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Specifications
Voltage Rating:
1kV
Capacitance:
8.2nF
Temperature Coefficient:
X7R
Tolerance:
±10%
Mfr. Part #:
1206X7R822K102NT
Model Number:
1206X7R822K102NT
Package:
1206
Key Attributes
Product Description
Product Overview
This product is a Multi-layer Ceramic Capacitor (MLCC) designed for high-voltage applications. It is suitable for coupling, wave filtering, and resonant functions in various power supply and electronic circuits. Applications include switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamps. These MLCCs are available in medium and high voltage ratings.
Product Attributes
- Terminal Composition: Au/Ag-Ni-Sn (From the inside out)
- Compliance: ROHS/REACH compliant
Technical Specifications
| Item | Description | Specification/Requirement | Testing Method | |
|---|---|---|---|---|
| 1. Application Field | ||||
| Coupling, wave filtering, resonant in high voltage circuits | Switch power supplier, AC-DC power charger, DC-DC power charger, networking/Communication interface, LCD backlight unit power supplier, amperite of energy saving lamps, etc. (Medium and High voltage MLCC) | |||
| 2. Testing Condition | ||||
| Normal condition | Temperature: 15~35, Humidity: 45~75%RH, Normal atmosphere: 86~106kPa | |||
| Relative condition | Temperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa | |||
| 3. Part Number Description | ||||
| Item 1 | Dimension Code | 0201, 0402, 0603, 0805, 1206, 1210, 1808, 1812, 1825, 2211, 2225 | ||
| Item 2 | Temperature Characteristic | C0G (030 PPM/), X7R (15%), X5R (15%) | ||
| Item 3 | Nominal Electrostatic Capacity | 8R08.0, 10010, 101100 (pF) | ||
| Item 4 | Tolerance of Electrostatic Capacity | B:0.1pF, C:0.25pF, D:0.5pF, F:1%, G: 2%, J:5%, K:10%, M:20%, Z:+80%/-20% | ||
| Item 5 | Rated Voltage (DC) | 250 25, 251 250, 252 2500 (V) | ||
| Item 6 | Terminal Composition | Au/Ag-Ni-Sn | ||
| Item 7 | Packing | T Tape/Reel, P Bag packing(PE) | ||
| 4. Construction and Dimension | ||||
| Item 1 | Construction | Ceramic dielectric, Inner electrode, Outer electrode, Nickel layer, Tin layer | ||
| Dimension (mm) | Part number | L W T WB | British system Metric system | |
| 0201 | 0.600.10 0.300.05 0.300.05 0.100.05 | 0603 | ||
| 0402 | 1.000.15 0.500.15 0.500.10 0.200.10 | 1005 | ||
| 0603 | 1.600.20 0.800.15 0.800.15 0.300.10 | 1608 | ||
| 0805 | 2.000.20 1.250.20 0.800.20 1.000.20 | 2012 | ||
| 1206 | 3.200.30 1.600.30 1.000.20 1.250.20 | 3216 | ||
| 1210 | 3.200.30 2.500.30 2.70 0.800.30 | 3225 | ||
| 1808 | 4.500.40 2.000.20 2.70 0.800.30 | 4520 | ||
| 1812 | 4.500.40 3.200.30 3.50 0.800.30 | 4532 | ||
| 1825 | 4.500.40 6.300.50 3.50 0.800.30 | 4563 | ||
| 2220 | 5.700.50 5.000.50 3.50 1.000.40 | 5750 | ||
| 2225 | 5.700.50 6.300.50 6.20 1.000.40 | 5763 | ||
| 5. Specification and Testing Method | ||||
| 1 | Temperature | -55~+125 | ||
| 2 | Visual/Dimension | 1, No Damage; 2, Dimension meet Spec | Naked eye (Visual inspection), Digital calliper | |
| 3 | Static Capacity | Meet standard specification and tolerance | NPO: 1MHz10%, 1.00.2Vrms (1000pF); 1KHz10%, 1.00.2Vrms (>1000pF). X7R/X7T/X7P: 1KHz10%, 1.00.2Vrms (10uF); 120Hz24, 0.50.1Vrms (>10uF). | |
| 4 | Dissipation Factor (DF) | NPO: DF0.56, Cr5 pF; DF1.5[(150/Cr)+7]10-4 (5pFCr50pF); DF0.15%, (50pFCr). Cr1000pF, 110%MHz, 1V0.2rms. Cr1000pF, 110%KHz, 1V0.2rms. X7R/X7T/X7P: Cr10uF, 110%KHz, 1V0.1rms. Cr10uF, 12024Hz, 0.5V0.1rms. (See Note 1 for exceptions) | ||
| 5 | IR Insulation Resistance | NPO: IR50000M, C10nF; IR*Cr500S, C10nF. X7R/X7T/X7P: IR10000M, C25nF; IR*Cr100S, C25nF. Testing condition: Rated voltage, Time: 605s, Humidity: 75%, Temperature: 255, Current: 50mA. | ||
| 6 | Hi-pot (DC) | No dielectric breakdown or damage. Ur=100V,...2.5 x rated voltage; Ur=200V/250V,...2.0 x rated voltage; Ur=450/500/630V,1.5 x rated voltage; 1KVUr2KV, 1.2 x rated voltage; 2KVUr,...1.1 x rated voltage. Voltage Raising time: 110S, Voltage maintaining time: 2S. | ||
| 7 | Solderability | Soldering area90% | Visual-No damage. Pre-heating temperature 80-120, time 10-30s, lead free solder, flux. Soldering temperature 2455, Solder time 20.5s. | |
| 8 | Resistance to the heat of soldering | Visual-No damage, soldering area90% | Pre-heating temperature 100-200, time 102 s, soldering temperature :2655, Soldering time:51s. Cleaning with solvent. Room temperature, time: 242 hours. | |
| Electrostatic capacity change rate | NPO: C/C0.5% or 0.5pF (larger reading). X7R: C/C15%. X7T: -33% C/C22%. X7P: C/C10%. | |||
| DF | Refer to NO#4 | |||
| IR | Refer to NO#5 | |||
| 9 | Flexural strength | No damage. Electro static capacity change rate C/C10% | Base board: Al2O3 /PCB. PCB dimension: Thickness: 1.6mm, Length: 100mm, Width: 40mm. Flexural depth: 1mm. Bend speed: 0.5mm/sec. Test it under the flexural status. Flexural deepth 452. | |
| 10 | Terminal bonding strength | No visual damage | Applied Force: 5N, Duration: 101S | |
| 11 | Thermal shock | NPO: C/C2.5% or 0.25pF (larger reading). X7R/X7P: C/C0.5%. X7T: C/C10%. | Pre-condition(X7R h characteristic): Upper limit temperature 1hour, place 241 hours, start to testing. Run 5 cycles Thermal shock. Test it after place 242 hours normal temp & humidity. | |
| 12 | Temperature moisture exposure | Visual: No visual damage. Electrostatic capacitance change rate: NPO: C/C2% or 1pF (larger reading). X7R/X7T/X7P: C/C10%. DF 2 times initial standard. IR: NPO: IR2500M or IR*Cr25S (Lower reading). X7R/X7T/X7P: IR1000M or IR*Cr25S (Lower reading). | Temperature 402, Humidity 90~95%RH, time 50024 hours. Test it after place 242 hours normal temp & humidity. | |
| 13 | High temperature exposure | Visual: No visual damage. Electrostatic capacitance change rate: NPO: C/C2% or 1pF (larger reading). X7R/X7T/X7P: C/C20%. DF 2 X initial standard. IR: NPO: IR4000M or IR*Cr40S (Lower reading). X7R/X7T/X7P: IR2000M or IR*Cr50S (Lower reading). | Temperature 1253, Time 100048 hours. Voltage: 100VV250V 2x Rated voltage, 250VV1KV 1.5x rated voltage, 1KVV 1.2x rated voltage. Test it after place 48 hours under normal pressure & temperature. | |
| 14 | PCB flexural strength | No crack and other defect | Soldering the MLCC on the PCB, Then pressing direction base on the photo. | |
| 6. EMBOSSED PLASTIC TAPING | ||||
| Embossed tape reel packing for 0805(2012)~1812(4532) type | Dimensions (see table on page 8) | |||
| 7. Paper Tape Reel Packing | ||||
| Paper tape reel packing for 10050402~12063216 | Dimensions (see table on page 9) | |||
| 8. Taping Specification | ||||
| Top tape peeling strength | 0.1N < peeling strength < 0.7N | Standard: No paper dirty remains on the scotch when peeling, and sticks to top and bottom tape. | ||
| 9. Packing Quantity | ||||
| Paper T/R (Pcs) | Plastic T/R (Pcs) | Size | ||
| 4000 | - | 0603 | ||
| 4000 | 3000 (T1.35mm) | 0805 | ||
| - | 3000 (T>1.35mm) | 1206 | ||
| - | 2000 (T1.60mm) | 1210 | ||
| - | 3000 (T>1.60mm) | 1808 | ||
| - | 2000 | 1812 | ||
| - | 1000 (T1.85mm) | 1812 above | ||
| - | 1000 (T>1.85mm) | 1812 above | ||
| - | 800 | 1812 above | ||
| - | 500 | 1812 above | ||
| 10. Precautions For Use | ||||
| 1 | Soldering Profile | To avoid crack problem by sudden temperature change, follow the temperature profile in the adjacent graph. | ||
| 2 | Manual Soldering | Careful handling required to avoid thermal cracks. Pay attention to soldering iron tip selection and temperature contact. | ||
| 11. Recommended Soldering Method | ||||
| Size | Temperature Characteristics | Rated Voltage | Capacitance | Soldering Method |
| 1005 | NPO | / | / | R |
| X7R/X5R/X7S/X6S | / | / | R | |
| 0201 | NPO | / | / | R |
| X7R/X5R/X7S/X6S | / | / | R | |
| Y5V | / | / | R | |
| 0402 | NPO | / | / | R |
| X7R/X5R/X7S/X6S | / | / | R | |
| Y5V | / | / | R | |
| 0603 | NPO | / | / | R/W |
| X7R/X5R/X7S/X6S | / | C1uf | R | |
| C1uf | R/W | |||
| Y5V | / | C1uf | R | |
| C1uf | R/W | |||
| 0805 | NPO | / | / | R/W |
| X7R/X5R/X7S/X6S | / | C4.7uf | R | |
| C4.7uf | R/W | |||
| Y5V | / | C1uf | R | |
| C1uf | R/W | |||
| 1206 | NPO | / | / | R/W |
| X7R/X5R/X7S/X6S | / | C10uf | R | |
| C10uf | R/W | |||
| Y5V | / | C10uf | R | |
| C10uf | R/W | |||
| 1210 | NPO | / | / | R |
| X7R/X5R/X7S/X6S | / | / | R | |
| Y5V | / | / | R | |
| Soldering method: RReflow Soldering, WWave Soldering | ||||
| 12. The temperature profile for soldering | ||||
| While in preheating, please keep the temperature difference between soldering temperature and surface temperature of chips as: T150. | ||||
2509251626_AIDE-CAPACITOR-1206X7R822K102NT_C48579728.pdf
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