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Specifications
Voltage Rating:
8kV
Capacitance:
220pF
Temperature Coefficient:
X7R
Tolerance:
±20%
Mfr. Part #:
2211X7R221M802NT
Model Number:
2211X7R221M802NT
Package:
2211
Key Attributes
Product Description
Product Overview
These Multi-Layer Ceramic Capacitors (MLCCs) are designed for high-voltage applications, including coupling, wave filtering, and resonant functions. They are suitable for use in switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamp ballasts. Available in various sizes and temperature characteristics, these MLCCs offer reliable performance in demanding electrical environments.
Product Attributes
- Terminal Composition: Au/Ag-Ni-Sn (from inside out)
- ROHS/REACH Compliance: Meets RoHS and REACH standards.
Technical Specifications
| Item | Description | Specification/Requirement | Testing Method |
|---|---|---|---|
| Application Field | Coupling, wave filtering, resonant in high voltage circuits, switch power supplier, AC-DC power charger, DC-DC power charger, networking/Communication interface, LCD backlight unit power supplier, amperite of energy saving lamps, etc. (Medium and High voltage MLCC). | ||
| Testing Conditions: - Normal Condition: Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa - Relative Condition: Temperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa | |||
| Part Number Description | Example: 1812 X7R 684 M 251 N T Dimension Code Temperature characteristic (C0G, X7R, X5R) Nominal electrostatic capacity Tolerance of electrostatic capacity Rated voltage (DC) Terminal composition Packing (T: Tape/Reel, P: Bag packing) | ||
| Construction | 1. Ceramic dielectric | N/A | N/A |
| 2. Inner electrode | N/A | N/A | |
| Dimension (mm) | Part number | L W T WB | British system / Metric system |
| 0201 (0603) | 0.600.10 0.300.05 0.300.05 0.100.05 | N/A | |
| 0402 (1005) | 1.000.15 0.500.15 0.500.10 0.200.10 | N/A | |
| ... (other dimensions listed in original text) ... | ... | ... | ... |
| Temperature Characteristic | C0G | 0 30 PPM/ | N/A |
| X7R | 15% | N/A | |
| X5R | 15% | N/A | |
| Nominal Electrostatic Capacity | Example | 8R08.0, 10010, 101100 (pF) | N/A |
| Tolerance of Electrostatic Capacity | B: 0.1pF, C: 0.25pF, D: 0.5pF, F: 1%, G: 2%, J: 5%, K: 10%, M: 20%, Z: +80%/-20% | ||
| Rated Voltage (DC) | Example | 25025, 251250, 2522500 (V) | N/A |
| Temperature Range | N/A | -55~+125 | N/A |
| Dissipation Factor (DF) | See original text for detailed specifications based on characteristic and capacitance. | ||
| Insulation Resistance (IR) | See original text for detailed specifications based on characteristic and capacitance. | ||
| Hi-pot (DC) | See original text for detailed specifications based on rated voltage. | ||
| Solderability | Soldering area 90% | N/A | Pre-heating: 80-120 (10-30s), Solder: 2455 (20.5s) |
| Resistance to the heat of soldering | Visual-No damage, soldering area 90% | N/A | Pre-heating: 100-200 (102s), Solder: 2655 (51s) |
| Flexural Strength | No damage | Electrostatic capacity change rate: 10% | Base board: Al2O3 /PCB, Flexural depth: 1mm, Bend speed: 0.5mm/sec |
| Terminal Bonding Strength | No visual damage | Applied Force: 5N (101S) | N/A |
| Thermal Shock | See original text for detailed specifications based on characteristic. | ||
| Temperature Moisture Exposure | See original text for detailed specifications based on characteristic. | ||
| High Temperature Exposure | See original text for detailed specifications based on characteristic. | ||
| PCB Flexural Strength | No crack and other defect. IR measurement after soldering. | ||
| Embossed Plastic Taping Dimensions | See original text for detailed dimensions (0805 to 1812 types). | ||
| Paper Tape Reel Packing Dimensions | See original text for detailed dimensions (1005, 0201, 0402, 0603, 0805, 1206 types). | ||
| Reel Dimensions | 7REEL: 1782.0mm, 13REEL: 3302.0mm | ||
| Top Tape Peeling Strength | Paper Taping: 0.1N < peeling strength < 0.7N | Embossed Taping: Standard | N/A |
| Packing Quantity | See original text for quantities per size and packing type (Paper T/R, Plastic T/R). | ||
Precautions for Use
MLCCs may fail in short or open circuit modes under severe electrical or mechanical stress beyond specified ratings. To prevent failure modes such as burn out, flaming, or glowing, adhere to the following precautions:
- Soldering Profile: Follow the recommended temperature profile to avoid cracks due to sudden temperature changes.
- Manual Soldering: Exercise caution to prevent thermal cracks. Ensure proper soldering iron tip selection and temperature control.
- Optimum Solder Amount for Reflow Soldering: Refer to recommended soldering amounts.
- Recommended Soldering Method: Refer to the table for recommended methods (R-Reflow, W-Wave) based on size, characteristics, voltage, and capacitance.
- Soldering Temperature Profile: Maintain a temperature difference of T150 between soldering temperature and chip surface temperature during preheating.
2509251626_AIDE-CAPACITOR-2211X7R221M802NT_C48579740.pdf
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