quality High Voltage Multi Layer Ceramic Capacitor AIDE CAPACITOR 0603C0G111J500NT for Switch Power Supplies factory

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Specifications

Voltage Rating:

50V

Capacitance:

110pF

Temperature Coefficient:

C0G

Tolerance:

±5%

Mfr. Part #:

0603C0G111J500NT

Model Number:

0603C0G111J500NT

Package:

0603

Key Attributes

Product Description

Product Overview

This product is a high-performance Multi-Layer Ceramic Capacitor (MLCC) designed for applications in high-voltage circuits. It is suitable for coupling, wave filtering, and resonant functions within switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamps. The MLCCs are available in various sizes and temperature characteristics, including C0G, X7R, and X5R, with a wide range of capacitance and voltage ratings.

Product Attributes

Terminal Composition: Au/Ag-Ni-Sn (From the inside out)
RoHS/REACH Compliance: Meets RoHS and REACH standards.

Technical Specifications

Part Number Description Example: 1812 X7R 684 M 251 N T

Dimension Codes (L*W):

Inch: 0.02*0.01 (0201), 0.04*0.02 (0402), 0.06*0.03 (0603), 0.08*0.05 (0805), 0.12*0.06 (1206), 0.12*0.10 (1210), 0.18*0.08 (1808), 0.18*0.12 (1812), 0.18*0.25 (1825), 0.22*0.11 (2211), 0.22*0.25 (2225)
MM: 0.50*0.25 (0201), 1.00*0.50 (0402), 1.60*0.80 (0603), 2.00*1.25 (0805), 3.20*1.60 (1206), 3.20*2.50 (1210), 4.50*2.00 (1808), 4.50*3.20 (1812), 4.50*6.30 (1825), 5.70*2.8 (2211), 5.70*6.30 (2225)

Temperature Characteristics: C0G (030 PPM/), X7R (15%), X5R (15%)

Nominal Electrostatic Capacity: 8R08.0, 10010, 101100 (pF)

Tolerance of Electrostatic Capacity: B:0.1pF, C:0.25pF, D:0.5pF, F:1%, G: 2%, J:5%, K:10%, M:20%, Z:+80%/-20%

Rated Voltage (DC): 25025V, 251250V, 2522500V

Packing: T (Tape/Reel), P (Bag packing)

Construction:

Ceramic dielectric
Inner electrode
Outer electrode
Nickle layer
Tin layer

Dimensions (mm):

Part Number	Dimension (mm)	British system	Metric system	L	W	T
0201	0603	0.600.10	0.300.05	0.300.05	0.100.05
0402	1005	1.000.15	0.500.15	0.500.10	0.200.10
0603	1608	1.600.20	0.800.15	0.800.15	0.300.10	0.600.10
0805	2012	2.000.20	1.250.20	0.800.20	1.000.20	0.500.20
				1.250.20	0.800.20
1206	3216	3.200.30	1.600.30	1.000.20	1.250.20	0.600.30
				1.600.30
1210	3225	3.200.30	2.500.30	2.70	0.800.30
1808	4520	4.500.40	2.000.20	2.70	0.800.30
1812	4532	4.500.40	3.200.30	3.50	0.800.30
1825	4563	4.500.40	6.300.50	3.50	0.800.30
2220	5750	5.700.50	5.000.50	3.50	1.000.40
2225	5763	5.700.50	6.300.50	6.20	1.000.40

Specification and Testing Method:

No	Item	Specification/Requirement	Testing method
1	Temperature	-55~+125
2	Visual/ Dimension	1,No Damage 2,Dimension meet Spec	Naked eye (Visual inspection), Digital calliper
3	Static capacity	Meet standard specification and tolerance	NPO characteristic: Capacity Frequency Voltage 1000pF 1MHz10% 1.00.2Vrms; 1000pF 1KHz10% 1.00.2Vrms X7R/X7T/X7P characteristic: Capacity Frequency Voltage 10uF 1KHz10% 1.00.2Vrms; 10uF 120Hz24 0.50.1Vrms
4	Dissipation factor (DF)	NPO Characteristic: DF0.56, Cr5pF; DF1.5[(150/Cr)+7]10-4 (5pFCr50pF); DF0.15%, (50pFCr) Cr1000pF, Testing frequency 110%MHz, Testing voltage 1V0.2rms. Cr1000pF, Testing frequency 110%KHz, Testing voltage 1V0.2rms. X7R/X7T/X7P characteristic: see Note 1 Cr10uF, Test frequency 110%KHz,Voltage 1V0.1rms. Cr10uF, Frequency 12024Hz, Voltage 0.5V0.1rms.
5	IR Insulation Resistance	NPO Characteristic: IR50000M,C10nF; IRCr500S,C10nF Testing condition: Rated voltage, Time:605s, Humidity:75%, Temperature:255, Current :50mA X7R/X7T/X7P Characteristic: IR10000M,C25nF; IRCr100S,C25nF
6	Hi-potDC	No dielectric breakdown or damage Ur=100V,...............2.5 x rated voltage Ur=200V/250V,.... 2.0 x rated voltage Ur=450/500/630V,1.5 x rated voltage 1KVUr2KV,.......1.2 x rated voltage 2KVUr,...............1.1 x rated voltage Voltage Raising time:110S, Voltage maintaining time2S
7	Solderability	soldering area90% Visual-No damage	Pre-heating temperature 80-120,time10-30s, lead free solder, flux; Soldering temperature 2455; Solder time 20.5s
8	Resistance to the heat of soldering	Visual Visual-No damage, soldering area90%	Pre-heating temperature 100-200,time102 s, soldering temperature :2655, Soldering time:51s. Cleaning with solvent. Room temperature , time :242 hours.
9	Flexural strength	No damage	Base boardAl2O3 /PCB; PCB dimension Thickness: 1.6mm, Length: 100mm, Width: 40mm; Flexural depth: 1mm; Bend speed: 0.5mm/sec. Test it under the flexural status.
10	Terminal bonding strength	No visual damage	Applied Force: 5N, Duration: 101S
11	Thermal shock	NPO Characteristic; C/C2.5% or 0.25pF ( larger reading) X7R/X7P- characteristic: C/C0.5% X7T characteristicC/C10% Pre-condition(X7R h characteristic):Upper limit temperature 1hour, place 241 hours,start to testing. Run 5 cycles Thermal shock. Test it after place 242 hours normal temp & humidity
12	Temperature moisture exposure	Visual No visual damage Test it after place 242 hours normal temp & humidity Temperature 402, Humidity 90~95%RH, time 500+24 hours Electrost atic capacitance change rate: NPO characteristic: C/C2% or 1pF (larger reading); X7R/X7T/X7P characteristic: C/C10% DF 2 times initial standard IR NPO characteristic: IR2500M or IRCr25S (Lower reading); X7R/X7T/X7P : IR1000M or IRCr25S (Lower reading)
13	High temperature exposure	Visual No visual damage Charging and discharging current 50mA Max. Test it after place 48 hours under normal pressure & temperature Temperature 1253, Time 100048 hours Voltage: 100VV250V 2x Rated voltage; 250VV1KV 1.5x rated voltage; 1KVV 1.2x rated voltage Electrost atic capacitance change rate: NPO : C/C2% or 1pF (larger reading); X7R/X7T/X7P: C/C20% DF 2 X initial standard IR NPO : IR4000M or IRCr40S (Lower reading); X7R/X7T/X7P : IR2000M or IRCr50S (Lower reading)	Step Temperature time Lower limit temperature 303 m Normal temp & humidity 2~3 m Upper limit temperature 303 m Normal temp & humidity 2~3 m
14	PCB flexural strength	No crack and other defect	IR Soldering the MLCC on the PCB (Photo1), Then pressing direction base on the photo 2. SIZE A B C 0805(2012) 1.2 4 1.65; 1206(3216) 2.2 5 2; 1210(3225) 2.2 5 2.9; 1812(4532) 3.5 7 3.7; 2220(5750) 4.5 8 5.6

Embossed Plastic Taping:

Code	Tape size	A	B	C	D	E	F	G	H	J
0805	1.55 0.20	2.35 0.20	8.00 0.20	3.50 0.05	1.75 0.10	4.00 0.10	2.00 0.10	4.00 0.10	1.50 -0/+0.10	1.50 Max
1206	1.95 0.20	3.60 0.20	8.00 0.20	3.50 0.05	1.75 0.10	4.00 0.10	2.00 0.10	4.00 0.1	1.50 -0/+0.10	1.85 Max
1210	2.70 0.10	3.42 0.10	8.00 0.10	3.50 0.05	1.75 0.10	4.00 0.10	2.00 0.05	4.00 0.10	1.55 -0/+0.10	3.2 Max
1808	2.20 0.10	4.95 0.10	12.00 0.10	5.50 0.05	1.75 0.10	4.00 0.10	2.00 0.05	4.00 0.10	1.50 -0/+0.10	3.0 Max
1812	3.66 0.10	4.95 0.10	12.00 0.10	5.50 0.05	1.75 0.10	8.00 0.10	2.00 0.05	4.00 0.10	1.55 -0/+0.10	4.0 Max

Paper Tape Reel Packing:

Code	Paper size	W1	L1	D	C	B	P1	P2	P0	d
1005	0.240.02	0.450.02	8.000.10	3.500.05	1.750.10	2.000.05	2.000.05	4.000.10	1.50 -0/+0.10	0.30 Below
0201	0.370.10	0.670.10	8.000.10	3.500.05	1.750.10	2.000.05	2.000.05	4.000.10	1.50 -0/+0.10	0.80 Below
0402	0.650.10	1.150.10	8.000.10	3.500.05	1.750.10	2.000.05	2.000.05	4.000.10	1.50 -0/+0.10	0.80 Below

Code	Paper size	A	B	C	D	E	F	G	H	J
0603	1.10 0.10	1.90 0.10	8.00 0.10	3.50 0.05	1.75 0.10	4.00 0.10	2.00 0.10	4.00 0.10	1.50 -0/+0.10	1.10 Max
0805	1.45 0.15	2.30 0.15	8.0 0.15	3.50 0.05	1.75 0.10	4.00 0.10	2.00 0.10	4.00 0.10	1.50 -0/+0.10	1.10 Max
1206	1.80 0.20	3.40 0.20	8.00 0.20	3.50 0.05	1.75 0.10	4.00 0.10	2.00 0.10	4.00 0.10	1.50 -0/+0.10	1.10 Max

Reel Dimensions (unit: mm):

Unit:mm	A	B	C	D	E	F	G
7REEL	1782.0	3.0	130.5	210.5	21 or Bigger	1010.5	12max
13REEL	3302.0	3.0	130.5	210.5	21 or Bigger	1010.5	12max

Taping Specification:

Top tape peeling strength: 0.1N < peeling strength < 0.7N. No paper dirty remains on the scotch when peeling, and sticks to top and bottom tape.

Packing Quantity:

Dimension	Paper T/R (Pcs)	Plastic T/R (Pcs)
0603	4000
0805	4000	3000 (T1.35mm), 3000 (T1.35mm)
1206		2000 (T1.60mm), 3000 (T1.60mm)
1210		2000
1808		1000 (T1.85mm)
1812		1000 (T1.85mm)
1812	800	500

Precautions For Use:

Soldering Profile: Follow the temperature profile to avoid cracks due to sudden temperature changes.
Manual Soldering: Handle soldering iron carefully to avoid thermal cracks. Pay attention to tip selection and temperature.
Optimum Solder Amount for Reflow Soldering
Recommended Soldering amounts

Recommended Soldering Method:

Size	Temperature Characteristics	Rated Voltage	Capacitance	Soldering Method
1005	NPO	/	/	R
	X7R/X5R/X7S/X6S	/	/	R
0201	NPO	/	/	R
	X7R/X5R/X7S/X6S	/	/	R
	Y5V	/	/	R
0402	NPO	/	/	R
	X7R/X5R/X7S/X6S	/	/	R
	Y5V	/	/	R
0603	NPO	/	/	R/W
	X7R/X5R/X7S/X6S	/	C1uf	R
			C1uf	R/W
	Y5V	/	C1uf	R
			C1uf	R/W
0805	NPO	/	/	R/W
	X7R/X5R/X7S/X6S	/	C4.7uf	R
			C4.7uf	R/W
	Y5V	/	C1uf	R
			C1uf	R/W
1206	NPO	/	/	R/W
	X7R/X5R/X7S/X6S	/	C10uf	R
			C10uf	R/W
	Y5V	/	C10uf	R
			C10uf	R/W
1210	NPO	/	/	R
	X7R/X5R/X7S/X6S	/	/	R
	Y5V	/	/	R

Soldering methodRReflow Soldering, WWave Soldering

Soldering Temperature Profile:

During preheating, keep the temperature difference between soldering temperature and surface temperature of chips as T150.

2509251626_AIDE-CAPACITOR-0603C0G111J500NT_C49326292.pdf

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