<
>
Specifications
Voltage Rating:
50V
Capacitance:
820pF
Temperature Coefficient:
X7R
Tolerance:
±10%
Mfr. Part #:
1206X7R821K500NT
Model Number:
1206X7R821K500NT
Package:
1206
Key Attributes
Product Description
Product Overview
This product is a Multi-Layer Ceramic Capacitor (MLCC) designed for high-voltage applications. It is suitable for coupling, wave filtering, and resonant functions in various power supply and electronic circuits, including switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight units, and energy-saving lamps. The MLCCs are available in a range of sizes and temperature characteristics, offering reliable performance under specified conditions.
Product Attributes
- Material: Ceramic dielectric, Inner electrode, Outer electrode (Au/Ag-Ni-Sn terminal composition)
- Certifications: ROHS/REACH compliance
Technical Specifications
| Item | Description/Specification | Testing Method |
|---|---|---|
| Application Field | ||
| Coupling, wave filtering, resonant in high voltage circuits, switch power supplier, AC-DC power charger, DC-DC power charger, networking/Communication interface, LCD backlight unit power supplier, amperite of energy saving lamps (Medium and High voltage MLCC). | ||
| Testing Conditions | ||
| Normal Condition | Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa | |
| Relative Condition | Temperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa | |
| Part Number Description Example: 1812 X7R 684 M 251 N T | ||
| 1. Dimension Code | 0201, 0402, 0603, 0805, 1206, 1210, 1808, 1812, 1825, 2211, 2225 | |
| 2. Temperature Characteristic | C0G (030 PPM/), X7R (15%), X5R (15%) | |
| 3. Nominal Electrostatic Capacity | 8R08.0, 10010, 101100 (pF) | |
| 4. Tolerance of Electrostatic Capacity | B:0.1pF, C:0.25pF, D:0.5pF, F:1%, G: 2%, J:5%, K:10%, M:20%, Z:+80%/-20% | |
| 5. Rated Voltage (DC) | 250 25, 251 250, 252 2500 (V) | |
| 6. Terminal Composition | Au/Ag-Ni-Sn (From the inside out) | |
| 7. Packing | T Tape/Reel, P Bag packing (PE) | |
| Construction and Dimension | ||
| Construction | 1 Ceramic dielectric, 2 Inner electrode, 3 Outer electrode, 4 Nickle layer, 5 Tin layer | |
| Dimension (mm) | Part Number | L | W | T | WB 0201 (0603) | 0.600.10 | 0.300.05 | 0.300.05 | 0.100.05 0402 (1005) | 1.000.15 | 0.500.15 | 0.500.10 | 0.200.10 0603 (1608) | 1.600.20 | 0.800.15 | 0.800.15 | 0.300.10 0805 (2012) | 2.000.20 | 1.250.20 | 0.800.20 | 0.500.20 1206 (3216) | 3.200.30 | 1.600.30 | 1.000.20 | 0.600.30 1210 (3225) | 3.200.30 | 2.500.30 (2.70) | 0.800.30 | 0.800.20 1808 (4520) | 4.500.40 | 2.000.20 (2.70) | 0.800.30 | 0.500.20 1812 (4532) | 4.500.40 | 3.200.30 (3.50) | 0.800.30 | 1.250.20 1825 (4563) | 4.500.40 | 6.300.50 (3.50) | 0.800.30 | 1.600.30 2220 (5750) | 5.700.50 | 5.000.50 (3.50) | 1.000.40 | 2.000.20 2225 (5763) | 5.700.50 | 6.300.50 (6.20) | 1.000.40 | 4.500.40 | Digital calliper |
| Specification and Testing Method | ||
| Temperature | -55~+125 | |
| Visual/Dimension | 1. No Damage 2. Dimension meet Spec | Naked eye (Visual inspection), Digital calliper |
| Static Capacity | Meet standard specification and tolerance | NPO: 1000pF: 1MHz10%, 1.00.2Vrms; >1000pF: 1KHz10%, 1.00.2Vrms X7R/X7T/X7P: 10uF: 1KHz10%, 1.00.2Vrms; >10uF: 120Hz24, 0.50.1Vrms |
| Dissipation Factor (DF) | NPO: DF0.56, Cr5 pF; DF1.5[(150/Cr)+7]10-4 (5pFCr50pF); DF0.15%, (50pFCr) X7R/X7T/X7P: See Note 1 | NPO: Cr1000pF: 1MHz10%, 1V0.2rms; Cr1000pF: 1KHz10%, 1V0.2rms X7R/X7T/X7P: Cr10uF: 1KHz10%, 1V0.1rms; Cr10uF: 120Hz24, 0.5V0.1rms |
| IR Insulation Resistance | NPO: IR50000M, C10nF; IR*Cr500S, C10nF X7R/X7T/X7P: IR10000M, C25nF; IR*Cr100S, C25nF | Testing condition: Rated voltage, Time: 605s, Humidity: 75%, Temperature: 255, Current: 50mA |
| Hi-pot (DC) | No dielectric breakdown or damage | Ur=100V, 2.5 x rated voltage; Ur=200V/250V, 2.0 x rated voltage; Ur=450/500/630V, 1.5 x rated voltage; 1KVUr2KV, 1.2 x rated voltage; 2KVUr, 1.1 x rated voltage. Voltage Raising time: 110S, Voltage maintaining time: 2S |
| Solderability | Soldering area90% | Pre-heating temperature 80-120, time 10-30s, lead free solder, flux. Soldering temperature 2455, Solder time 20.5s. |
| Resistance to the heat of soldering | No damage, soldering area90% | Pre-heating temperature 100-200, time 102 s, soldering temperature: 2655, Soldering time: 51s. Cleaning with solvent. Room temperature, time: 242 hours. |
| Electrostatic capacity change rate | NPO: C/C0.5% or 0.5pF (larger reading) X7R: C/C15% X7T: -33% C/C22% X7P: C/C10% | |
| Flexural strength | No damage. Electro static capacity change rate C/C10% | Base board: Al2O3 /PCB. PCB dimension: Thickness: 1.6mm, Length: 100mm, Width: 40mm. Flexural depth: 1mm. Bend speed: 0.5mm/sec. |
| Terminal bonding strength | No visual damage | Applied Force: 5N, Duration: 101S |
| Thermal shock | NPO: C/C2.5% or 0.25pF (larger reading) X7R/X7P: C/C0.5% X7T: C/C10% | Pre-condition (X7R h characteristic): Upper limit temperature 1hour, place 241 hours, start testing. Run 5 cycles Thermal shock. Test after place 242 hours normal temp & humidity. |
| Temperature moisture exposure | Visual: No visual damage. Electrostatic capacitance change rate: NPO: C/C2% or 1pF (larger reading) X7R/X7T/X7P: C/C10% DF 2 times initial standard IR: NPO: IR2500M or IR*Cr25S (Lower reading) X7R/X7T/X7P: IR1000M or IR*Cr25S (Lower reading) | Temperature 402, Humidity 90~95%RH, time 50024 hours. Test after place 242 hours normal temp & humidity. |
| High temperature exposure | Visual: No visual damage. Electrostatic capacitance change rate: NPO: C/C2% or 1pF (larger reading) X7R/X7T/X7P: C/C20% DF 2 X initial standard IR: NPO: IR4000M or IR*Cr40S (Lower reading) X7R/X7T/X7P: IR2000M or IR*Cr50S (Lower reading) | Temperature 1253, Time 100048 hours. Voltage: 100VV250V: 2x Rated voltage; 250VV1KV: 1.5x rated voltage; 1KVV: 1.2x rated voltage. Test after place 48 hours under normal pressure & temperature. |
| PCB flexural strength | No crack and other defect | IR Soldering the MLCC on the PCB, then pressing direction base on the photo. |
| Embossed Plastic Taping Dimensions (mm) | ||
| Code | Tape size A, B, C, D, E, F, G, H, J, T | |
| 0805 | 1.55 0.20, 2.35 0.20, 8.00 0.20, 3.50 0.05, 1.75 0.10, 4.00 0.10, 2.00 0.10, 4.00 0.10, 1.50 -0/+0.10, 1.50 Max | |
| 1206 | 1.95 0.20, 3.60 0.20, 8.00 0.20, 3.50 0.05, 1.75 0.10, 4.00 0.10, 2.00 0.10, 4.00 0.10, 1.50 -0/+0.10, 1.85 Max | |
| 1210 | 2.70 0.10, 3.42 0.10, 8.00 0.10, 3.50 0.05, 1.75 0.10, 4.00 0.10, 2.00 0.05, 4.00 0.10, 1.55 -0/+0.10, 3.2 Max | |
| 1808 | 2.20 0.10, 4.95 0.10, 12.00 0.10, 5.50 0.05, 1.75 0.10, 4.00 0.10, 2.00 0.05, 4.00 0.10, 1.50 -0/+0.10, 3.0 Max | |
| 1812 | 3.66 0.10, 4.95 0.10, 12.00 0.10, 5.50 0.05, 1.75 0.10, 8.00 0.10, 2.00 0.05, 4.00 0.10, 1.55 -0/+0.10, 4.0 Max | |
| Paper Tape Reel Packing Dimensions (mm) | ||
| Code | Paper size W1, L1, D, C, B, P1, P2, P0, d, t | |
| 1005 | 0.240.02, 0.450.02, 8.000.10, 3.500.05, 1.750.10, 2.000.05, 2.000.05, 4.000.10, 1.50 -0/+0.10, 0.30 Below | |
| 0201 | 0.370.10, 0.670.10, 8.000.10, 3.500.05, 1.750.10, 2.000.05, 2.000.05, 4.000.10, 1.50 -0/+0.10, 0.80 Below | |
| 0402 | 0.650.10, 1.150.10, 8.000.10, 3.500.05, 1.750.10, 2.000.05, 2.000.05, 4.000.10, 1.50 -0/+0.10, 0.80 Below | |
| 0603 | 1.10 0.10, 1.90 0.10, 8.00 0.10, 3.50 0.05, 1.75 0.10, 4.00 0.10, 2.00 0.10, 4.00 0.10, 1.50 -0/+0.10, 1.10 Max | |
| 0805 | 1.45 0.15, 2.30 0.15, 8.0 0.15, 3.50 0.05, 1.75 0.10, 4.00 0.10, 2.00 0.10, 4.00 0.10, 1.50 -0/+0.10, 1.10 Max | |
| 1206 | 1.80 0.20, 3.40 0.20, 8.00 0.20, 3.50 0.05, 1.75 0.10, 4.00 0.10, 2.00 0.10, 4.00 0.10, 1.50 -0/+0.10, 1.10 Max | |
| Reel Dimensions (mm) | ||
| Unit: mm | 7REEL: 1782.0, 3.0, 130.5, 210.5, 21 or Bigger, 1010.5, 12max 13REEL: 3302.0, 3.0, 130.5, 210.5, 21 or Bigger, 1010.5, 12max | |
| Taping Specification | ||
| Top tape peeling strength | 0.1N < peeling strength < 0.7N. No paper dirty remains on the scotch when peeling, and sticks to top and bottom tape. | (a) Paper Taping, (b) Embossed Taping |
| Packing Quantity | ||
| Size | Paper T/R (Pcs) | Plastic T/R (Pcs) | |
| 0603 | 4000 | - | |
| 0805 | 4000 | 3000 (T1.35mm) | |
| 1206 | - | 3000 (T>1.35mm) | |
| 1210 | - | 2000 (T1.60mm) | |
| 1808 | - | 3000 (T>1.60mm) | |
| 1812 | - | 2000 | |
| 1812 | - | 1000 (T1.85mm) | |
| - | 800 (T>1.85mm) | ||
| - | 500 | ||
| Precautions For Use | ||
| Soldering Profile | To avoid crack problem by sudden temperature change, follow the temperature profile in the adjacent graph. | |
| Manual Soldering | Risk of thermal cracks. Handle soldering iron carefully, pay attention to tip selection and temperature contact. | |
| Recommended Soldering Method | Size | Capacitance | Soldering Method 1005 | / | R 0201 | / | R 0402 | / | R 0603 | C1uf | R; C1uf | R/W 0805 | C4.7uf | R; C4.7uf | R/W 1206 | C10uf | R; C10uf | R/W 1210 | / | R Soldering method: RReflow Soldering, WWave Soldering | |
| Soldering Temperature Profile | While in preheating, keep temperature difference between soldering temperature and surface temperature of chips as T150. | |
2509251626_AIDE-CAPACITOR-1206X7R821K500NT_C48579727.pdf
Request A Quote
Please Use Our Online Inquiry Contact Form Below If You Have Any Questions, Our Team Will Get Back To You As Soon As Possible
