x rated voltage, 1KVV 1.2x rated voltage. Test after place 48 hours under normal pressure & temperature.
PCB flexural strength No crack and other defect. Soldering the MLCC on the PCB, then pressing direction based on the photo.
Embossed Plastic Taping Dimensions (unit: mm)
Code Tape size A B C D E F G H J T
0805 T 1.55 0.20 2.35 0.20 8.00 0.20 3.50 0.05 1.75 0.10 4.00 0.10 2.00 0.10 4.00 0.10 1.50 -0/+0.10 1.50 Max
1206 T 1.95 0.20 3.60 0.20 8.00 0.20 3.50 0.05 1.75 0.10 4.00 0.10 2.00 0.10 4.00 0.1 1.50 -0/+0.10 1.85 Max
1210 T 2.70 0.10 3.42 0.10 8.00 0.10 3.50 0.05 1.75 0.10 4.00 0.10 2.00 0.05 4.00 0.10 1.55 -0/+0.10 3.2 Max
1808 T 2.20 0.10 4.95 0.10 12.00 0.10 5.50 0.05 1.75 0.10 4.00 0.10 2.00 0.05 4.00 0.10 1.50 -0/+0.10 3.0 Max
1812 T 3.66 0.10 4.95 0.10 12.00 0.10 5.50 0.05 1.75 0.10 8.00 0.10 2.00 0.05 4.00 0.10 1.55 -0/+0.10 4.0 Max
Paper Tape Reel Packing Dimensions (unit: mm)
Code Paper size W1 L1 D C B P1 P2 P0 d t
1005 0.24 0.02 0.45 0.02 8.00 0.10 3.50 0.05 1.75 0.10 2.00 0.05 2.00 0.05 4.00 0.10 1.50 -0/+0.10 0.30 Below
0201 0.37 0.10 0.67 0.10 8.00 0.10 3.50 0.05 1.75 0.10 2.00 0.05 2.00 0.05 4.00 0.10 1.50 -0/+0.10 0.80 Below
0402 0.65 0.10 1.15 0.10 8.00 0.10 3.50 0.05 1.75 0.10 2.00 0.05 2.00 0.05 4.00 0.10 1.50 -0/+0.10 0.80 Below
Code Paper size A B C D E F G H J T
0603 1.10 0.10 1.90 0.10 8.00 0.10 3.50 0.05 1.75 0.10 4.00 0.10 2.00 0.10 4.00 0.10 1.50 -0/+0.10 1.10 Max
0805 1.45 0.15 2.30 0.15 8.0 0.15 3.50 0.05 1.75 0.10 4.00 0.10 2.00 0.10 4.00 0.10 1.50 -0/+0.10 1.10 Max
1206 1.80 0.20 3.40 0.20 8.00 0.20 3.50 0.05 1.75 0.10 4.00 0.10 2.00 0.10 4.00 0.10 1.50 -0/+0.10 1.10 Max
Reel Dimensions (unit: mm)
Type A B C D E F G
7REEL 1782.0 3.0 130.5 210.5 21 or Bigger 1010.5 12max
13REEL 3302.0 3.0 130.5 210.5 21 or Bigger 1010.5 12max
Taping Specification
Top tape peeling strength (a) Paper Taping Reel type: 0.1N < peeling strength < 0.7N. No paper dirty remains on the scotch when peeling, and sticks to top and bottom tape. (b) Embossed Taping Standard: 0.1N < peeling strength < 0.7N. No paper dirty remains on the scotch when peeling, and sticks to top and bottom tape.
Packing Quantity
Size Paper T/R (Pcs) Plastic T/R (Pcs)
0603 4000 -
0805 4000 3000 (T1.35mm)
1206 - 3000 (T1.60mm), 2000 (T>1.60mm)
1210 - 3000 (T1.85mm), 1000 (T>1.85mm)
1808 - 800
1812 - 500
Precautions For Use
MLCCs may fail in a short circuit mode when subjected to severe conditions beyond specified ratings. Follow "precautions for safety" and Application Notes. If you have questions, contact engineering or the factory.
1. Soldering Profile Follow the temperature profile in the adjacent graph to avoid cracks due to sudden temperature change.
2. Manual Soldering Risk of thermal cracks. Handle soldering iron carefully, pay attention to tip selection and temperature contact.
3. Optimum Solder Amount for Reflow Soldering Recommended
4. Recommended Soldering Method See details in table below
5. The temperature profile for soldering While preheating, keep temperature difference between soldering temperature and surface temperature of chips as: T150.

2509251626_AIDE-CAPACITOR-1206X7R681K202NT_C48579722.pdf

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